Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | Width | Data EEPROM Size | Additional Features | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | PWM Channels | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
I2C |
S-PBGA-B196 |
|||||||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY |
BGA196,14X14,40 |
.95 V |
85 Cel |
.0125 MBps |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
15 mm |
0 |
100 MHz |
15 mm |
CMOS |
1 V |
I2C, PCI, SMBUS |
1 mm |
S-PBGA-B196 |
3 |
e1 |
||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,18X18,40 |
.95 V |
70 Cel |
0 Cel |
BOTTOM |
1.9 mm |
19 mm |
19 mm |
CMOS |
1 V |
I2C; PCI; SMBUS; SPI; USB |
1 mm |
S-PBGA-B324 |
IEEE 1149.1; IEEE 1149.6 |
|||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
312.5 MBps |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
I2C |
S-PBGA-B324 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
CMOS |
I2C |
S-PBGA-B676 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
CMOS |
I2C |
S-PBGA-B676 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
.95 V |
85 Cel |
625 MBps |
-40 Cel |
BOTTOM |
1.63 mm |
15 mm |
0 |
100 MHz |
15 mm |
CMOS |
1 V |
I2C; SMBUS |
1 mm |
S-PBGA-B196 |
||||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
1467 |
SQUARE |
PLASTIC/EPOXY |
YES |
BOTTOM |
CMOS |
I2C, SMBUS, UART |
S-PBGA-B1467 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
1467 |
SQUARE |
PLASTIC/EPOXY |
YES |
BOTTOM |
CMOS |
I2C, SMBUS, UART |
S-PBGA-B1467 |
||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
1467 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BOTTOM |
CMOS |
I2C, PCI, SMBUS, UART |
R-PBGA-B1467 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
OTHER |
BALL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
0 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.7 V |
85 Cel |
2500 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
5 mm |
0 |
30 |
260 |
5 mm |
CMOS |
1.8 V |
PCI |
.5 mm |
S-PBGA-B48 |
3 |
Not Qualified |
e1 |
|||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA25,5X5,16 |
1.6 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
.62 mm |
1.97 mm |
8 |
38.4 MHz |
1.97 mm |
CMOS |
40 mA |
1.8 V |
UART |
.4 mm |
S-PBGA-B25 |
1 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
BALL |
25 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
CMOS |
3.3 V |
I2C |
S-PBGA-B25 |
e1 |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
201 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA201,17X17,32 |
1.35 V |
70 Cel |
250 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
15 mm |
ALSO OPERATES AT 3.3V SUPPLY |
32 |
125 MHz |
30 |
260 |
15 mm |
CMOS |
1.5 V |
PCI |
.8 mm |
S-PBGA-B201 |
3 |
e1 |
|||||||||||||||||||||||
|
Renesas Electronics |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
GRID ARRAY |
.9 V |
85 Cel |
24000 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.88 mm |
19 mm |
0 |
125 MHz |
260 |
19 mm |
CMOS |
1 V |
I2C; ISA; PCI; SMBUS; VGA |
1 mm |
S-PBGA-B324 |
4 |
e1 |
||||||||||||||||||||||||||
|
Renesas Electronics |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
1,3.3 |
GRID ARRAY |
BGA484,22X22,40 |
.9 V |
85 Cel |
24000 MBps |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2.92 mm |
23 mm |
ALSO OPERATES AT 100 MHZ |
125 MHz |
NOT SPECIFIED |
250 |
23 mm |
CMOS |
3400 mA |
1 V |
Bus Controllers |
I2C; ISA; SMBUS; VGA |
1 mm |
S-PBGA-B484 |
4 |
Not Qualified |
e1 |
|||||||||||||||||||||
Renesas Electronics |
BUS CONTROLLER, PCI |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
GRID ARRAY |
BGA484,22X22,40 |
.9 V |
85 Cel |
32000 MBps |
-40 Cel |
BOTTOM |
2.92 mm |
23 mm |
ALSO OPERATES AT 100 MHZ |
0 |
125 MHz |
23 mm |
CMOS |
3400 mA |
1 V |
I2C; ISA; VGA |
1 mm |
S-PBGA-B484 |
|||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
CMOS |
I2C |
S-PBGA-B376 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
1 V |
85 Cel |
625 MBps |
-40 Cel |
BOTTOM |
1.5 mm |
15 mm |
15 mm |
CMOS |
I2C; SMBUS; SPI; VGA |
1 mm |
S-PBGA-B196 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA25,5X5,16 |
1.6 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
.62 mm |
1.97 mm |
8 |
26 MHz |
1.97 mm |
CMOS |
40 mA |
1.8 V |
UART |
.4 mm |
