Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | Width | Data EEPROM Size | Additional Features | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | PWM Channels | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
BGA196,14X14,40 |
.95 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
15 mm |
260 |
15 mm |
CMOS |
2030 mA |
1 V |
I2C, SMBUS, SPI, USB |
1 mm |
S-PBGA-B196 |
3 |
IEEE 1149.1; IEEE 1149.6 |
e1 |
|||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
CMOS |
I2C |
S-PBGA-B324 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
1311 |
SQUARE |
PLASTIC/EPOXY |
YES |
105 Cel |
174000 MBps |
-40 Cel |
BOTTOM |
CMOS |
I2C, PCI, SMBUS, UART |
S-PBGA-B1311 |
|||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
1,3.3 |
GRID ARRAY |
BGA484,22X22,40 |
.9 V |
85 Cel |
32000 MBps |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2.92 mm |
23 mm |
ALSO OPERATES AT 100 MHZ |
0 |
125 MHz |
30 |
245 |
23 mm |
CMOS |
3400 mA |
1 V |
Bus Controllers |
I2C; ISA; VGA |
1 mm |
S-PBGA-B484 |
4 |
Not Qualified |
e1 |
|||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
753 |
SQUARE |
PLASTIC/EPOXY |
YES |
BOTTOM |
CMOS |
I2C, SMBUS, UART |
S-PBGA-B753 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,18X18,40 |
1 V |
85 Cel |
625 MBps |
-40 Cel |
BOTTOM |
1.9 mm |
19 mm |
0 |
100 MHz |
19 mm |
CMOS |
I2C, PCI, SMBUS |
1 mm |
S-PBGA-B324 |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
169 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
32 |
1.5,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA169,13X13,32 |
1.35 V |
70 Cel |
250 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
12 mm |
ALSO OPERATES AT 3.3V SUPPLY |
32 |
125 MHz |
30 |
260 |
12 mm |
CMOS |
1.5 V |
Bus Controllers |
VGA |
.8 mm |
S-PBGA-B169 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
I2C; PCI |
S-PBGA-B676 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
BGA196,14X14,40 |
.95 V |
85 Cel |
.0125 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
15 mm |
260 |
15 mm |
CMOS |
1 V |
I2C |
1 mm |
S-PBGA-B196 |
3 |
e1 |
||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
I2C |
S-PBGA-B676 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
BALL |
176 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
ALSO REQUIRES 3.3 V |
48 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
1.05 V |
PCI |
S-PBGA-B176 |
|||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
.95 V |
85 Cel |
625 MBps |
-40 Cel |
BOTTOM |
1.5 mm |
15 mm |
0 |
100 MHz |
15 mm |
CMOS |
1 V |
I2C, PCI, SMBUS |
1 mm |
S-PBGA-B196 |
||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
160 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
32 |
1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA160,14X14,32 |
1.6 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.58 mm |
12 mm |
32 |
100 MHz |
12 mm |
CMOS |
1.8 V |
Bus Controllers |
I2C, SMBUS |
.8 mm |
S-PBGA-B160 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
.99 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,18X18,40 |
.9 V |
.0125 MBps |
BOTTOM |
2.89 mm |
19 mm |
0 |
100 MHz |
19 mm |
CMOS |
.95 V |
I2C, SPI |
1 mm |
S-PBGA-B324 |
||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
.95 V |
85 Cel |
625 MBps |
-40 Cel |
BOTTOM |
1.5 mm |
15 mm |
0 |
100 MHz |
15 mm |
CMOS |
1 V |
I2C, PCI |
1 mm |
S-PBGA-B196 |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
2 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
70 Cel |
625 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
10 mm |
16 |
19.2 MHz |
10 mm |
CMOS |
200 mA |
1.2 V |
I2C, I2S, SMBUS, SPI, UART, USB |
.8 mm |
S-PBGA-B121 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
650 |
SQUARE |
PLASTIC/EPOXY |
YES |
105 Cel |
174000 MBps |
-40 Cel |
BOTTOM |
CMOS |
I2C, PCI, SMBUS, UART |
S-PBGA-B650 |
||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
2 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
85 Cel |
625 MBps |
-40 Cel |
BOTTOM |
1.2 mm |
10 mm |
32 |
52 MHz |
10 mm |
CMOS |
200 mA |
1.2 V |
I2C, SPI, USB |
.8 mm |
S-PBGA-B121 |
3 |
||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
BALL |
