HBGA Bus Controllers 46

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Drive Interface Standard	JESD-609 Code
PI7C9X2G1616PRBHSBE	Diodes Incorporated	BUS CONTROLLER, PCI		BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	0	GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	1 V	85 Cel	625 MBps	-40 Cel		BOTTOM	1.9 mm	19 mm	0	100 MHz			19 mm	CMOS		I2C, PCI, SMBUS	1 mm	S-PBGA-B324
PEX8724-CA80BCG	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA324,18X18,40		70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	19 mm				245	19 mm	CMOS			1 mm	S-PBGA-B324	4			e1
PEX8619-BA50BIG	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.95 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm	19 mm				260	19 mm	CMOS	1 V	I2C; PCI; SMBUS; SPI; USB	1 mm	S-PBGA-B324	3	Not Qualified	IEEE 1149.1; IEEE 1149.6	e1
PEX8618-BA50BCG	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.95 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm	19 mm				260	19 mm	CMOS	1 V	I2C; PCI; SMBUS; SPI; USB	1 mm	S-PBGA-B324	3		IEEE 1149.1; IEEE 1149.6	e1
PI7C9X2G1224GPBHSBE	Diodes Incorporated	BUS CONTROLLER, PCI		BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	0	GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	1 V	85 Cel	625 MBps	-40 Cel		BOTTOM	1.9 mm	19 mm	0	100 MHz			19 mm	CMOS		I2C, PCI, SMBUS	1 mm	S-PBGA-B324
PI7C9X3G816GPBHFCE	Diodes Incorporated	BUS CONTROLLER, PCI		BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	.99 V	0	GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.9 V		.0125 MBps			BOTTOM	2.89 mm	19 mm	0	100 MHz			19 mm	CMOS	.95 V	I2C, SPI	1 mm	S-PBGA-B324
PEX8619-BA50BCG	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.95 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm	19 mm				260	19 mm	CMOS	1 V	I2C; PCI; SMBUS; SPI; USB	1 mm	S-PBGA-B324	3	Not Qualified	IEEE 1149.1; IEEE 1149.6	e1
PEX8618-BA50BC	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.95 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm	19 mm					19 mm	CMOS	1 V	I2C; PCI; SMBUS; SPI; USB	1 mm	S-PBGA-B324	3		IEEE 1149.1; IEEE 1149.6	e1
PEX8615-BA50BIG	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.95 V	85 Cel	3000 MBps	-40 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm	19 mm				260	19 mm	CMOS	1 V	I2C; PCI; SMBUS; SPI; USB	1 mm	S-PBGA-B324	3		IEEE 1149.1; IEEE 1149.6	e1
PEX8613-BA50BCG	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.95 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm	19 mm				260	19 mm	CMOS	1 V	I2C; PCI; SMBUS; SPI; USB	1 mm	S-PBGA-B324	3		IEEE 1149.1; IEEE 1149.6	e1
PEX8619-BA50BC	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.95 V	70 Cel		0 Cel		BOTTOM	1.9 mm	19 mm					19 mm	CMOS	1 V	I2C; PCI; SMBUS; SPI; USB	1 mm	S-PBGA-B324			IEEE 1149.1; IEEE 1149.6
88SE1485A1-BSS2C000-A189	Marvell Technology	BUS CONTROLLER, PCI	COMMERCIAL	BALL	625	HBGA	SQUARE	PLASTIC/EPOXY	YES	1 V	24	GRID ARRAY, HEAT SINK/SLUG	BGA625,25X25,32	.9 V	70 Cel	1000 MBps	0 Cel		BOTTOM	2.53 mm	21 mm	16	100 MHz			21 mm	CMOS	.95 V	ATA; I2C; SPI; UART	.8 mm	S-PBGA-B625
PI7C9X2G1616PRBHSBEX	Diodes Incorporated	BUS CONTROLLER, PCI		BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	0	GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	1 V	85 Cel	625 MBps	-40 Cel		BOTTOM	1.9 mm	19 mm	0	100 MHz			19 mm	CMOS		I2C, PCI, SMBUS	1 mm	S-PBGA-B324
