Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | Width | Data EEPROM Size | Additional Features | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | PWM Channels | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Broadcom |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP160,1.2SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
130 mA |
5 V |
Bus Controllers |
.635 mm |
S-PQFP-G160 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP208,1.2SQ,20 |
70 Cel |
0 Cel |
QUAD |
CMOS |
130 mA |
3.3 V |
Bus Controllers |
.5 mm |
S-PQFP-G208 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
BALL |
304 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY |
BGA304,23X23,50 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
CMOS |
3.3 V |
Bus Controllers |
1.27 mm |
S-PBGA-B304 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||
|
Broadcom |
BALL |
64 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY, FINE PITCH |
BGA64,8X8,20 |
BOTTOM |
3.3 V |
Bus Controllers |
.5 mm |
S-PBGA-B64 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
90 mA |
5 V |
Bus Controllers |
1.27 mm |
S-PQCC-J28 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
BALL |
380 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.8,3.3 |
GRID ARRAY |
BGA380,20X20,50 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
Bus Controllers |
1.27 mm |
S-PBGA-B380 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||
Broadcom |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP64,.47SQ,20 |
QUAD |
3.3 V |
Bus Controllers |
.5 mm |
S-PQFP-G64 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, SCSI |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
5 |
FLATPACK |
QFP160,1.2SQ |
4.75 V |
70 Cel |
40 MBps |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
4.07 mm |
28 mm |
32 |
80 MHz |
28 mm |
CMOS |
130 mA |
5 V |
Bus Controllers |
PCI |
.65 mm |
S-PQFP-G160 |
Not Qualified |
IEEE 1149.1 |
e0 |
|||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
120 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.08 V |
85 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
11 mm |
8 |
260 |
11 mm |
CMOS |
1.2 V |
PCI |
.8 mm |
S-PBGA-B120 |
3 |
IEEE 1284 |
|||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
BALL |
169 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
GRID ARRAY |
BGA169,13X13 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
CMOS |
130 mA |
5 V |
Bus Controllers |
1.5 mm |
S-PBGA-B169 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
80 mA |
5 V |
Bus Controllers |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
484 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
CMOS |
1.2 V |
X-PBGA-B484 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, SCSI |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
FLATPACK, FINE PITCH |
4.75 V |
70 Cel |
40 MBps |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
28 mm |
32 |
80 MHz |
30 |
225 |
28 mm |
CMOS |
5 V |
68030; 68040; 80386 |
.5 mm |
S-PQFP-G208 |
Not Qualified |
e0 |
||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
BALL |
329 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY |
BGA329,23X23,50 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
200 mA |
3.3 V |
Bus Controllers |
1.27 mm |
S-PBGA-B329 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP160,1.2SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
160 mA |
5 V |
Bus Controllers |
.635 mm |
S-PQFP-G160 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
BALL |
456 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.8,3.3 |
GRID ARRAY |
BGA456,26X26,50 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
Bus Controllers |
1.27 mm |
S-PBGA-B456 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, SCSI |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
FLATPACK, FINE PITCH |
4.75 V |
70 Cel |
40 MBps |
0 Cel |
QUAD |
4.07 mm |
28 mm |
32 |
80 MHz |
28 mm |
CMOS |
5 V |
PCI |
.5 mm |
S-PQFP-G208 |
Not Qualified |
IEEE 1149.1 |
|||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
472 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
64 |
GRID ARRAY |
1.14 V |
TIN LEAD |
BOTTOM |
2.5 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
