Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | Maximum Output Current | Trim or Adjustable Output (V) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Main Out Ripple Voltage | Control Technique | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Switcher Config | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Output Voltage | Control Mode | Protection(s) | Maximum Total Power Output | Minimum Operating Temperature | Terminal Finish | Maximum Output Voltage | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width (mm) | Qualification | Normal Position (V) | Minimum Supply Voltage (Vsup) | Nominal Input Voltage | Additional Features | Minimum Input Voltage | Maximum Negative Input Voltage | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Length | Adjustable Threshold | Nominal Output Voltage | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
36 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
5 |
BICMOS |
BALL |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B36 |
1 |
.69 mm |
2.437 mm |
e2 |
30 |
260 |
2.688 mm |
YES |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
1 |
5.5 V |
.625 mm |
1 mm |
Not Qualified |
1.8 V |
e1 |
30 |
260 |
1.5 mm |
YES |
||||||||||||||||||||||||||||||||||
|
Onsemi |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
4 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
5 V |
.51 mm |
1.48 mm |
2.5 V |
e1 |
30 |
260 |
1.91 mm |
NO |
||||||||||||||||||||||||||||||||||
|
Onsemi |
POWER SUPPLY SUPPORT CIRCUIT |
4 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA4,2X2,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B4 |
5.5 V |
.655 mm |
.76 mm |
1.2 V |
.76 mm |
NO |
||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
25 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
.21 mA |
1 |
1 |
GULL WING |
5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA25,5X5,16 |
.4 mm |
105 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B25 |
3 |
6 V |
.544 mm |
2.593 mm |
3.3 V |
260 |
+.2,.66,1.23,2.6V |
2.593 mm |
NO |
|||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.1 mA |
1 |
1 |
BALL |
3.6 V |
2.7/4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,16 |
Power Management Circuits |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B10 |
4.5 V |
.705 mm |
1.37 mm |
Not Qualified |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
2.01 mm |
NO |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
8 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,16 |
.4 mm |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B8 |
1 |
5.5 V |
.35 mm |
.745 mm |
1.7 V |
e1 |
260 |
0.95 |
1.508 mm |
YES |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
8 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,16 |
.4 mm |
125 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.35 mm |
1.7 V |
YES |
||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.005 mA |
1 |
1 |
BALL |
1.8 V |
GRID ARRAY |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B6 |
1 |
5.5 V |
.5 mm |
.9 mm |
Not Qualified |
1.62 V |
e1 |
NOT SPECIFIED |
260 |
1.4 mm |
NO |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
16 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.675 mA |
1 |
4 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B16 |
5.5 V |
.679 mm |
2.17 mm |
2.7 V |
e1 |
30 |
260 |
2.225 mm |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,16 |
.4 mm |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
1 |
5.5 V |
.4 mm |
.706 mm |
1.8 V |
e1 |
30 |
260 |
0.044 |
1.106 mm |
YES |
|||||||||||||||||||||||||||||||||
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
8 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,16 |
.4 mm |
125 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.35 mm |
1.7 V |
YES |
||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.1 mA |
1 |
1 |
BALL |
3.6 V |
2.7/4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,16 |
Power Management Circuits |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B10 |
4.5 V |
.705 mm |
1.37 mm |
Not Qualified |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
2.01 mm |
NO |
|||||||||||||||||||||||||||||||||
|
Onsemi |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
9 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
3.6 V |
2.5/4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
Power Management Circuits |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B9 |
1 |
4.5 V |
.51 mm |
1.6 mm |
Not Qualified |
2.5 V |
e1 |
30 |
260 |
1.76 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
9 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.03 mA |
1 |
1 |
BALL |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,16 |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B9 |
1 |
4.9 V |
.69 mm |
1.448 mm |
2.3 V |
e2 |
30 |
260 |
1.468 mm |
NO |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
20 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
BALL |
12 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B20 |
1 |
22 V |
.5 mm |
1.518 mm |
2.8 V |
e1 |
30 |
260 |
1.918 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Onsemi |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
9 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B9 |
1 |
5.5 V |
.526 mm |
1.215 mm |
2.7 V |
e1 |
30 |
260 |
1.26 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
5.5 V |
.625 mm |
1.388 mm |
2.7 V |
e1 |
30 |
260 |
1.6445 mm |
NO |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
30 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
3 mA |
1 |
1 |
BALL |
5 V |
BUCK |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B30 |
1 |
13.5 V |
.625 mm |
1.9615 mm |
3.9 V |
e1 |
30 |
260 |
+0.265V |
2.362 mm |
YES |
||||||||||||||||||||||||||||||||
|
Onsemi |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
9 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B9 |
1 |
5.5 V |
.619 mm |
1.215 mm |
3 V |
e1 |
30 |
260 |
1.26 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
25 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BICMOS |
BALL |
3.7 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
S-PBGA-B25 |
1 |
5.5 V |
.69 mm |
2.308 mm |
2.7 V |
e2 |
30 |
260 |
2.308 mm |
YES |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
OTHER |
28 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
10 mA |
BALL |
4/10 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA28,4X7,16 |
Power Management Circuits |
.4 mm |
125 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B28 |
1 |
10 V |
.5 mm |
Not Qualified |
4 V |
e1 |
30 |
260 |
+15V |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B12 |
1 |
5.5 V |
.4 mm |
1.388 mm |
2.7 V |
e1 |
30 |
260 |
1.645 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
OTHER |
28 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
