Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | Width | Data EEPROM Size | Additional Features | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | PWM Channels | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
I2C |
S-PBGA-B324 |
|||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
312.5 MBps |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
I2C |
S-PBGA-B324 |
|||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
GULL WING |
208 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
32 |
5 |
FLATPACK |
133 MBps |
TIN |
QUAD |
32 |
40 MHz |
260 |
CMOS |
5 V |
Bus Controllers |
I960; MPC850; MPC860; POWERPC 40X |
R-PQFP-G208 |
3 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
312 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
GRID ARRAY, HEAT SINK/SLUG |
.9 V |
85 Cel |
-40 Cel |
BOTTOM |
27 mm |
100 MHz |
27 mm |
CMOS |
1 V |
1 mm |
S-PBGA-B312 |
Not Qualified |
|||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
CMOS |
I2C |
S-PBGA-B676 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
312 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
GRID ARRAY, HEAT SINK/SLUG |
.9 V |
85 Cel |
-40 Cel |
BOTTOM |
27 mm |
100 MHz |
27 mm |
CMOS |
1 V |
1 mm |
S-PBGA-B312 |
Not Qualified |
|||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
680 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
GRID ARRAY, HEAT SINK/SLUG |
.9 V |
85 Cel |
-40 Cel |
BOTTOM |
35 mm |
100 MHz |
35 mm |
CMOS |
1 V |
1 mm |
S-PBGA-B680 |
Not Qualified |
|||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
680 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
.9 V |
85 Cel |
312.5 MBps |
-40 Cel |
BOTTOM |
2.23 mm |
35 mm |
0 |
35 mm |
CMOS |
1 V |
I2C; ISA; SPI; VGA |
1 mm |
S-PBGA-B680 |
||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
312 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
GRID ARRAY, HEAT SINK/SLUG |
.9 V |
85 Cel |
-40 Cel |
BOTTOM |
27 mm |
100 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
27 mm |
CMOS |
1 V |
1 mm |
S-PBGA-B312 |
Not Qualified |
|||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,18X18,40 |
.95 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
19 mm |
19 mm |
CMOS |
1 V |
I2C; ISA; SMBUS; SPI; VGA |
1 mm |
S-PBGA-B324 |
4 |
IEEE 1149.1; IEEE 1149.6 |
e1 |
|||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
0 |
GRID ARRAY |
BGA376,22X22,40 |
BOTTOM |
23 mm |
0 |
23 mm |
CMOS |
I2C |
S-PBGA-B376 |
||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
260 |
CMOS |
I2C |
S-PBGA-B324 |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
1156 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
BGA1156,34X34,40 |
.95 V |
70 Cel |
.0125 MBps |
0 Cel |
BOTTOM |
2.85 mm |
35 mm |
0 |
245 |
35 mm |
CMOS |
1 V |
I2C; SMBUS; SPI; VGA |
1 mm |
S-PBGA-B1156 |
4 |
IEEE 1149.6; IEEE 1149.1 |
|||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
88 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC88,.4SQ,16 |
.95 V |
85 Cel |
625 MBps |
-40 Cel |
QUAD |
.9 mm |
10 mm |
10 mm |
CMOS |
1 V |
8051, PCI, SPI, USB |
.4 mm |
S-XQCC-N88 |
||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
680 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
.9 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
35 mm |
0 |
100 MHz |
35 mm |
CMOS |
1 V |
1 mm |
S-PBGA-B680 |
3 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
GULL WING |
176 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
FLATPACK, FINE PITCH |
QFP176,1.0SQ,20 |
3 V |
85 Cel |
132 MBps |
-40 Cel |
QUAD |
3 mm |
24 mm |
32 |
50 MHz |
24 mm |
CMOS |
200 mA |
3.3 V |
I960; MPC850; MPC860; PPC401 |
.5 mm |
S-PQFP-G176 |
|||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
644 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
I2C |
S-PBGA-B644 |
|||||||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
296 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
ITS ALSO REQUIRES 3.3 V SUPPLY |
CMOS |
I2C |
S-PBGA-B296 |
||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
644 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
I2C |
S-PBGA-B644 |
|||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
680 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
.9 V |
85 Cel |
312.5 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.23 mm |
35 mm |
0 |
260 |
35 mm |
CMOS |
1 V |
I2C; ISA; SPI; VGA |
1 mm |
S-PBGA-B680 |
3 |
e1 |
|||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY |
264 MBps |
TIN LEAD |
BOTTOM |
66 MHz |
CMOS |
2.5 V |
Bus Controllers |
I960; MPC850; MPC860; POWERPC 80X/82X; POWERPC 401 |
S-PBGA-B256 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
296 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
ITS ALSO REQUIRES 3.3 V SUPPLY |
260 |
CMOS |
I2C |
S-PBGA-B296 |
3 |
e1 |
|||||||||||||||||||||||||||||||||||||||
|
Broadcom |
136 |
PLASTIC/EPOXY |
YES |
LCC136(UNSPEC) |
Bus Controllers |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
FLATPACK |
QFP160,1.2SQ |
4.75 V |
85 Cel |
132 MBps |
-40 Cel |
QUAD |
4 mm |
28 mm |
32 |
40 MHz |
28 mm |
CMOS |
130 mA |
5 V |
ISA |
.65 mm |
S-PQFP-G160 |
|||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
BGA196,14X14,40 |
.95 V |
70 Cel |
.0125 MBps |
0 Cel |
BOTTOM |
1.9 mm |
15 mm |
15 mm |
CMOS |
1 V |
I2C |
1 mm |
S-PBGA-B196 |
|||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
BGA196,14X14,40 |
.95 V |
70 Cel |
0 Cel |
BOTTOM |
1.9 mm |
15 mm |
NOT SPECIFIED |
NOT SPECIFIED |
15 mm |
CMOS |
2030 mA |
