532 Digital Signal Processors (DSPs) 347

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

TMS320C6411ACLZ

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

20

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.14 V

BOTTOM

3.25 mm

65536

23 mm

IT ALSO REQUIRES 3.3V I/O SUPPLY

YES

32

75.75 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

NO

NO

TMS320C6414TBGLZ6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.16 V

23

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.05 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.25 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.1 V

64

Digital Signal Processors

FLASH

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

8

TMS320C6415TGLZ6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

90 Cel

0 Cel

BOTTOM

3.25 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

SM32C6416TGLZA8EP

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

105 Cel

-40 Cel

BOTTOM

3.25 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

100 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6415EZLZ5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

23

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

1.14 V

BOTTOM

3.3 mm

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.75 MHz

MULTIPLE

23 mm

CMOS

1.2 V

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS32C6414DZLZA5E0

Texas Instruments

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

16384

CMOS

125 mA

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS320C6415TBZLZ8

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.16 V

90 Cel

0 Cel

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.18 MHz

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS32C6415DGLZ6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

23

32

1.4,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.36 V

TIN LEAD

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.75 MHz

MULTIPLE

23 mm

CMOS

1.4 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS32C6414EZLZ5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.14 V

90 Cel

4

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

260

MULTIPLE

23 mm

3

CMOS

125 mA

1.2 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS320C6415CGLZ6E3

Texas Instruments

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.4,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

16384

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS32C6416EGLZ5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.14 V

TIN LEAD

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

20

220

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS320C6416CGLZ5E0

Texas Instruments

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

16384

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS320C6416TZLZ8

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

90 Cel

0 Cel

BOTTOM

3.25 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS32C6416EZLZA6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

105 Cel

4

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

260

MULTIPLE

23 mm

3

CMOS

125 mA

1.4 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS32C6415CGLZ5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.14 V

90 Cel

0 Cel

BOTTOM

3.3 mm

16384

23 mm

YES

64

75.19 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6414TBZLZ1

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.25 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

30

260

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS320TCI100BQGLZ

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

20

GRID ARRAY, FINE PITCH

1.16 V

90 Cel

0 Cel

TIN LEAD

BOTTOM

3.3 mm

23 mm

ALSO REQUIRES 3.3V SUPPLY FOR I/O

YES

64

850 MHz

20

220

MULTIPLE

23 mm

CMOS

1.2 V

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS32C6416DGLZ7E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

23

32

1.4,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.36 V

TIN LEAD

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.19 MHz

MULTIPLE

23 mm

CMOS

1.4 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS320C6411CLZ

Texas Instruments

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

262144

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS32C6416EZLZ7E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

TIN SILVER COPPER

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

30

260

MULTIPLE

23 mm

CMOS

125 mA

1.4 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

SM32C6416DGLZ50AEP

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.31 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.19 V

105 Cel

-40 Cel

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

33 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.25 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320TCI100BZLZA6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.16 V

23

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.05 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.19 MHz

30

260

MULTIPLE

23 mm

CMOS

1.1 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS32C6414EZLZ7E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

90 Cel

4

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

260

MULTIPLE

23 mm

3

CMOS

125 mA

1.4 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS320TCI100BGLZ6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.16 V

23

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.05 V

90 Cel

0 Cel

BOTTOM

3.3 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.19 MHz

20

220

MULTIPLE

23 mm

CMOS

1.1 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

TMS320C6414TGLZA7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

105 Cel

-40 Cel

BOTTOM

3.25 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6415TZLZ8

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.16 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.05 V

90 Cel

0 Cel

BOTTOM

3.25 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.1 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6411EGLZ

Texas Instruments

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

16384

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS32C6414EGLZ5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.14 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.2 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS320TCI100BZLZ7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.19 MHz

30

260

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS32C6416DGLZK5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

4096

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS32C6414EZLZA5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.31 V

32

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.19 V

105 Cel

4

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

260

MULTIPLE

23 mm

3

CMOS

125 mA

1.25 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS320C6414TBGLZA7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.24 V

23

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

105 Cel

4

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.25 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.2 V

64

Digital Signal Processors

FLASH

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

8

TMS32C6414DGLZK7E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.4,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

4096

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS320C6414EZLZA6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

23

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

1.36 V

BOTTOM

3.3 mm

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.75 MHz

MULTIPLE

23 mm

CMOS

1.4 V

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320TCI100QGLZA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

20

GRID ARRAY, FINE PITCH

1.16 V

105 Cel

-40 Cel

TIN LEAD

BOTTOM

3.3 mm

23 mm

ALSO REQUIRES 3.3V SUPPLY FOR I/O

YES

64

850 MHz

MULTIPLE

23 mm

CMOS

1.2 V

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS320C6416TBGLZA6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.16 V

23

32

1.1,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.05 V

105 Cel

4

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.1 V

64

Digital Signal Processors

FLASH

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

8

TMS32C6415EZLZA5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.31 V

32

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.19 V

105 Cel

4

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

260

MULTIPLE

23 mm

3

CMOS

125 mA

1.25 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS320C6416EGLZA5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.31 V

23

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

1.19 V

BOTTOM

3.3 mm

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.75 MHz

MULTIPLE

23 mm

CMOS

1.25 V

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6416TGLZ8

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

90 Cel

0 Cel

BOTTOM

3.25 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS32C6415EGLZ5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.14 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.2 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS320C6414TGLZ6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.16 V

23

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.05 V

90 Cel

0 Cel

BOTTOM

3.25 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.1 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6415TBZLZA8

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.25 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

30

260

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS320C6414GLZ400

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

32

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

1.16 V

BOTTOM

3.3 mm

23 mm

0 TO 90 OPERATING CASE TEMPERATURE

YES

32

75.18 MHz

MULTIPLE

23 mm

CMOS

1.2 V

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6415EZLZ7E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

23

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

1.36 V

BOTTOM

3.3 mm

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.75 MHz

MULTIPLE

23 mm

CMOS

1.4 V

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6411GLZ300

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

.95 V

BOTTOM

3.3 mm

262144

23 mm

YES

32

300 MHz

MULTIPLE

23 mm

CMOS

1 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6414EZLZA5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.31 V

23

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

1.19 V

BOTTOM

3.3 mm

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.75 MHz

MULTIPLE

23 mm

CMOS

1.25 V

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS32C6415DGLZA6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

TIN LEAD

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

MULTIPLE

23 mm

CMOS

1.4 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS320C6416EGLZA6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

23

32

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

1.36 V

BOTTOM

3.3 mm

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.75 MHz

MULTIPLE

23 mm

CMOS

1.4 V

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.