Broadcom Bus Controllers 302

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount Maximum Supply Voltage Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family Maximum Data Transfer Rate Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words Width Data EEPROM Size Additional Features Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length RAM Bytes Technology Maximum Supply Current Nominal Supply Voltage PWM Channels Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Drive Interface Standard JESD-609 Code On Chip Program ROM Width No. of I/O Lines

PCI9056-BA66BIG

Broadcom

BUS CONTROLLER, PCI

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

32

2.5,3.3

GRID ARRAY

BGA256,16X16,40

2.3 V

85 Cel

264 MBps

-40 Cel

TIN SILVER COPPER

BOTTOM

1.76 mm

17 mm

ALSO REQUIRES 3.3V I/O SUPPLY

32

66 MHz

260

17 mm

CMOS

180 mA

2.5 V

Bus Controllers

I960; MPC850; MPC860; POWERPC 801; POWERPC 401

1 mm

S-PBGA-B256

3

Not Qualified

e1

PEX8112-AA66BIF

Broadcom

BUS CONTROLLER, PCI

INDUSTRIAL

BALL

144

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

0

1.5,3.3,3.3/5

GRID ARRAY

BGA144,12X12,40

85 Cel

250 MBps

-40 Cel

TIN SILVER COPPER

BOTTOM

0

260

CMOS

207 mA

1.5 V

Bus Controllers

1 mm

R-PBGA-B144

3

Not Qualified

e1

PCI9030-AA60PIF

Broadcom

BUS CONTROLLER, PCI

GULL WING

176

QFP

SQUARE

PLASTIC/EPOXY

YES

32

3.3

FLATPACK

240 MBps

TIN BISMUTH

QUAD

32

60 MHz

260

CMOS

3.3 V

Bus Controllers

PCI

R-PQFP-G176

3

Not Qualified

e6

PEX8311-AA66BCF

Broadcom

BUS CONTROLLER, PCI

COMMERCIAL

BALL

337

FBGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

0

GRID ARRAY, FINE PITCH

2.3 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2 mm

21 mm

0

66 MHz

260

21 mm

CMOS

2.5 V

PCI

.5 mm

S-PBGA-B337

3

Not Qualified

IEEE 1149.1

e1

PCI9054-AC50PIF

Broadcom

BUS CONTROLLER, PCI

INDUSTRIAL

GULL WING

176

FQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

3.3

FLATPACK, FINE PITCH

QFP176,1.0SQ,20

3 V

85 Cel

132 MBps

-40 Cel

TIN BISMUTH

QUAD

3 mm

24 mm

32

50 MHz

260

24 mm

CMOS

200 mA

3.3 V

Bus Controllers

I960; MPC850; MPC860; PPC401

.5 mm

S-PQFP-G176

3

Not Qualified

e6

PCI9052G

Broadcom

BUS CONTROLLER, PCI

INDUSTRIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

32

FLATPACK

QFP160,1.2SQ

4.75 V

85 Cel

132 MBps

-40 Cel

TIN

QUAD

4 mm

28 mm

32

40 MHz

260

28 mm

CMOS

130 mA

5 V

ISA

.65 mm

S-PQFP-G160

3

Not Qualified

e3

PCI9656-BA66BIG

Broadcom

BUS CONTROLLER, PCI

INDUSTRIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

64

2.5,3.3

GRID ARRAY

BGA272,20X20,50

2.3 V

85 Cel

528 MBps

-40 Cel

TIN SILVER COPPER

BOTTOM

2.26 mm

27 mm

ALSO REQUIRES 3.3V I/O SUPPLY

64

66 MHz

260

27 mm

CMOS

185 mA

2.5 V

Bus Controllers

I960; MPC850; MPC860; POWERPC 80X/82X; POWERPC 401