1 V |
I2C, SMBUS, SPI, USB |
1 mm |
S-PBGA-B196 |
IEEE 1149.1; IEEE 1149.6 |
||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
680 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
GRID ARRAY, HEAT SINK/SLUG |
.9 V |
85 Cel |
-40 Cel |
BOTTOM |
35 mm |
100 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
35 mm |
CMOS |
1 V |
1 mm |
S-PBGA-B680 |
Not Qualified |
||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
88 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC88,.4SQ,16 |
.95 V |
85 Cel |
60.03 MBps |
-40 Cel |
QUAD |
.9 mm |
10 mm |
10 mm |
CMOS |
1 V |
PCI, SPI, USB |
.4 mm |
S-XQCC-N88 |
||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
1156 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
BGA1156,34X34,40 |
.95 V |
70 Cel |
.0125 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.85 mm |
35 mm |
0 |
35 mm |
CMOS |
1 V |
I2C; SMBUS; SPI; USB |
1 mm |
S-PBGA-B1156 |
4 |
IEEE 1149.6; IEEE 1149.1 |
e1 |
||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
CMOS |
I2C |
S-PBGA-B676 |
|||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
1,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
.9 V |
85 Cel |
-40 Cel |
BOTTOM |
1.57 mm |
17 mm |
133 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
CMOS |
1 V |
Bus Controllers |
1 mm |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
CMOS |
I2C |
S-PBGA-B676 |
3 |
e1 |
|||||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
CMOS |
I2C; PCI |
S-PBGA-B676 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
260 |
CMOS |
I2C |
S-PBGA-B676 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BGA324(UNSPEC) |
312.5 MBps |
BOTTOM |
CMOS |
PCI; I2C |
S-PBGA-B324 |
|||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
1156 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
BGA1156,34X34,40 |
.95 V |
70 Cel |
.0125 MBps |
0 Cel |
BOTTOM |
2.85 mm |
35 mm |
0 |
250 MHz |
35 mm |
CMOS |
1 V |
I2C, SMBUS, SPI, USB |
1 mm |
S-PBGA-B1156 |
||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,18X18,40 |
.95 V |
70 Cel |
3000 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
19 mm |
260 |
19 mm |
CMOS |
1 V |
I2C; PCI; SMBUS; SPI; USB |
1 mm |
S-PBGA-B324 |
3 |
IEEE 1149.1; IEEE 1149.6 |
e1 |
|||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
680 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
.95 V |
85 Cel |
312.5 MBps |
-40 Cel |
BOTTOM |
2.23 mm |
35 mm |
0 |
35 mm |
CMOS |
1 V |
1 mm |
S-PBGA-B680 |
|||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
245 |
CMOS |
I2C |
S-PBGA-B676 |
4 |
||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY |
BGA676,26X26,40 |
.95 V |
85 Cel |
.0125 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
27 mm |
0 |
260 |
27 mm |
CMOS |
1 V |
I2C |
1 mm |
S-PBGA-B676 |
3 |
IEEE 1149.6; IEEE 1149.1 |
e1 |
|||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
64 |
GRID ARRAY |
BGA256,16X16,40 |
.9 V |
85 Cel |
1250 MBps |
-40 Cel |
BOTTOM |
1.76 mm |
17 mm |
64 |
133 MHz |
17 mm |
CMOS |
1 V |
PCI, SPI |
1 mm |
S-PBGA-B256 |
||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
OTHER |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,18X18,40 |
.95 V |
85 Cel |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
19 mm |
260 |
19 mm |
CMOS |
1 V |
I2C; PCI; SMBUS; SPI; USB |
1 mm |
S-PBGA-B324 |
3 |
IEEE 1149.1; IEEE 1149.6 |
e1 |
||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
1,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
.9 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.57 mm |
17 mm |
133 MHz |
260 |
17 mm |
CMOS |
1 V |
Bus Controllers |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
S-PBGA-B676 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
64 |
GRID ARRAY |
BGA256,16X16,40 |
.9 V |
85 Cel |
1250 MBps |
-40 Cel |
BOTTOM |
1.76 mm |
17 mm |
64 |
133 MHz |
17 mm |
CMOS |
1 V |
PCI, SPI |
1 mm |
S-PBGA-B256 |
|||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
337 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.7 V |
0 |
GRID ARRAY, FINE PITCH |
2.3 V |
85 Cel |
-40 Cel |
BOTTOM |
2 mm |
21 mm |
0 |
66 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
21 mm |
CMOS |
2.5 V |
PCI |
.5 mm |
S-PBGA-B337 |
Not Qualified |
IEEE 1149.1 |
||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
CMOS |
PCI; I2C |
S-PBGA-B196 |
|||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
I2C |
S-PBGA-B324 |
Bus controllers are integrated circuits that are used to manage and control the flow of data and control signals between different devices in a computer system. They are commonly used in systems that have multiple buses, such as a memory bus and an I/O bus. Bus controllers ensure that data is transferred efficiently and correctly between different devices in the system.
One of the primary functions of a bus controller is to manage bus arbitration. Bus arbitration is the process of resolving conflicts that occur when two or more devices on the bus attempt to access the bus at the same time. Bus controllers use various algorithms to determine which device has priority access to the bus and when other devices can access it.
Another important function of bus controllers is to manage the transfer of data and control signals between devices on the bus. This involves controlling the timing and synchronization of signals, as well as error detection and correction. Bus controllers also manage other aspects of the bus, such as interrupt handling and power management.