Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | Width | Data EEPROM Size | Additional Features | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | PWM Channels | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
2 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
85 Cel |
625 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
10 mm |
32 |
19.2 MHz |
40 |
260 |
10 mm |
CMOS |
200 mA |
1.2 V |
I2C, I2S, SMBUS, SPI, UART, USB |
.8 mm |
S-PBGA-B121 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
2 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
70 Cel |
625 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
10 mm |
32 |
19.2 MHz |
260 |
10 mm |
CMOS |
200 mA |
1.2 V |
I2C, I2S, SMBUS, SPI, UART, USB |
.8 mm |
S-PBGA-B121 |
3 |
Not Qualified |
e1 |
|||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
85 Cel |
375 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
10 mm |
32 |
52 MHz |
10 mm |
CMOS |
200 mA |
1.2 V |
I2C; I2S; SPI; UART |
.8 mm |
S-PBGA-B121 |
3 |
GPIF |
e1 |
|||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
70 Cel |
375 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
10 mm |
32 |
52 MHz |
10 mm |
CMOS |
200 mA |
1.2 V |
I2C; I2S; SPI; UART |
.8 mm |
S-PBGA-B121 |
3 |
GPIF |
e1 |
|||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.7 V |
32 |
2.5,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
2.3 V |
85 Cel |
264 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
32 |
66 MHz |
260 |
17 mm |
CMOS |
180 mA |
2.5 V |
Bus Controllers |
I960; MPC850; MPC860; POWERPC 801; POWERPC 401 |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
144 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
0 |
1.5,3.3,3.3/5 |
GRID ARRAY |
BGA144,12X12,40 |
85 Cel |
250 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
0 |
260 |
CMOS |
207 mA |
1.5 V |
Bus Controllers |
1 mm |
R-PBGA-B144 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
337 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.7 V |
0 |
GRID ARRAY, FINE PITCH |
2.3 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2 mm |
21 mm |
0 |
66 MHz |
260 |
21 mm |
CMOS |
2.5 V |
PCI |
.5 mm |
S-PBGA-B337 |
3 |
Not Qualified |
IEEE 1149.1 |
e1 |
|||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
BALL |
121 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
0 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
85 Cel |
625 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.7 mm |
10 mm |
0 |
40 MHz |
260 |
10 mm |
CMOS |
192 mA |
1.2 V |
Bus Controllers |
I2C, I2S, SPI, UART |
.8 mm |
S-PBGA-B121 |
3 |
Not Qualified |
e1 |
|||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
BALL |
121 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
0 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
70 Cel |
625 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.7 mm |
10 mm |
0 |
40 MHz |
260 |
10 mm |
CMOS |
192 mA |
1.2 V |
I2C, I2S, SPI, UART |
.8 mm |
S-PBGA-B121 |
3 |
e1 |
|||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
.99 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,32 |
.9 V |
.0125 MBps |
BOTTOM |
1.4 mm |
10 mm |
10 mm |
CMOS |
.95 V |
I2C, SPI |
.8 mm |
S-PBGA-B144 |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
169 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA169,13X13,32 |
1.35 V |
85 Cel |
250 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
12 mm |
ALSO OPERATES AT 1.5 V SUPPLY |
32 |
125 MHz |
30 |
260 |
12 mm |
CMOS |
1.5 V |
PCI |
.8 mm |
S-PBGA-B169 |
3 |
e1 |
|||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.7 V |
64 |
2.5,3.3 |
GRID ARRAY |
BGA272,20X20,50 |
2.3 V |
85 Cel |
528 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.26 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
64 |
66 MHz |
260 |
27 mm |
CMOS |
185 mA |
2.5 V |
Bus Controllers |
I960; MPC850; MPC860; POWERPC 80X/82X; POWERPC 401 |
1.27 mm |
S-PBGA-B272 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
650 |
SQUARE |
PLASTIC/EPOXY |
YES |
105 Cel |
174000 MBps |
-40 Cel |
BOTTOM |
CMOS |
I2C, PCI, SMBUS, UART |
S-PBGA-B650 |
||||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
BGA196,14X14,40 |
.95 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
15 mm |
260 |
15 mm |
CMOS |
2030 mA |
1 V |
I2C, SMBUS, SPI, USB |
1 mm |
S-PBGA-B196 |
3 |
IEEE 1149.1; IEEE 1149.6 |
e1 |
|||||||||||||||||||||||||||
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
650 |
SQUARE |
PLASTIC/EPOXY |
YES |
105 Cel |
174000 MBps |
-40 Cel |
BOTTOM |
CMOS |
I2C, PCI, SMBUS, UART |
S-PBGA-B650 |
||||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
CMOS |
I2C |
S-PBGA-B324 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
