VFBGA Power Management ICs 2,400+

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	No. of Functions	No. of Channels	Technology	Terminal Form	Nominal Supply Voltage (Vsup)	Power Supplies (V)	Switcher Config	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold
BQ24250YFFT	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	UNSPECIFIED	5 mA				BALL		4.5/10	BUCK	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B30	1	10.5 V	.625 mm	2.59 mm	Not Qualified	4.35 V		e1	30	260	+3.35V	2.2 mm
BQ25155YFPR	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	20	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B20	1	5.5 V	.5 mm	1.615 mm		3.4 V		e1	30	260		2.015 mm	YES
FPF1504UCX	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	4	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1	CMOS	BALL	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,16		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	3.6 V	.625 mm	.96 mm		1 V		e1	30	260		.96 mm	NO
ISL28025FI12Z-T	Renesas Electronics	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	16	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1		BALL	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	5.5 V	.66 mm	2.16 mm		3 V		e1	30	260		2.16 mm	NO
MAX16154DBAD+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		6	VFBGA	RECTANGULAR	YES	UNSPECIFIED	.0009 mA	1	1		BALL				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,16		.4 mm	125 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-XBGA-B6	1	5.5 V	.69 mm	.828 mm		1.2 V		e2	30	260	+1.5V	1.238 mm	YES
LC709203FXE-03MH	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	CMOS	BALL	3.6 V	2.5/4.5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B9	1	4.5 V	.51 mm	1.6 mm	Not Qualified	2.5 V		e1	30	260		1.76 mm
BQ27220YZFR	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1	1		BALL	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-XBGA-B9	1	4.5 V	.625 mm	1.58 mm		2.45 V		e1	30	260		1.6205 mm	NO
BQ27421YZFR-G1A	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.6 V	3.6		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B9	1	4.5 V	.625 mm	1.58 mm	Not Qualified	2.45 V		e1	30	260		1.62 mm	NO
NX5P3290UKZ	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	16	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1		BALL	5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B16	1	5.5 V	.595 mm	2.05 mm		4 V				260		2.05 mm	YES
BQ25101YFPR	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT			VFBGA	RECTANGULAR	YES	UNSPECIFIED					BALL				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B6	1	6.45 V	.5 mm	1.4 mm		4.45 V		e1	30	260		1 mm
BQ27546YZFT-G1	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	15	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B15	1	4.5 V	.625 mm	1.956 mm		2.8 V		e1	30	260		2.61 mm	NO
MAX4372HEBT-T	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	6	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.06 mA	1	1	BICMOS	BALL	12 V	2.7/28		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B6	1	28 V	.67 mm	1 mm	Not Qualified	2.7 V		e0				1.52 mm	NO
MAX4372HEBT+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	6	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.06 mA	1	1	BICMOS	BALL	12 V	2.7/28		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	28 V	.67 mm	1 mm	Not Qualified	2.7 V		e1	30	260		1.52 mm	NO
MAX77654MENV+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	8		BALL	3.7 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.5 mm	2.338 mm		2.7 V		e2	30	260	2.85	2.788 mm	YES
STBC02JR	STMicroelectronics	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	2		BALL	5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B30		5.4 V	.6 mm	2.25 mm		4.55 V	OTHER SUPPLY VOLTAGE= 4.75 V TO 5.4 V		NOT SPECIFIED	NOT SPECIFIED		2.59 mm	YES
BQ25100AYFPT	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT			VFBGA	RECTANGULAR	YES	UNSPECIFIED					BALL				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B6	1	6.45 V	.5 mm	1.4 mm		4.45 V		e1	30	260		1 mm