CA91L8260B-100IE	Renesas Electronics	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	420	HBGA	SQUARE	PLASTIC/EPOXY	YES	2.63 V	32	GRID ARRAY, HEAT SINK/SLUG	BGA420,26X26,50	2.38 V	85 Cel		-40 Cel		BOTTOM	2.46 mm	35 mm	64	100 MHz			35 mm	CMOS	2.5 V	I2C; VGA; MPC826X; MPC825X; MPC827X; MPC8280; MPC74X; MPC75X; POWERPC 7400; POWERPC 7XX	1.27 mm	S-PBGA-B420			IEEE 1394
PEX8615-BA50BC	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.95 V	70 Cel	3000 MBps	0 Cel		BOTTOM	1.9 mm	19 mm					19 mm	CMOS	1 V	I2C; PCI; SMBUS; SPI; USB	1 mm	S-PBGA-B324			IEEE 1149.1; IEEE 1149.6
PEX8532-BB25BI	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	680	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	0	GRID ARRAY, HEAT SINK/SLUG		.9 V	85 Cel	312.5 MBps	-40 Cel		BOTTOM	2.23 mm	35 mm	0	100 MHz			35 mm	CMOS	1 V		1 mm	S-PBGA-B680		Not Qualified
PEX8548-AA25BIG	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	736	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	0	GRID ARRAY, HEAT SINK/SLUG		.9 V	85 Cel	312.5 MBps	-40 Cel	TIN SILVER COPPER	BOTTOM	2.42 mm	37.5 mm	0			260	37.5 mm	CMOS	1 V	I2C; ISA; SPI; VGA	1 mm	S-PBGA-B736	3			e1
PEX8532-BB25BIG	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	680	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	0	GRID ARRAY, HEAT SINK/SLUG		.9 V	85 Cel	312.5 MBps	-40 Cel		BOTTOM	2.23 mm	35 mm	0	100 MHz	NOT SPECIFIED	NOT SPECIFIED	35 mm	CMOS	1 V		1 mm	S-PBGA-B680		Not Qualified
PEX8532-BC25BIG	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	680	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	0	GRID ARRAY, HEAT SINK/SLUG		.9 V	85 Cel		-40 Cel		BOTTOM		35 mm	0	100 MHz		260	35 mm	CMOS	1 V		1 mm	S-PBGA-B680	3	Not Qualified
PEX8649-AA50RBCF	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	676	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0	GRID ARRAY, HEAT SINK/SLUG	BGA676,26X26,40	.95 V	70 Cel	.0125 MBps	0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	27 mm	0				27 mm	CMOS	1 V	I2C; SMBUS; SPI; USB	1 mm	S-PBGA-B676	4		IEEE 1149.6; IEEE 1149.1	e1
PEX8614-BA50BC	Broadcom	BUS CONTROLLER, PCI	OTHER	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.95 V	85 Cel		-10 Cel		BOTTOM	1.9 mm	19 mm					19 mm	CMOS	1 V	I2C; PCI; SMBUS; SPI; USB	1 mm	S-PBGA-B324			IEEE 1149.1; IEEE 1149.6
PEX8647-BB50RBCF	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	676	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0	GRID ARRAY, HEAT SINK/SLUG		.95 V	70 Cel		0 Cel		BOTTOM	2.48 mm	27 mm	0				27 mm	CMOS	1 V	I2C; SMBUS; SPI; USB	1 mm	S-PBGA-B676			IEEE 1149.6; IEEE 1149.1
PEX8548-AA25BI	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	736	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	0	GRID ARRAY, HEAT SINK/SLUG		.9 V	85 Cel	312.5 MBps	-40 Cel		BOTTOM	2.42 mm	37.5 mm	0				37.5 mm	CMOS	1 V	I2C; ISA; SPI; VGA	1 mm	S-PBGA-B736
PEX8532-BA25BIG	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	680	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0	GRID ARRAY, HEAT SINK/SLUG		.95 V	85 Cel	312.5 MBps	-40 Cel		BOTTOM	2.23 mm	35 mm	0				35 mm	CMOS	1 V		1 mm	S-PBGA-B680
PEX8613-BA50BIG	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.95 V	85 Cel		-40 Cel		BOTTOM	1.9 mm	19 mm			NOT SPECIFIED	NOT SPECIFIED	19 mm	CMOS	1 V	I2C; PCI; SMBUS; SPI; USB	1 mm	S-PBGA-B324			IEEE 1149.1; IEEE 1149.6