1.27 mm

S-PBGA-B272

3

Not Qualified

e1

PEX8606-BA50BIG

Broadcom

BUS CONTROLLER, PCI

INDUSTRIAL

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

BGA196,14X14,40

.95 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.9 mm

15 mm

260

15 mm

CMOS

2030 mA

1 V

I2C, SMBUS, SPI, USB

1 mm

S-PBGA-B196

3

IEEE 1149.1; IEEE 1149.6

e1

PEX8718-AB80BIG

Broadcom

BUS CONTROLLER, PCI

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

TIN SILVER COPPER

BOTTOM

CMOS

I2C

S-PBGA-B324

4

e1

PCI9030-AA60BIF

Broadcom

BUS CONTROLLER, PCI

BALL

180

BGA

SQUARE

PLASTIC/EPOXY

YES

32

3.3

GRID ARRAY

240 MBps

TIN SILVER COPPER

BOTTOM

32

60 MHz

260

CMOS

3.3 V

Bus Controllers

PCI

R-PBGA-B180

2A

Not Qualified

e1

SS02-0B00-00

Broadcom

BUS CONTROLLER, PCI

UNSPECIFIED

UNSPECIFIED

UNSPECIFIED

70 Cel

0 Cel

UNSPECIFIED

CMOS

PCI

X-XXSS-X

NET2272REV1A-LF

Broadcom

BUS CONTROLLER, UNIVERSAL SERIAL BUS

OTHER

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

2.6 V

5

2.5,3.3

FLATPACK, LOW PROFILE, FINE PITCH

TQFP64,.47SQ

2.2 V

85 Cel

0 Cel

QUAD

1.27 mm

10 mm

ALSO REQUIRES 3.3V SUPPLY

16

30 MHz

260

10 mm

CMOS

2.5 V

Bus Controllers

.5 mm

S-PQFP-G64

4

Not Qualified

PEX8714-AB80BIG

Broadcom

BUS CONTROLLER, PCI

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

TIN SILVER COPPER

BOTTOM

245

CMOS

I2C

S-PBGA-B324

4

e1

PEX8734-AB80BIG

Broadcom

BUS CONTROLLER, PCI

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

TIN SILVER COPPER

BOTTOM

245

CMOS

I2C

S-PBGA-B676

4

e1

PEX8724-CA80BCG

Broadcom

BUS CONTROLLER, PCI

COMMERCIAL

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BGA324,18X18,40

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.48 mm

19 mm

245

19 mm

CMOS

1 mm

S-PBGA-B324

4

e1

SS02-0B00-02

Broadcom

BUS CONTROLLER, PCI

UNSPECIFIED

UNSPECIFIED

UNSPECIFIED

70 Cel

0 Cel

UNSPECIFIED

CMOS

PCI

X-XXSS-X

PEX8619-BA50BIG

Broadcom

BUS CONTROLLER, PCI

INDUSTRIAL

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, HEAT SINK/SLUG

BGA324,18X18,40

.95 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.9 mm

19 mm

260

19 mm

CMOS

1 V

I2C; PCI; SMBUS; SPI; USB

1 mm

S-PBGA-B324

3

Not Qualified

IEEE 1149.1; IEEE 1149.6

e1

PEX8114-BD13BIG

Broadcom

BUS CONTROLLER, PCI

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

0

1,3.3

GRID ARRAY

BGA256,16X16,40

.9 V

85 Cel

312.5 MBps

-40 Cel

TIN SILVER COPPER

BOTTOM

1.76 mm

17 mm

0

260

17 mm

CMOS

1 V

Bus Controllers

ISA; SPI; VGA

1 mm

S-PBGA-B256

3

Not Qualified

e1

PEX8604-BA50BIG

Broadcom

BUS CONTROLLER, PCI

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

TIN SILVER COPPER

BOTTOM

260

CMOS

I2C

S-PBGA-B196

3

e1

PEX8608-BA50BCG

Broadcom

BUS CONTROLLER, PCI

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