10 mA |
BALL |
4/10 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA28,4X7,16 |
Power Management Circuits |
.4 mm |
125 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B28 |
1 |
10 V |
.4 mm |
Not Qualified |
4 V |
e1 |
30 |
260 |
+15V |
|||||||||||||||||||||||||||||||||||
|
Microchip Technology |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
16 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
4 |
TS 16949 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B16 |
5.5 V |
.679 mm |
2.17 mm |
2.7 V |
30 |
260 |
2.225 mm |
YES |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
70 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
9 |
BALL |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B70 |
1 |
5.5 V |
.69 mm |
3.167 mm |
2.6 V |
e2 |
30 |
260 |
4.118 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
72 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BICMOS |
BALL |
3.7 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B72 |
1 |
5 V |
.69 mm |
3.608 mm |
2.8 V |
e2 |
30 |
260 |
3.867 mm |
YES |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
56 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
5 V |
BUCK-BOOST |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA56,7X8,16 |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B56 |
1 |
24 V |
.5 mm |
2.8575 mm |
3.6 V |
e1 |
30 |
260 |
+3.4V |
3.227 mm |
YES |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
20 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
BALL |
12 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B20 |
1 |
22 V |
.5 mm |
1.518 mm |
2.8 V |
e1 |
30 |
260 |
1.918 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
1 |
3.6 V |
.5 mm |
.888 mm |
.75 V |
e1 |
30 |
260 |
1.388 mm |
NO |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
30 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
11 |
BALL |
5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA30,5X6,20 |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B30 |
1 |
28 V |
.69 mm |
2.618 mm |
3.6 V |
IT ALSO HAS 2.4 TO 20V SUPPLY VOLTAGE |
e2 |
30 |
260 |
3.068 mm |
YES |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
9 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B9 |
4.5 V |
.705 mm |
1.46 mm |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.564 mm |
YES |
||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.06 mA |
1 |
1 |
BICMOS |
BALL |
12 V |
2.7/28 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Power Management Circuits |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B6 |
1 |
28 V |
.67 mm |
1 mm |
Not Qualified |
2.7 V |
e0 |
1.52 mm |
NO |
||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.06 mA |
1 |
1 |
BICMOS |
BALL |
12 V |
2.7/28 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Power Management Circuits |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
1 |
28 V |
.67 mm |
1 mm |
Not Qualified |
2.7 V |
e1 |
30 |
260 |
1.52 mm |
NO |
|||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B12 |
1 |
5.5 V |
.4 mm |
1.388 mm |
2.7 V |
e1 |
30 |
260 |
1.645 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
42 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
BALL |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA42,6X7,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B42 |
1 |
20 V |
.565 mm |
2.51 mm |
2.8 V |
30 |
260 |
2.91 mm |
NO |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY SUPPORT CIRCUIT |
9 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.03 mA |
1 |
1 |
BALL |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,16 |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-XBGA-B9 |
1 |
4.9 V |
.69 mm |
1.448 mm |
2.3 V |
e2 |
30 |
260 |
1.468 mm |
NO |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
25 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
4 |
BALL |
5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B25 |
1 |
5.5 V |
.5 mm |
2.468 mm |
3.4 V |
e1 |
30 |
260 |
2.53 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
5.5 V |
.625 mm |
1.388 mm |
2.7 V |
e1 |
30 |
260 |
1.6445 mm |
NO |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B12 |
1 |
5.5 V |
.4 mm |
1.388 mm |
2.7 V |
e1 |
30 |
260 |
1.645 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
OTHER |
9 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.6 V |
2.5/4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,16 |
Power Management Circuits |
.4 mm |
70 Cel |
-20 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B9 |
1 |
4.5 V |
.69 mm |
1.415 mm |
Not Qualified |
2.5 V |
e2 |
30 |
260 |
1.595 mm |
NO |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
15 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B15 |
1 |
4.5 V |
.625 mm |
1.956 mm |
2.8 V |
e1 |
30 |
260 |
2.61 mm |
NO |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
OTHER |
20 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
BALL |
5 V |
BUCK |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-30 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B20 |
1 |
6 V |
.625 mm |
2 mm |
4 V |
RECHARGE THRESHOLD VOLTAGE IS 0.12V |
e1 |
30 |
260 |
+0.12V |
2.142 mm |
YES |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
9 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B9 |
1 |
4.5 V |
.625 mm |
1.58 mm |
2.45 V |
e1 |
30 |
260 |
1.62 mm |
NO |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
32 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
2 mA |
1 |
2 |
BALL |
5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA32,6X6,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B32 |
6.8 V |
.56 mm |
2.56 mm |
4.1 V |
NOT SPECIFIED |
NOT SPECIFIED |
2.56 mm |
YES |
||||||||||||||||||||||||||||||||||||
|
Onsemi |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B6 |
1 |
5.5 V |
.625 mm |
.98 mm |
1.8 V |
e1 |
NOT SPECIFIED |
NOT SPECIFIED |
1.48 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
30 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
11 |
BALL |
5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA30,5X6,20 |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B30 |
1 |
28 V |
.69 mm |
2.618 mm |
3.6 V |
IT ALSO HAS 2.4 TO 20V SUPPLY VOLTAGE |
e2 |
30 |
260 |
3.068 mm |
YES |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
POWER SUPPLY SUPPORT CIRCUIT |
40 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
6 |
BALL |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA40,5X8,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B40 |
.567 mm |
2.126 mm |
+0.9, +2.1V |
3.327 mm |
YES |
Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.
PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.
PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.
One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.