PEX8516-BB25BI	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	312	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, HEAT SINK/SLUG		.9 V	85 Cel		-40 Cel		BOTTOM		27 mm		100 MHz			27 mm	CMOS	1 V		1 mm	S-PBGA-B312		Not Qualified
PEX8516-BA25BIG	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	312	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, HEAT SINK/SLUG		.9 V	85 Cel		-40 Cel		BOTTOM		27 mm		100 MHz			27 mm	CMOS	1 V		1 mm	S-PBGA-B312		Not Qualified
PEX8524-BB25VBI	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	680	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, HEAT SINK/SLUG		.9 V	85 Cel		-40 Cel		BOTTOM		35 mm		100 MHz			35 mm	CMOS	1 V		1 mm	S-PBGA-B680		Not Qualified
PEX8533-AA25BI	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	680	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	0	GRID ARRAY, HEAT SINK/SLUG		.9 V	85 Cel	312.5 MBps	-40 Cel		BOTTOM	2.23 mm	35 mm	0				35 mm	CMOS	1 V	I2C; ISA; SPI; VGA	1 mm	S-PBGA-B680
PEX8516-BB25BIG	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	312	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, HEAT SINK/SLUG		.9 V	85 Cel		-40 Cel		BOTTOM		27 mm		100 MHz	NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS	1 V		1 mm	S-PBGA-B312		Not Qualified
PEX8616-BB50RBCF	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.95 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	19 mm					19 mm	CMOS	1 V	I2C; ISA; SMBUS; SPI; VGA	1 mm	S-PBGA-B324	4		IEEE 1149.1; IEEE 1149.6	e1
PEX8625-AA50RBCF	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	1156	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0	GRID ARRAY, HEAT SINK/SLUG	BGA1156,34X34,40	.95 V	70 Cel	.0125 MBps	0 Cel		BOTTOM	2.85 mm	35 mm	0			245	35 mm	CMOS	1 V	I2C; SMBUS; SPI; VGA	1 mm	S-PBGA-B1156	4		IEEE 1149.6; IEEE 1149.1
PEX8532-BC25BI	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	680	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	0	GRID ARRAY, HEAT SINK/SLUG		.9 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM		35 mm	0	100 MHz			35 mm	CMOS	1 V		1 mm	S-PBGA-B680	3	Not Qualified		e0
PEX8533-AA25BIG	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	680	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	0	GRID ARRAY, HEAT SINK/SLUG		.9 V	85 Cel	312.5 MBps	-40 Cel	TIN SILVER COPPER	BOTTOM	2.23 mm	35 mm	0			260	35 mm	CMOS	1 V	I2C; ISA; SPI; VGA	1 mm	S-PBGA-B680	3			e1
PEX8524-BB25VBIG	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	680	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, HEAT SINK/SLUG		.9 V	85 Cel		-40 Cel		BOTTOM		35 mm		100 MHz	NOT SPECIFIED	NOT SPECIFIED	35 mm	CMOS	1 V		1 mm	S-PBGA-B680		Not Qualified
PEX8696-AA50RBCF	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	1156	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0	GRID ARRAY, HEAT SINK/SLUG	BGA1156,34X34,40	.95 V	70 Cel	.0125 MBps	0 Cel	TIN SILVER COPPER	BOTTOM	2.85 mm	35 mm	0				35 mm	CMOS	1 V	I2C; SMBUS; SPI; USB	1 mm	S-PBGA-B1156	4		IEEE 1149.6; IEEE 1149.1	e1
PEX8696-AA50RBCG	Broadcom	BUS CONTROLLER, PCI		BALL	1156	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0	GRID ARRAY, HEAT SINK/SLUG	BGA1156,34X34,40	.95 V	70 Cel	.0125 MBps	0 Cel		BOTTOM	2.85 mm	35 mm	0	250 MHz			35 mm	CMOS	1 V	I2C, SMBUS, SPI, USB	1 mm	S-PBGA-B1156