100 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 mm |
6 mm |
26 MHz |
6 mm |
CMOS |
1.2 V |
I2C |
.5 mm |
S-PBGA-B100 |
3 |
e1 |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.14 V |
85 Cel |
1.5 MBps |
-40 Cel |
BOTTOM |
1.2 mm |
10 mm |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
CMOS |
1.2 V |
I2C; VBUS |
.8 mm |
S-PBGA-B121 |
|||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,18X18,40 |
.95 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
19 mm |
260 |
19 mm |
CMOS |
1 V |
I2C; PCI; SMBUS; SPI; USB |
1 mm |
S-PBGA-B324 |
3 |
Not Qualified |
IEEE 1149.1; IEEE 1149.6 |
e1 |
|||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
S-PBGA-B676 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
64 |
1.8,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.6 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
64 |
133 MHz |
17 mm |
CMOS |
1.8 V |
Bus Controllers |
PCI |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
1311 |
SQUARE |
PLASTIC/EPOXY |
YES |
105 Cel |
174000 MBps |
-40 Cel |
BOTTOM |
CMOS |
I2C, PCI, SMBUS, UART |
S-PBGA-B1311 |
||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
1311 |
SQUARE |
PLASTIC/EPOXY |
YES |
105 Cel |
174000 MBps |
-40 Cel |
BOTTOM |
CMOS |
I2C, PCI, SMBUS, UART |
S-PBGA-B1311 |
||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,18X18,40 |
.95 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
19 mm |
19 mm |
CMOS |
1 V |
I2C; PCI; SMBUS; SPI; USB |
1 mm |
S-PBGA-B324 |
3 |
IEEE 1149.1; IEEE 1149.6 |
e1 |
||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
144 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
32 |
1.5,3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA144,13X13,20 |
1.35 V |
70 Cel |
250 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
7 mm |
ALSO OPERATES AT 3.3V SUPPLY |
32 |
125 MHz |
30 |
260 |
7 mm |
CMOS |
1.5 V |
Bus Controllers |
VGA |
.5 mm |
S-PBGA-B144 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
1.35 V |
85 Cel |
250 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
15 mm |
100 MHz |
30 |
260 |
15 mm |
CMOS |
1.5 V |
PCI |
1 mm |
S-PBGA-B196 |
3 |
e1 |
||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,18X18,40 |
.95 V |
85 Cel |
3000 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
19 mm |
260 |
19 mm |
CMOS |
1 V |
I2C; PCI; SMBUS; SPI; USB |
1 mm |
S-PBGA-B324 |
3 |
IEEE 1149.1; IEEE 1149.6 |
e1 |
|||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
1.35 V |
70 Cel |
250 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
15 mm |
100 MHz |
30 |
260 |
15 mm |
CMOS |
1.5 V |
PCI |
1 mm |
S-PBGA-B196 |
3 |
e1 |
||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
753 |
SQUARE |
PLASTIC/EPOXY |
YES |
BOTTOM |
CMOS |
I2C, SMBUS, UART |
S-PBGA-B753 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
257 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
GRID ARRAY |
BGA257(UNSPEC) |
3 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
66 MHz |
30 |
260 |
CMOS |
3.3 V |
VGA |
R-PBGA-B257 |
3 |
e1 |
|||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
1156 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
0 |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
0 |
245 |
CMOS |
I2C |
S-PBGA-B1156 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
BUS CONTROLLER, VME |
COMMERCIAL |
BALL |
313 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
64 |
5 |
GRID ARRAY |
BGA313,25X25,50 |
4.5 V |
70 Cel |
70 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.5 mm |
35 mm |
64 |
33 MHz |
260 |
35 mm |
CMOS |
5 V |
Bus Controllers |
PCI |
2.54 mm |
S-PBGA-B313 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
2 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
85 Cel |
625 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
10 mm |
32 |
19.2 MHz |
10 mm |
CMOS |
200 mA |
1.2 V |
I2C, I2S, SMBUS, SPI, UART, USB |
.8 mm |
S-PBGA-B121 |
3 |
e1 |
|||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCMCIA |
COMMERCIAL |
BALL |
209 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
3 V |
70 Cel |
16.25 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
32 |
33 MHz |
30 |
260 |
16 mm |
CMOS |
3.3 V |
PCI |
.8 mm |
S-PBGA-B209 |