BQ25100YFPT	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT			VFBGA	RECTANGULAR	YES	UNSPECIFIED					BALL				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B6	1	6.45 V	.5 mm	1.4 mm		4.45 V		e1	30	260		1 mm
FAN54120UC420X	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	OTHER	6	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,16		.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B6		6 V	.622 mm	.76 mm		4 V			NOT SPECIFIED	NOT SPECIFIED	+4.2V	1.36 mm	NO
STBC02AJR	STMicroelectronics	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	2		BALL	5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B30		5.4 V	.6 mm	2.25 mm		4.55 V	OTHER SUPPLY VOLTAGE= 4.75 V TO 5.4 V		NOT SPECIFIED	NOT SPECIFIED		2.59 mm	YES
STBC15LJTR	STMicroelectronics	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	12	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.044 mA	1	1		BALL	5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,12		.3 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B12		6.5 V	.335 mm	1.11 mm		3.3 V			NOT SPECIFIED	NOT SPECIFIED	+3.5V	1.41 mm	YES
TPS22924DYZPT	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	6	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.35 mA	1	1		BALL	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B6	1	3.6 V	.5 mm	.888 mm		.75 V		e1	NOT SPECIFIED	260		1.388 mm	NO
FFG1040UC003X	Onsemi	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	12	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	4.5 V	.625 mm	1.51 mm		2.5 V		e1	30	260		1.96 mm	YES
MAX34417ENE+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	16	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	4		BALL				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	S-PBGA-B16	1	3.6 V	.5 mm	2.007 mm		2.7 V		e2	30	260		2.007 mm	NO
PTLV841SADL01YBHR	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	4	VFBGA	SQUARE	YES	PLASTIC/EPOXY	.0012 mA	1	1		BALL	.9 V			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA4,2X2,16		.4 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B4		6 V	.4 mm	.73 mm		.85 V					+0.505V	.73 mm	YES
TLV841SADL41YBHR	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT		4	VFBGA	SQUARE	YES	PLASTIC/EPOXY	.001 mA	1	1		BALL	1 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,16		.4 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	6 V	.4 mm	.731 mm		.7 V		e1		260	+0.505V	.731 mm	YES
BQ27426YZFT	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B9	1	4.5 V	.625 mm	1.58 mm		2.45 V		e1	30	260		1.62 mm	NO
FFG3105UCX	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	6	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	4.5 V	.625 mm	.96 mm		2.5 V	ALSO HAS 5.5V TO 6V DEVICE PROGRAMMING VOLTAGE	e1	30	260		1.66 mm	YES
MAX17048X+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	OTHER	8	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.04 mA	1	1		BALL		2.5/4.5		GRID ARRAY, FINE PITCH	BGA8,2X4,16	Power Management Circuits	.4 mm	70 Cel	-20 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B8	1	4.5 V	.69 mm	.835 mm	Not Qualified	2.5 V	RESET THRESHOLD VOLTAGE IS 3 VOLT	e2	30	260	+3V	1.625 mm	YES
MAX17055EWL+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B9	1	4.9 V	.69 mm	1.407 mm		2.3 V		e2	30	260		1.498 mm	NO
NX20P0408UK	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	12	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,16		.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B12		5.5 V	.565 mm	1.27 mm		2.5 V						1.67 mm	NO
MAX6407BS22-T	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	4	VFBGA	SQUARE	YES	PLASTIC/EPOXY	.00175 mA	1	1	BICMOS	BALL	3 V	1.2/5.5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B4	1	5.5 V	.67 mm	1.1 mm	Not Qualified	1.2 V		e0			+2.2V	1.1 mm	NO
MAX6407BS22+T	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	4	VFBGA	SQUARE	YES	PLASTIC/EPOXY	.00175 mA	1	1	BICMOS	BALL	3 V	1.2/5.5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B4	1	5.5 V	.67 mm	1.1 mm	Not Qualified	1.2 V		e3			+2.2V	1.1 mm	NO
BQ25910YFFT	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	36	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1	1		BALL	5 V		BUCK	GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B36	1	14 V	.625 mm	2.6 mm		3.9 V		e1	30	260		1.6 mm	YES