PEX8615-BA50BCG	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.95 V	70 Cel	3000 MBps	0 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm	19 mm				260	19 mm	CMOS	1 V	I2C; PCI; SMBUS; SPI; USB	1 mm	S-PBGA-B324	3		IEEE 1149.1; IEEE 1149.6	e1
PEX8532-BA25BI	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	680	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0	GRID ARRAY, HEAT SINK/SLUG		.95 V	85 Cel	312.5 MBps	-40 Cel		BOTTOM	2.23 mm	35 mm	0				35 mm	CMOS	1 V		1 mm	S-PBGA-B680
PEX8614-BA50BCG	Broadcom	BUS CONTROLLER, PCI	OTHER	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.95 V	85 Cel		-10 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm	19 mm				260	19 mm	CMOS	1 V	I2C; PCI; SMBUS; SPI; USB	1 mm	S-PBGA-B324	3		IEEE 1149.1; IEEE 1149.6	e1
PEX8624-BB50BIF	Broadcom	BUS CONTROLLER, PCI	INDUSTRIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0	GRID ARRAY, HEAT SINK/SLUG		.95 V	85 Cel		-40 Cel		BOTTOM	2.48 mm	19 mm	0				19 mm	CMOS	1 V	I2C; ISA; SMBUS; SPI; VGA	1 mm	S-PBGA-B324
PEX8624-BB50RBCF	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0	GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.95 V	70 Cel		0 Cel		BOTTOM	2.48 mm	19 mm	0			245	19 mm	CMOS	1 V	I2C; ISA; SMBUS; SPI; VGA	1 mm	S-PBGA-B324	4
PEX8612-BB50RBCF	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0	GRID ARRAY, HEAT SINK/SLUG		.95 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	19 mm	0				19 mm	CMOS	1 V	I2C; SMBUS; SPI; USB	1 mm	S-PBGA-B324	4		IEEE 1149.6; IEEE 1149.1	e1
PEX8613-BA50BC	Broadcom	BUS CONTROLLER, PCI	COMMERCIAL	BALL	324	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG	BGA324,18X18,40	.95 V	70 Cel		0 Cel		BOTTOM	1.9 mm	19 mm					19 mm	CMOS	1 V	I2C; PCI; SMBUS; SPI; USB	1 mm	S-PBGA-B324			IEEE 1149.1; IEEE 1149.6
PEX8680-AA50RBCG	Broadcom	BUS CONTROLLER, PCI		BALL	1156	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0	GRID ARRAY, HEAT SINK/SLUG	BGA1156,34X34,40	.95 V	70 Cel		0 Cel		BOTTOM	2.85 mm	35 mm	0	250 MHz		245	35 mm	CMOS	1 V	I2C, PCI, SMBUS	1 mm	S-PBGA-B1156
PEX8680-AA50RBCF	Broadcom	BUS CONTROLLER, PCI		BALL	1156	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0	GRID ARRAY, HEAT SINK/SLUG	BGA1156,34X34,40	.95 V	70 Cel		0 Cel		BOTTOM	2.85 mm	35 mm	0	250 MHz		245	35 mm	CMOS	1 V	I2C, PCI, SMBUS	1 mm	S-PBGA-B1156	4

Bus Controllers

Bus controllers are integrated circuits that are used to manage and control the flow of data and control signals between different devices in a computer system. They are commonly used in systems that have multiple buses, such as a memory bus and an I/O bus. Bus controllers ensure that data is transferred efficiently and correctly between different devices in the system.

One of the primary functions of a bus controller is to manage bus arbitration. Bus arbitration is the process of resolving conflicts that occur when two or more devices on the bus attempt to access the bus at the same time. Bus controllers use various algorithms to determine which device has priority access to the bus and when other devices can access it.

Another important function of bus controllers is to manage the transfer of data and control signals between devices on the bus. This involves controlling the timing and synchronization of signals, as well as error detection and correction. Bus controllers also manage other aspects of the bus, such as interrupt handling and power management.