3 |
Not Qualified |
IEEE 1394 |
e1 |
|||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,18X18,40 |
.95 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
19 mm |
260 |
19 mm |
CMOS |
1 V |
I2C; PCI; SMBUS; SPI; USB |
1 mm |
S-PBGA-B324 |
3 |
IEEE 1149.1; IEEE 1149.6 |
e1 |
||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
1156 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
0 |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
0 |
245 |
CMOS |
I2C |
S-PBGA-B1156 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
196 |
SQUARE |
PLASTIC/EPOXY |
YES |
BGA196(UNSPEC) |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
SMBUS |
S-PBGA-B196 |
||||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
85 Cel |
-40 Cel |
BOTTOM |
1.63 mm |
15 mm |
15 mm |
CMOS |
1 mm |
S-PBGA-B196 |
|||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
X86; POWERPC; MIPS; ARM; PCI |
S-PBGA-B196 |
|||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
X86; POWERPC; MIPS; ARM; PCI |
S-PBGA-B196 |
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Renesas Electronics |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
1023 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY |
1.14 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.76 mm |
33 mm |
33.33 MHz |
30 |
260 |
33 mm |
CMOS |
1.2 V |
POWERPC 60X |
1 mm |
S-PBGA-B1023 |
4 |
Not Qualified |
e1 |
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|
Renesas Electronics |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1,3.3 |
GRID ARRAY |
BGA484,22X22,40 |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
250 |
CMOS |
Bus Controllers |
1 mm |
S-PBGA-B484 |
4 |
Not Qualified |
e1 |
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|
Renesas Electronics |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
BGA196,14X14,40 |
.95 V |
85 Cel |
1000 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.85 mm |
15 mm |
100 MHz |
245 |
15 mm |
CMOS |
1734 mA |
1 V |
I2C; PCI; SMBUS |
1 mm |
S-PBGA-B196 |
4 |
e1 |
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|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
BALL |
121 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
0 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
70 Cel |
625 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.7 mm |
10 mm |
0 |
40 MHz |
10 mm |
CMOS |
192 mA |
1.2 V |
I2C, I2S, SPI, UART |
.8 mm |
S-PBGA-B121 |
3 |
e1 |
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Plx Technology |
INDUSTRIAL |
BALL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.5,3.3,3.3/5 |
GRID ARRAY |
BGA144,12X12,40 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
207 mA |
Bus Controllers |
1 mm |
S-PBGA-B144 |
Not Qualified |
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|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
161 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.5,3.3,3.3/5 |
GRID ARRAY |
BGA161,14X14,25 |
85 Cel |
250 MBps |
-40 Cel |
BOTTOM |
66 MHz |
260 |
CMOS |
207 mA |
1.5 V |
Bus Controllers |
.635 mm |
S-PBGA-B161 |
3 |
Not Qualified |
Bus controllers are integrated circuits that are used to manage and control the flow of data and control signals between different devices in a computer system. They are commonly used in systems that have multiple buses, such as a memory bus and an I/O bus. Bus controllers ensure that data is transferred efficiently and correctly between different devices in the system.
One of the primary functions of a bus controller is to manage bus arbitration. Bus arbitration is the process of resolving conflicts that occur when two or more devices on the bus attempt to access the bus at the same time. Bus controllers use various algorithms to determine which device has priority access to the bus and when other devices can access it.
Another important function of bus controllers is to manage the transfer of data and control signals between devices on the bus. This involves controlling the timing and synchronization of signals, as well as error detection and correction. Bus controllers also manage other aspects of the bus, such as interrupt handling and power management.