GRID ARRAY

BGA196,14X14,40

.95 V

85 Cel

.0125 MBps

-10 Cel

TIN SILVER COPPER

BOTTOM

1.9 mm

15 mm

0

100 MHz

260

15 mm

CMOS

1 V

I2C, PCI, SMBUS

1 mm

S-PBGA-B196

3

e1

PEX8725-CA80BCG

Broadcom

BUS CONTROLLER, PCI

BALL

324

SQUARE

PLASTIC/EPOXY

YES

TIN SILVER COPPER

BOTTOM

245

CMOS

I2C, PCI

S-PBGA-B324

4

e1

PEX8618-BA50BCG

Broadcom

BUS CONTROLLER, PCI

COMMERCIAL

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, HEAT SINK/SLUG

BGA324,18X18,40

.95 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.9 mm

19 mm

260

19 mm

CMOS

1 V

I2C; PCI; SMBUS; SPI; USB

1 mm

S-PBGA-B324

3

IEEE 1149.1; IEEE 1149.6

e1

PEX8604-BA50BCG

Broadcom

BUS CONTROLLER, PCI

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

BGA196,14X14,40

.95 V

.1 MBps

TIN SILVER COPPER

BOTTOM

1.9 mm

15 mm

260

15 mm

CMOS

1 V

I2C

1 mm

S-PBGA-B196

3

e1

PCI9656-BA66BI

Broadcom

BUS CONTROLLER, PCI

INDUSTRIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

64

2.5,3.3

GRID ARRAY

BGA272,20X20,50

2.3 V

85 Cel

528 MBps

-40 Cel

TIN LEAD

BOTTOM

2.26 mm

27 mm

ALSO REQUIRES 3.3V I/O SUPPLY

64

66 MHz

260

27 mm

CMOS

185 mA

2.5 V

Bus Controllers

I960; MPC850; MPC860; POWERPC 80X/82X; POWERPC 401

1.27 mm

S-PBGA-B272

3

Not Qualified

e0

PEX8606-BA50BCG

Broadcom

BUS CONTROLLER, PCI

COMMERCIAL

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

BGA196,14X14,40

.95 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.9 mm

15 mm

260

15 mm

CMOS

2030 mA

1 V

I2C, SMBUS, SPI, USB

1 mm

S-PBGA-B196

3

IEEE 1149.1; IEEE 1149.6

e1

PEX8624-BB50RBIG

Broadcom

BUS CONTROLLER, PCI

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

TIN SILVER COPPER

BOTTOM

CMOS

I2C

S-PBGA-B324

4

e1

PEX8605-AB50NIG

Broadcom

BUS CONTROLLER, PCI

GULL WING

136

QFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK

QUAD

CMOS

I2C

S-PQFP-G136

3

PEX8648-BB50RBIG

Broadcom

BUS CONTROLLER, PCI

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

TIN SILVER COPPER

BOTTOM

245

CMOS

I2C; PCI

S-PBGA-B676

4

e1

PEX8609-BA50BIG

Broadcom

BUS CONTROLLER, PCI

INDUSTRIAL

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

BGA196,14X14,40

.95 V

85 Cel

.0125 MBps

-40 Cel

TIN SILVER COPPER

BOTTOM

1.9 mm

15 mm

260

15 mm

CMOS

1 V

I2C

1 mm

S-PBGA-B196

3

e1

PEX8750-AB80BIG

Broadcom

BUS CONTROLLER, PCI

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

TIN SILVER COPPER

BOTTOM

245

CMOS

I2C

S-PBGA-B676

4

e1

SS06-0B00-02

Broadcom

BUS CONTROLLER, PCI

UNSPECIFIED

UNSPECIFIED

UNSPECIFIED

70 Cel

0 Cel

UNSPECIFIED

CMOS

PCI

X-XXSS-X

PEX8603-AB50NIG

Broadcom

BUS CONTROLLER, PCI

INDUSTRIAL

NO LEAD

136

HVQCCN

SQUARE

UNSPECIFIED

YES

1.1 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC136(UNSPEC)