TPS22904YFPT	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	4	VFBGA	SQUARE	YES	PLASTIC/EPOXY	.001 mA	1	1		BALL	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B4	1	3.6 V	.5 mm	.77 mm	Not Qualified	1.1 V		e1	NOT SPECIFIED	260		.77 mm	NO
TPS22924CYZPR	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	6	VFBGA	RECTANGULAR	YES	UNSPECIFIED	.35 mA	1	1		BALL	1 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-XBGA-B6	1	3.6 V	.5 mm	.9 mm	Not Qualified	.75 V		e1	NOT SPECIFIED	260		1.4 mm	NO
ISL91302BIIZ-T	Renesas Electronics	POWER SUPPLY MANAGEMENT CIRCUIT		54	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.006 mA	1	1		BALL	3.7 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA54,6X9,16		.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B54		5.5 V	.55 mm	2.551 mm		2.5 V			NOT SPECIFIED	NOT SPECIFIED	2.6	3.67 mm	YES
MAX17260BEWL+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT		9	VFBGA	RECTANGULAR	YES	UNSPECIFIED	.03 mA	1	1		BALL				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-XBGA-B9	1	4.9 V	.69 mm	1.448 mm		2.3 V		e2	30	260		1.468 mm	NO
TPS22922YZPR	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	6	VFBGA	RECTANGULAR	YES	UNSPECIFIED	.00088 mA	1	1		BALL	1 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-XBGA-B6	1	3.6 V	.5 mm	.9 mm	Not Qualified	.9 V		e1	NOT SPECIFIED	260		1.4 mm	NO
MAX17260BEWL+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT		9	VFBGA	RECTANGULAR	YES	UNSPECIFIED	.03 mA	1	1		BALL				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-XBGA-B9	1	4.9 V	.69 mm	1.448 mm		2.3 V		e2	30	260		1.468 mm	NO
TUSB422IYFPR	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1	1		BALL	3.7 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B9	1	5.5 V	.5 mm	1.335 mm		2.7 V		e1	30	260		1.38 mm	NO
BQ24253YFFT	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	UNSPECIFIED	5 mA				BALL		4.5/10	BUCK	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B30	1	10.5 V	.375 mm	2.59 mm	Not Qualified	4.35 V		e1	30	260	+3.35V	2.2 mm
FAN54120UC425X	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	OTHER	6	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,16		.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B6		6 V	.622 mm	.76 mm		4 V			NOT SPECIFIED	NOT SPECIFIED	+4.25V	1.36 mm	NO
FAN54120UC435X	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	OTHER	6	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,16		.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B6		6 V	.622 mm	.76 mm		4 V			NOT SPECIFIED	NOT SPECIFIED	+4.35V	1.36 mm	NO
FUSB300CUCX	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	2		BALL	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B9	1	3.5 V	.625 mm	1.215 mm		3 V		e1	30	260		1.215 mm	YES
LP3925RMX-A/NOPB	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	81	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1		BALL	3.6 V	3.6		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA81,9X9,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B81	1	4.5 V	.725 mm	3.61 mm	Not Qualified	3 V	ALSO REQUIRE SUPPLY VOLTAGE 1V TO 4.5V		30	260		3.61 mm	YES
BQ24257YFFT	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	2000 mA	1	1		BALL	5 V	4.5/10		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B30	1	6.5 V	.625 mm	1.9875 mm	Not Qualified	4.35 V		e1	NOT SPECIFIED	260	+3.35V	2.3875 mm	YES
ISL91211AIIZ-T	Renesas Electronics	POWER SUPPLY MANAGEMENT CIRCUIT		54	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1	3		BALL	3.7 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA54,6X9,16		.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B54		5.5 V	.55 mm	2.551 mm		2.5 V			NOT SPECIFIED	NOT SPECIFIED	+2.58V	3.67 mm	YES
MAX14750AEWA+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	25	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	4	BICMOS	BALL	2.7 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B25	1	5.5 V	.69 mm	2.107 mm		1.8 V		e2	30	260		2.227 mm	YES

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.