S-PBGA-B25 |
1 |
|||||||||||||||||||||||||||||
Texas Instruments |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,3.3/5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA257,19X19,32 |
3 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1.4 mm |
16 mm |
32 |
66 MHz |
20 |
220 |
16 mm |
CMOS |
3.3 V |
Bus Controllers |
.8 mm |
S-PBGA-B257 |
3 |
Not Qualified |
e0 |
||||||||||||||||||||||||
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
650 |
SQUARE |
PLASTIC/EPOXY |
YES |
105 Cel |
174000 MBps |
-40 Cel |
BOTTOM |
CMOS |
I2C, PCI, SMBUS, UART |
S-PBGA-B650 |
||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
2 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
70 Cel |
625 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
10 mm |
16 |
19.2 MHz |
10 mm |
CMOS |
200 mA |
1.2 V |
I2C, I2S, SMBUS, SPI, UART, USB |
.8 mm |
S-PBGA-B121 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
1.2 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
85 Cel |
185 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
10 mm |
19.2 MHz |
10 mm |
CMOS |
200 mA |
1.2 V |
Bus Controllers |
I2C |
.8 mm |
S-PBGA-B121 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
BALL |
192 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA192,14X14,32 |
.95 V |
70 Cel |
1250 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.45 mm |
12 mm |
25 MHz |
12 mm |
CMOS |
750 mA |
1 V |
I2C; SPI |
.8 mm |
S-PBGA-B192 |
e1 |
||||||||||||||||||||||||||||
|
Intel |
BALL |
942 |
BGA |
PLASTIC/EPOXY |
YES |
1.05,1.5,1.8,3.3,5 |
GRID ARRAY |
BGA942(UNSPEC) |
BOTTOM |
Bus Controllers |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
CMOS |
I2C |
S-PBGA-B324 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
S-PBGA-B676 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||
|
Intel |
BALL |
989 |
BGA |
PLASTIC/EPOXY |
YES |
1.05,1.5,1.8,3.3,5 |
GRID ARRAY |
BGA989(UNSPEC) |
BOTTOM |
Bus Controllers |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
BUS CONTROLLER, PCI |
BALL |
836 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
GRID ARRAY |
.998 V |
2000 MBps |
BOTTOM |
2.207 mm |
25 mm |
0 |
25 mm |
CMOS |
1.05 V |
I2C; ISA; SMBUS; PCI; ATA |
S-PBGA-B836 |
IEEE 802.3 |
||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
I2C |
S-PBGA-B324 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||
|
Marvell Technology |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
625 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 V |
24 |
GRID ARRAY, HEAT SINK/SLUG |
BGA625,25X25,32 |
.9 V |
70 Cel |
1000 MBps |
0 Cel |
BOTTOM |
2.53 mm |
21 mm |
16 |
100 MHz |
21 mm |
CMOS |
.95 V |
ATA; I2C; SPI; UART |
.8 mm |
S-PBGA-B625 |
|||||||||||||||||||||||||||||
|
Marvell Technology |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
481 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
22 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.95 V |
70 Cel |
625 MBps |
0 Cel |
BOTTOM |
1.6 mm |
19 mm |
36 |
19 mm |
CMOS |
1 V |
ATA; I2C; SPI; UART |
.8 mm |
S-PBGA-B481 |
|||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.7 V |
32 |
2.5,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
2.3 V |
85 Cel |
264 MBps |
-40 Cel |
TIN LEAD |
BOTTOM |
1.76 mm |
17 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
32 |
66 MHz |
17 mm |
CMOS |
180 mA |
2.5 V |
Bus Controllers |
I960; MPC850; MPC860; POWERPC 801; POWERPC 401 |
1 mm |
S-PBGA-B256 |
Not Qualified |
e0 |
|||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
ITS ALSO REQUIRES 3.3 V SUPPLY |
260 |
CMOS |
I2C |
S-PBGA-B196 |
3 |
e1 |
|||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
S-PBGA-B676 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||
Digital Equipment |
COMMERCIAL |
BALL |
304 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3,3.3/5 |
GRID ARRAY |
BGA304,23X23,50 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
Bus Controllers |
1.27 mm |
S-PBGA-B304 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||
Intel |
COMMERCIAL |
BALL |
304 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3,3.3/5 |
GRID ARRAY |
BGA304,23X23,50 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
Bus Controllers |
1.27 mm |
S-PBGA-B304 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||
