532 Digital Signal Processors (DSPs) 347

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

TMX320C6415TGLZ1

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

TIN LEAD

BOTTOM

3.3 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

100 MHz

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

V62/05607-03XE

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.16 V

4

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

100 MHz

MULTIPLE

23 mm

3

CMOS

1.2 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMX320C6415TGLZ

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

90 Cel

0 Cel

BOTTOM

3.3 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

100 MHz

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

NO

NO

TMX32C6415EGLZA5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.31 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.19 V

BOTTOM

3.3 mm

16384

23 mm

YES

64

75.19 MHz

MULTIPLE

23 mm

CMOS

1.25 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMX320C6416TGLZ6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.16 V

23

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.05 V

BOTTOM

3.3 mm

262144

23 mm

YES

64

100 MHz

MULTIPLE

23 mm

CMOS

1.1 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMX32C6415EGLZ7E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

23

32

1.4,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.36 V

BOTTOM

3.3 mm

16384

23 mm

YES

64

75.18 MHz

MULTIPLE

23 mm

CMOS

1.4 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMX320C6416TGLZ1

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.16 V

90 Cel

0 Cel

BOTTOM

3.3 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.18 MHz

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMX320C6415TGLZ6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.16 V

23

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.05 V

BOTTOM

3.3 mm

262144

23 mm

YES

64

100 MHz

MULTIPLE

23 mm

CMOS

1.1 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMX320C6415TGLZ7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

BOTTOM

3.3 mm

262144

23 mm

YES

64

100 MHz

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

V62/04609-04XA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.31 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.19 V

105 Cel

-40 Cel

TIN LEAD

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

33 MHz

20

220

MULTIPLE

23 mm

CMOS

1.25 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMX3C6414EGLZA6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

23

GRID ARRAY, FINE PITCH

1.36 V

BOTTOM

3.3 mm

23 mm

YES

64

75.75 MHz

MULTIPLE

23 mm

CMOS

1.4 V

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMX32C6416EGLZ7E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

23

32

1.4,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.36 V

BOTTOM

3.3 mm

16384

23 mm

YES

64

75.18 MHz

MULTIPLE

23 mm

CMOS

1.4 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

V62/04609-03XE

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.31 V

23

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.19 V

105 Cel

4

-40 Cel

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.19 MHz

MULTIPLE

23 mm

3

CMOS

1.25 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMX320C6414TGLZ1

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

90 Cel

0 Cel

BOTTOM

3.25 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

V62/04609-02XE

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.31 V

23

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.19 V

105 Cel

4

-40 Cel

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.19 MHz

MULTIPLE

23 mm

3

CMOS

1.25 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

V62/04609-05XA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.31 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.19 V

105 Cel

4

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

33 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.25 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMX32C6414EGLZ6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

23

32

1.4,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.36 V

BOTTOM

3.3 mm

16384

23 mm

YES

64

75.18 MHz

MULTIPLE

23 mm

CMOS

1.4 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

V62/04609-08XA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.31 V

23

32

GRID ARRAY, FINE PITCH

1.19 V

105 Cel

4

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

33 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.25 V

64

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

V62/04609-06XA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.31 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.19 V

105 Cel

-40 Cel

TIN LEAD

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

33 MHz

20

220

MULTIPLE

23 mm

CMOS

1.25 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMX320C6414TGLZ7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

BOTTOM

3.3 mm

262144

23 mm

YES

64

100 MHz

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMX32C6416EGLZ6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

23

32

1.4,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.36 V

BOTTOM

3.3 mm

16384

23 mm

YES

64

75.18 MHz

MULTIPLE

23 mm

CMOS

1.4 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6416EGLZ6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

23

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

1.36 V

BOTTOM

3.3 mm

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.75 MHz

MULTIPLE

23 mm

CMOS

1.4 V

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6415TBZLZW7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

260

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

e1

TMS32C6416CGLZ5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.14 V

90 Cel

0 Cel

BOTTOM

3.3 mm

16384

23 mm

YES

64

75.19 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6414CGLZ5E0

Texas Instruments

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

16384

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS32C6414ECLZA6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.4,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

4096

NOT SPECIFIED

NOT SPECIFIED

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS320C6414EGLZW5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

23

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

1.14 V

BOTTOM

3.3 mm

23 mm

YES

64

75.19 MHz

MULTIPLE

23 mm

CMOS

1.2 V

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6415TGLZ8

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

90 Cel

0 Cel

BOTTOM

3.25 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS32C6416DZLZA5E0

Texas Instruments

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

16384

CMOS

125 mA

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS32C6414EZLZ6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

90 Cel

4

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

260

MULTIPLE

23 mm

3

CMOS

125 mA

1.4 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS32C6416ECLZ5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

4096

NOT SPECIFIED

NOT SPECIFIED

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS320C6414TZLZA7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

105 Cel

-40 Cel

BOTTOM

3.25 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6415TBGLZA6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.16 V

23

32

1.1,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.05 V

105 Cel

-40 Cel

BOTTOM

3.3 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.18 MHz

MULTIPLE

23 mm

CMOS

1.1 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS32C6415EGLZA6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

105 Cel

4

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

125 mA

1.4 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS32C6416ECLZA5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.25,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

4096

NOT SPECIFIED

NOT SPECIFIED

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS320C6415TBZLZA6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.16 V

23

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.05 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.25 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

30

260

MULTIPLE

23 mm

CMOS

1.1 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS32C6415EZLZ7E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

90 Cel

4

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

260

MULTIPLE

23 mm

3

CMOS

125 mA

1.4 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS32C6414TBCLZWA8

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

TIN SILVER COPPER

BOTTOM

4096

30

260

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

e1

TMS320C6416TGLZ7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

105 Cel

-40 Cel

BOTTOM

3.25 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6415TGLZA7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.16 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.05 V

105 Cel

-40 Cel

BOTTOM

3.25 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.1 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320TCI100BGLZA6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.16 V

23

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.05 V

105 Cel

-40 Cel

TIN LEAD

BOTTOM

3.3 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.19 MHz

MULTIPLE

23 mm

CMOS

1.1 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

e0

TMS32C6415DGLZK5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

4096

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS320C6416GLZ600

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

BOTTOM

3.3 mm

23 mm

0 TO 90 OPERATING CASE TEMPERATURE

YES

32

75.18 MHz

MULTIPLE

23 mm

CMOS

1.4 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6415EZLZ6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

23

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

1.36 V

BOTTOM

3.3 mm

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.75 MHz

MULTIPLE

23 mm

CMOS

1.4 V

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6411GLZ

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

23

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.14 V

TIN LEAD

BOTTOM

3.3 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

75.19 MHz

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS320C6415TGLZA8

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

105 Cel

-40 Cel

BOTTOM

3.25 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS32C6415ECLZ5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

4096

NOT SPECIFIED

NOT SPECIFIED

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS32C6414CGLZ6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

90 Cel

0 Cel

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.4 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.