1311 |
SQUARE |
PLASTIC/EPOXY |
YES |
105 Cel |
174000 MBps |
-40 Cel |
BOTTOM |
CMOS |
I2C, PCI, SMBUS, UART |
S-PBGA-B1311 |
||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
144 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
32 |
1.5,3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA144,13X13,20 |
1.35 V |
85 Cel |
250 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
7 mm |
IT ALSO OPERATES AT 3.3V |
32 |
125 MHz |
30 |
260 |
7 mm |
CMOS |
1.5 V |
Bus Controllers |
VGA |
.5 mm |
S-PBGA-B144 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
650 |
SQUARE |
PLASTIC/EPOXY |
YES |
105 Cel |
174000 MBps |
-40 Cel |
BOTTOM |
CMOS |
I2C, PCI, SMBUS, UART |
S-PBGA-B650 |
||||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
180 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3.3 |
GRID ARRAY |
240 MBps |
TIN SILVER COPPER |
BOTTOM |
32 |
60 MHz |
260 |
CMOS |
3.3 V |
Bus Controllers |
PCI |
R-PBGA-B180 |
2A |
Not Qualified |
e1 |
||||||||||||||||||||||||||||||||
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
1311 |
SQUARE |
PLASTIC/EPOXY |
YES |
105 Cel |
174000 MBps |
-40 Cel |
BOTTOM |
CMOS |
I2C, PCI, SMBUS, UART |
S-PBGA-B1311 |
||||||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,18X18,40 |
1 V |
85 Cel |
625 MBps |
-40 Cel |
BOTTOM |
1.9 mm |
19 mm |
0 |
100 MHz |
19 mm |
CMOS |
I2C, PCI, SMBUS |
1 mm |
S-PBGA-B324 |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
1.8,3.3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA25,5X5,16 |
1.6 V |
70 Cel |
.125 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
.62 mm |
1.97 mm |
52 MHz |
40 |
260 |
1.97 mm |
CMOS |
110 mA |
1.8 V |
Bus Controllers |
I2C; USB |
.4 mm |
S-PBGA-B25 |
1 |
Not Qualified |
e1 |
||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, I2C |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
.99 V |
GRID ARRAY |
BGA196,14X14,40 |
.9 V |
BOTTOM |
2.94 mm |
15 mm |
100 MHz |
15 mm |
CMOS |
.95 V |
I2C; PCI; SMBUS |
1 mm |
S-PBGA-B196 |
|||||||||||||||||||||||||||||||||||
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
1311 |
SQUARE |
PLASTIC/EPOXY |
YES |
105 Cel |
174000 MBps |
-40 Cel |
BOTTOM |
CMOS |
I2C, PCI, SMBUS, UART |
S-PBGA-B1311 |
||||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
I2C |
S-PBGA-B324 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
169 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.35 V |
85 Cel |
312.5 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
12 mm |
32 |
30 |
260 |
12 mm |
CMOS |
1.5 V |
PCI; VGA |
.8 mm |
S-PBGA-B169 |
3 |
e1 |
||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
169 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA169,13X13,32 |
1.35 V |
85 Cel |
250 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
12 mm |
ALSO OPERATES AT 1.5 V SUPPLY |
32 |
125 MHz |
30 |
260 |
12 mm |
CMOS |
1.5 V |
PCI |
.8 mm |
S-PBGA-B169 |
3 |
e1 |
|||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
X86; POWERPC; MIPS; ARM; PCI |
S-PBGA-B196 |
|||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
BALL |
56 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA56,8X8,20 |
3 V |
70 Cel |
60 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 mm |
5 mm |
0 |
48 MHz |
40 |
260 |
5 mm |
CMOS |
85 mA |
3.3 V |
I2C; UART; USB |
.5 mm |
S-PBGA-B56 |
3 |
e1 |
||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
169 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
32 |
1.5,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA169,13X13,32 |
1.35 V |
85 Cel |
250 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
12 mm |
ALSO OPERATES AT 3.3V SUPPLY |
32 |
125 MHz |
30 |
260 |
12 mm |
CMOS |
1.5 V |
Bus Controllers |
VGA |
.8 mm |
S-PBGA-B169 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||
|
Renesas Electronics |
BUS CONTROLLER, VME |
INDUSTRIAL |
BALL |
313 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
64 |
5 |
GRID ARRAY |
BGA313,25X25,50 |
4.5 V |
85 Cel |
70 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.46 mm |
35 mm |
64 |
33 MHz |
260 |
35 mm |
CMOS |
5 V |
Bus Controllers |
PCI |
2.54 mm |
S-PBGA-B313 |
3 |
Not Qualified |
IEEE 1149.1 |
e1 |
|||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
I2C |
S-PBGA-B676 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BGA324,18X18,40 |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
19 mm |
245 |
19 mm |
CMOS |
1 mm |
S-PBGA-B324 |
4 |
e1 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
2 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
70 Cel |
625 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
10 mm |
32 |
19.2 MHz |
10 mm |
CMOS |
200 mA |
1.2 V |