Intel |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
GRID ARRAY |
1.14 V |
85 Cel |
12 MBps |
-40 Cel |
BOTTOM |
2.34 mm |
23 mm |
0 |
100 MHz |
23 mm |
CMOS |
1.2 V |
I2C |
1 mm |
S-PBGA-B376 |
IEEE 802.3; IEEE 1588 |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA20,4X5,16 |
2.7 V |
85 Cel |
.125 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
.55 mm |
1.63 mm |
0 |
48 MHz |
2.03 mm |
CMOS |
3.3 V |
I2C, SPI, UART, USB |
.4 mm |
R-PBGA-B20 |
1 |
e1 |
|||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
BALL |
121 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
0 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
85 Cel |
625 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.7 mm |
10 mm |
0 |
40 MHz |
10 mm |
CMOS |
192 mA |
1.2 V |
Bus Controllers |
I2C, I2S, SPI, UART |
.8 mm |
S-PBGA-B121 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
BALL |
100 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 mm |
6 mm |
26 MHz |
6 mm |
CMOS |
1.2 V |
I2C |
.5 mm |
S-PBGA-B100 |
3 |
e1 |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
BALL |
192 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA192,14X14,32 |
.95 V |
70 Cel |
1250 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.45 mm |
12 mm |
0 |
25 MHz |
12 mm |
CMOS |
750 mA |
1 V |
I2C; SPI; UART |
.8 mm |
S-PBGA-B192 |
e1 |
||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
BALL |
192 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA192,14X14,32 |
.95 V |
70 Cel |
1250 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.45 mm |
12 mm |
25 MHz |
12 mm |
CMOS |
750 mA |
1 V |
I2C; SPI |
.8 mm |
S-PBGA-B192 |
e1 |
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|
Intel |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
BALL |
942 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
1,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA942(UNSPEC) |
.95 V |
BOTTOM |
1.978 mm |
27 mm |
100 MHz |
27 mm |
CMOS |
2000 mA |
1 V |
Bus Controllers |
PCI; I2C |
.7 mm |
S-PBGA-B942 |
Not Qualified |
IEEE 802.3; IEEE 1588 |
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Intel |
BALL |
492 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.5/5,3.3 |
GRID ARRAY |
BGA492,26X26,50 |
BOTTOM |
Bus Controllers |
1.27 mm |
S-PBGA-B492 |
Not Qualified |
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|
Renesas Electronics |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
1,3.3 |
GRID ARRAY |
BGA484,22X22,40 |
.9 V |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2.92 mm |
23 mm |
ALSO OPERATES AT 100 MHZ |
125 MHz |
NOT SPECIFIED |
250 |
23 mm |
CMOS |
3400 mA |
1 V |
Bus Controllers |
I2C; ISA; VGA |
1 mm |
S-PBGA-B484 |
4 |
Not Qualified |
IEEE 1149.6AC; IEEE 1149.1 |
e1 |
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Renesas Electronics |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.46 V |
32 |
GRID ARRAY |
3.14 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1.8 mm |
17 mm |
32 |
50 MHz |
20 |
225 |
17 mm |
CMOS |
3.3 V |
MC68360; MPC860 |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
IEEE 1149.1 |
e0 |
Bus controllers are integrated circuits that are used to manage and control the flow of data and control signals between different devices in a computer system. They are commonly used in systems that have multiple buses, such as a memory bus and an I/O bus. Bus controllers ensure that data is transferred efficiently and correctly between different devices in the system.
One of the primary functions of a bus controller is to manage bus arbitration. Bus arbitration is the process of resolving conflicts that occur when two or more devices on the bus attempt to access the bus at the same time. Bus controllers use various algorithms to determine which device has priority access to the bus and when other devices can access it.
Another important function of bus controllers is to manage the transfer of data and control signals between devices on the bus. This involves controlling the timing and synchronization of signals, as well as error detection and correction. Bus controllers also manage other aspects of the bus, such as interrupt handling and power management.