64 |
133 MHz |
30 |
225 |
27 mm |
CMOS |
1.2 V |
1 mm |
S-PBGA-B472 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
160 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
GRID ARRAY |
3 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
1.4 mm |
15 mm |
ALSO REQUIRES TYP 5 V |
32 |
66 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
15 mm |
CMOS |
3.3 V |
1 mm |
S-PBGA-B |
Not Qualified |
e0 |
|||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
380 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.75 V |
64 |
2.5,3.3 |
GRID ARRAY |
BGA380,20X20,50 |
2.25 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.5 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
64 |
133 MHz |
27 mm |
CMOS |
2.5 V |
Bus Controllers |
1.27 mm |
S-PBGA-B380 |
Not Qualified |
e0 |
||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
GULL WING |
208 |
QFP |
SQUARE |
METAL |
YES |
5 |
FLATPACK |
QFP208,1.2SQ,20 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
348 mA |
5 V |
Bus Controllers |
.5 mm |
S-MQFP-G208 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP160,1.2SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
130 mA |
5 V |
Bus Controllers |
.635 mm |
S-PQFP-G160 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
NO LEAD |
64 |
QCCN |
UNSPECIFIED |
UNSPECIFIED |
YES |
3.3 |
CHIP CARRIER |
LCC64(UNSPEC) |
375 MBps |
MATTE TIN |
QUAD |
260 |
CMOS |
3.3 V |
Bus Controllers |
SPI; UART; USB |
3 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||
|
Broadcom |
COMMERCIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
70 Cel |
0 Cel |
QUAD |
35 mA |
3.3 V |
Bus Controllers |
.5 mm |
S-PQFP-G100 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
|
Broadcom |
COMMERCIAL |
BALL |
129 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY, FINE PITCH |
BGA129,13X13,20 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
3.3 V |
Bus Controllers |
.5 mm |
S-PBGA-B129 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, SCSI |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
FLATPACK |
4.75 V |
70 Cel |
40 MBps |
0 Cel |
TIN LEAD |
QUAD |
4.01 mm |
28 mm |
32 |
33.33 MHz |
30 |
225 |
28 mm |
CMOS |
5 V |
PCI |
.65 mm |
S-PQFP-G160 |
Not Qualified |
X3.131 |
e0 |
|||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
1000 MBps |
UNSPECIFIED |
CMOS |
ATA; I2C; UART |
|||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, SCSI |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
FLATPACK |
4.75 V |
70 Cel |
40 MBps |
0 Cel |
TIN LEAD |
QUAD |
4.01 mm |
28 mm |
32 |
80 MHz |
30 |
225 |
28 mm |
CMOS |
5 V |
PCI |
.65 mm |
S-PQFP-G160 |
Not Qualified |
e0 |
||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
OTHER |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
7 mm |
8 |
12.024 MHz |
40 |
260 |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G48 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
GRID ARRAY |
BGA256,20X20,50 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
CMOS |
150 mA |
5 V |
Bus Controllers |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, SCSI |
COMMERCIAL |
BALL |
169 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
5 |
GRID ARRAY |
BGA169,13X13 |
4.75 V |
70 Cel |
40 MBps |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
3.5 mm |
23 mm |
32 |
80 MHz |
23 mm |
CMOS |
130 mA |
5 V |
Bus Controllers |
PCI |
1.5 mm |
S-PBGA-B169 |
Not Qualified |
IEEE 1149.1 |
e0 |
|||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
837 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
1000 MBps |
BOTTOM |
CMOS |
ATA; I2C; UART |
X-PBGA-B837 |
||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
GULL WING |
128 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP128,.63X.87,20 |
70 Cel |
0 Cel |
QUAD |
CMOS |
3.3 V |
Bus Controllers |
.5 mm |
R-PQFP-G128 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, SCSI |
COMMERCIAL |
BALL |
456 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
64 |
1.8,3.3 |
GRID ARRAY |
BGA456,26X26,50 |
1.71 V |
70 Cel |
320 MBps |
0 Cel |
TIN LEAD |
BOTTOM |
2.5 mm |
35 mm |
64 |
133 MHz |
30 |
225 |
35 mm |
CMOS |
1.8 V |
Bus Controllers |
PCI |
1.27 mm |
S-PBGA-B456 |