I2C, I2S, SMBUS, SPI, UART, USB |
.8 mm |
S-PBGA-B121 |
3 |
e1 |
|||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
169 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA169,13X13,32 |
1.35 V |
70 Cel |
250 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
12 mm |
ALSO OPERATES AT 1.5 V SUPPLY |
32 |
125 MHz |
30 |
260 |
12 mm |
CMOS |
1.5 V |
PCI |
.8 mm |
S-PBGA-B169 |
3 |
e1 |
|||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,18X18,40 |
.95 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
19 mm |
260 |
19 mm |
CMOS |
1 V |
I2C; PCI; SMBUS; SPI; USB |
1 mm |
S-PBGA-B324 |
3 |
Not Qualified |
IEEE 1149.1; IEEE 1149.6 |
e1 |
|||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
753 |
SQUARE |
PLASTIC/EPOXY |
YES |
BOTTOM |
CMOS |
I2C, SMBUS, UART |
S-PBGA-B753 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
1,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
.9 V |
85 Cel |
312.5 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
0 |
260 |
17 mm |
CMOS |
1 V |
Bus Controllers |
ISA; SPI; VGA |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
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|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
260 |
CMOS |
I2C |
S-PBGA-B196 |
3 |
e1 |
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|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY |
BGA196,14X14,40 |
.95 V |
85 Cel |
.0125 MBps |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
15 mm |
0 |
100 MHz |
260 |
15 mm |
CMOS |
1 V |
I2C, PCI, SMBUS |
1 mm |
S-PBGA-B196 |
3 |
e1 |
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Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
650 |
SQUARE |
PLASTIC/EPOXY |
YES |
105 Cel |
174000 MBps |
-40 Cel |
BOTTOM |
CMOS |
I2C, PCI, SMBUS, UART |
S-PBGA-B650 |
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|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
.95 V |
85 Cel |
625 MBps |
-40 Cel |
BOTTOM |
1.63 mm |
15 mm |
100 MHz |
15 mm |
CMOS |
1 V |
I2C; SMBUS |
1 mm |
S-PBGA-B196 |
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Renesas Electronics |
BUS CONTROLLER, VME |
INDUSTRIAL |
BALL |
313 |
IBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
64 |
5 |
GRID ARRAY, INTERSTITIAL PITCH |
BGA313,25X25,50 |
4.5 V |
85 Cel |
70 MBps |
-40 Cel |
TIN LEAD |
BOTTOM |
3.5 mm |
35 mm |
64 |
33 MHz |
20 |
225 |
35 mm |
CMOS |
5 V |
Bus Controllers |
PCI |
2.54 mm |
S-PBGA-B313 |
3 |
Not Qualified |
e0 |
||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
324 |
SQUARE |
PLASTIC/EPOXY |
YES |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
I2C, PCI |
S-PBGA-B324 |
4 |
e1 |
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|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,18X18,40 |
.95 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
19 mm |
260 |
19 mm |
CMOS |
1 V |
I2C; PCI; SMBUS; SPI; USB |
1 mm |
S-PBGA-B324 |
3 |
IEEE 1149.1; IEEE 1149.6 |
e1 |
||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
BGA196,14X14,40 |
.95 V |
.1 MBps |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
15 mm |
260 |
15 mm |
CMOS |
1 V |
I2C |
1 mm |
S-PBGA-B196 |
3 |
e1 |
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|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.7 V |
64 |
2.5,3.3 |
GRID ARRAY |
BGA272,20X20,50 |
2.3 V |
85 Cel |
528 MBps |
-40 Cel |
TIN LEAD |
BOTTOM |
2.26 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
64 |
66 MHz |
260 |
27 mm |
CMOS |
185 mA |
2.5 V |
Bus Controllers |
I960; MPC850; MPC860; POWERPC 80X/82X; POWERPC 401 |
1.27 mm |
S-PBGA-B272 |
3 |
Not Qualified |
e0 |
Bus controllers are integrated circuits that are used to manage and control the flow of data and control signals between different devices in a computer system. They are commonly used in systems that have multiple buses, such as a memory bus and an I/O bus. Bus controllers ensure that data is transferred efficiently and correctly between different devices in the system.
One of the primary functions of a bus controller is to manage bus arbitration. Bus arbitration is the process of resolving conflicts that occur when two or more devices on the bus attempt to access the bus at the same time. Bus controllers use various algorithms to determine which device has priority access to the bus and when other devices can access it.
Another important function of bus controllers is to manage the transfer of data and control signals between devices on the bus. This involves controlling the timing and synchronization of signals, as well as error detection and correction. Bus controllers also manage other aspects of the bus, such as interrupt handling and power management.