.95 V

85 Cel

-40 Cel

TIN

QUAD

.85 mm

10 mm

0

260

10 mm

CMOS

1 V

Bus Controllers

I2C; ISA; SMBUS; SPI; VGA

.5 mm

S-XQCC-N136

3

Not Qualified

e3

PEX8619-BA50BCG

Broadcom

BUS CONTROLLER, PCI

COMMERCIAL

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, HEAT SINK/SLUG

BGA324,18X18,40

.95 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.9 mm

19 mm

260

19 mm

CMOS

1 V

I2C; PCI; SMBUS; SPI; USB

1 mm

S-PBGA-B324

3

Not Qualified

IEEE 1149.1; IEEE 1149.6

e1

PEX8733-CA80BCG

Broadcom

BUS CONTROLLER, PCI

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

TIN SILVER COPPER

BOTTOM

245

CMOS

S-PBGA-B676

4

e1

SS06-0B00-00

Broadcom

BUS CONTROLLER, PCI

UNSPECIFIED

UNSPECIFIED

UNSPECIFIED

70 Cel

0 Cel

UNSPECIFIED

CMOS

PCI

X-XXSS-X

USB3382-AB50NIG

Broadcom

BUS CONTROLLER, UNIVERSAL SERIAL BUS

INDUSTRIAL

NO LEAD

136

HVQCCN

SQUARE

UNSPECIFIED

YES

1.1 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC136,.4SQ.20

.95 V

85 Cel

625 MBps

-40 Cel

QUAD

.85 mm

10 mm

260

10 mm

CMOS

1 V

8051, I2C, PCI, SPI, USB

.5 mm

S-XQCC-N136

3

PEX8618-BA50BC

Broadcom

BUS CONTROLLER, PCI

COMMERCIAL

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, HEAT SINK/SLUG

BGA324,18X18,40

.95 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.9 mm

19 mm

19 mm

CMOS

1 V

I2C; PCI; SMBUS; SPI; USB

1 mm

S-PBGA-B324

3

IEEE 1149.1; IEEE 1149.6

e1

USB2380-AB25NIG

Broadcom

BUS CONTROLLER, UNIVERSAL SERIAL BUS

INDUSTRIAL

NO LEAD

88

HVQCCN

SQUARE

UNSPECIFIED

YES

1.1 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC88,.4SQ,16

.95 V

85 Cel

60.03 MBps

-40 Cel

QUAD

.9 mm

10 mm

260

10 mm

CMOS

1 V

PCI, SPI, USB

.4 mm

S-XQCC-N88

3

PEX8615-BA50BIG

Broadcom

BUS CONTROLLER, PCI

INDUSTRIAL

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, HEAT SINK/SLUG

BGA324,18X18,40

.95 V

85 Cel

3000 MBps

-40 Cel

TIN SILVER COPPER

BOTTOM

1.9 mm

19 mm

260

19 mm

CMOS

1 V

I2C; PCI; SMBUS; SPI; USB

1 mm

S-PBGA-B324

3

IEEE 1149.1; IEEE 1149.6

e1

PEX8764-AB80BIG

Broadcom

BUS CONTROLLER, PCI

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

0

GRID ARRAY

TIN SILVER COPPER

BOTTOM

0

245

CMOS

I2C

S-PBGA-B1156

4

e1

PEX8613-BA50BCG

Broadcom

BUS CONTROLLER, PCI

COMMERCIAL

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, HEAT SINK/SLUG

BGA324,18X18,40

.95 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.9 mm

19 mm

260

19 mm

CMOS

1 V

I2C; PCI; SMBUS; SPI; USB

1 mm

S-PBGA-B324

3

IEEE 1149.1; IEEE 1149.6

e1

PEX8796-AB80BIG

Broadcom

BUS CONTROLLER, PCI

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

0

GRID ARRAY

TIN SILVER COPPER

BOTTOM

0

245

CMOS

I2C

S-PBGA-B1156

4

e1

USB3380-AB50NIG

Broadcom

BUS CONTROLLER, UNIVERSAL SERIAL BUS

INDUSTRIAL

NO LEAD

88

HVQCCN

SQUARE

UNSPECIFIED

YES

1.1 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC88,.4SQ,16

.95 V

85 Cel

625 MBps

-40 Cel

QUAD

.9 mm

10 mm

260

10 mm

CMOS

1 V

8051, PCI, SPI, USB

.4 mm

S-XQCC-N88

3

PEX8112-AA66FBIF

Broadcom

BUS CONTROLLER, PCI

INDUSTRIAL

BALL

161

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3,3.3/5

GRID ARRAY

BGA161,14X14,25

85 Cel

250 MBps

-40 Cel

BOTTOM

66 MHz

260

CMOS

207 mA

1.5 V

Bus Controllers

.635 mm

S-PBGA-B161

3

Not Qualified

PEX8604-BA50BC

Broadcom

BUS CONTROLLER, PCI

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

NOT SPECIFIED

NOT SPECIFIED

CMOS

I2C

S-PBGA-B196

PEX8608-BA50BC

Broadcom

BUS CONTROLLER, PCI

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

GRID ARRAY

BGA196,14X14,40

.95 V

85 Cel

.0125 MBps

-10 Cel

TIN SILVER COPPER

BOTTOM

1.9 mm

15 mm

0

100 MHz

15 mm

CMOS

1 V

I2C, PCI, SMBUS

1 mm

S-PBGA-B196

3

e1

PEX8619-BA50BC

Broadcom

BUS CONTROLLER, PCI

COMMERCIAL

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, HEAT SINK/SLUG

BGA324,18X18,40

.95 V

70 Cel

0 Cel

BOTTOM

1.9 mm

19 mm

19 mm

CMOS

1 V

I2C; PCI; SMBUS; SPI; USB

1 mm

S-PBGA-B324

IEEE 1149.1; IEEE 1149.6

PEX8624-BB50RBCG

Broadcom

BUS CONTROLLER, PCI

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

312.5 MBps

TIN SILVER COPPER

BOTTOM

245

CMOS

I2C

S-PBGA-B324

4

e1

Bus Controllers

Bus controllers are integrated circuits that are used to manage and control the flow of data and control signals between different devices in a computer system. They are commonly used in systems that have multiple buses, such as a memory bus and an I/O bus. Bus controllers ensure that data is transferred efficiently and correctly between different devices in the system.

One of the primary functions of a bus controller is to manage bus arbitration. Bus arbitration is the process of resolving conflicts that occur when two or more devices on the bus attempt to access the bus at the same time. Bus controllers use various algorithms to determine which device has priority access to the bus and when other devices can access it.

Another important function of bus controllers is to manage the transfer of data and control signals between devices on the bus. This involves controlling the timing and synchronization of signals, as well as error detection and correction. Bus controllers also manage other aspects of the bus, such as interrupt handling and power management.