Not Qualified |
e0 |
|||||||||||||||||||||||
Broadcom |
COMMERCIAL |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP208,1.2SQ,20 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
150 mA |
5 V |
Bus Controllers |
.5 mm |
S-PQFP-G208 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
CMOS |
1.2 V |
PCI |
S-PBGA-B484 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP160,1.2SQ |
70 Cel |
0 Cel |
QUAD |
CMOS |
130 mA |
5 V |
Bus Controllers |
.635 mm |
S-PQFP-G160 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, SCSI |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
FLATPACK, FINE PITCH |
4.75 V |
70 Cel |
40 MBps |
0 Cel |
QUAD |
4.07 mm |
28 mm |
32 |
80 MHz |
28 mm |
CMOS |
5 V |
PCI |
.5 mm |
S-PQFP-G208 |
Not Qualified |
IEEE 1149.1 |
|||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
NO LEAD |
68 |
HQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
2.62 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG |
2.38 V |
70 Cel |
100 MBps |
0 Cel |
MATTE TIN OVER NICKEL |
QUAD |
10 mm |
0 |
25 MHz |
40 |
260 |
10 mm |
CMOS |
2.5 V |
.5 mm |
S-PQCC-N68 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, SCSI |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
32 |
FLATPACK, FINE PITCH |
3.135 V |
70 Cel |
80 MBps |
0 Cel |
QUAD |
4.1 mm |
28 mm |
32 |
160 MHz |
28 mm |
CMOS |
3.3 V |
PCI |
.5 mm |
S-PQFP-G208 |
Not Qualified |
||||||||||||||||||||||||||||||
Broadcom |
OTHER |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP48,.35SQ,20 |
85 Cel |
0 Cel |
QUAD |
CMOS |
30 mA |
3.3 V |
Bus Controllers |
.5 mm |
S-PQFP-G48 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP208,1.2SQ,20 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
3.3 V |
Bus Controllers |
.5 mm |
S-PQFP-G208 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY |
BGA272,20X20,50 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
130 mA |
3.3 V |
Bus Controllers |
1.27 mm |
S-PBGA-B272 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP160,1.2SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
130 mA |
5 V |
Bus Controllers |
.635 mm |
S-PQFP-G160 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, SCSI |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
GRID ARRAY |
4.75 V |
70 Cel |
40 MBps |
0 Cel |
BOTTOM |
2.35 mm |
27 mm |
32 |
80 MHz |
27 mm |
CMOS |
5 V |
PCI |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
IEEE 1149.1 |
|||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, SCSI |
BALL |
636 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
GRID ARRAY |
4000 MBps |
BOTTOM |
2.5 mm |
27 mm |
32 |
27 mm |
CMOS |
1.2 V |
I2C; PCI; UART |
1 mm |
S-PBGA-B636 |
|||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
70 Cel |
0 Cel |
QUAD |
35 mA |
3.3 V |
Bus Controllers |
.5 mm |
S-PQFP-G100 |
Not Qualified |
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Broadcom |
BUS CONTROLLER, SCSI |
BALL |
169 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
16 |
GRID ARRAY |
3.13 V |
70 Cel |
BOTTOM |
3.5 mm |
23 mm |
8 |
40 MHz |
23 mm |
CMOS |
3.3 V |
8067; I2C |
1.27 mm |
S-PBGA-B169 |
Not Qualified |
IEEE 1149.1 |
Bus controllers are integrated circuits that are used to manage and control the flow of data and control signals between different devices in a computer system. They are commonly used in systems that have multiple buses, such as a memory bus and an I/O bus. Bus controllers ensure that data is transferred efficiently and correctly between different devices in the system.
One of the primary functions of a bus controller is to manage bus arbitration. Bus arbitration is the process of resolving conflicts that occur when two or more devices on the bus attempt to access the bus at the same time. Bus controllers use various algorithms to determine which device has priority access to the bus and when other devices can access it.
Another important function of bus controllers is to manage the transfer of data and control signals between devices on the bus. This involves controlling the timing and synchronization of signals, as well as error detection and correction. Bus controllers also manage other aspects of the bus, such as interrupt handling and power management.