532 Digital Signal Processors (DSPs) 347

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
SM32C6416EGLZ50AEP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V	23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.19 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	33 MHz	20	220	MULTIPLE	23 mm		CMOS		1.25 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS32C6416ECLZA6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES			32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32						BOTTOM		4096						NOT SPECIFIED	NOT SPECIFIED				CMOS				Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified
TMS3C6415DGLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V	23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.19 V	105 Cel		-40 Cel		BOTTOM	3.3 mm	16384	23 mm		YES	64	75 MHz			MULTIPLE	23 mm		CMOS		1.25 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6414EZLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6416TZLZA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel		BOTTOM	3.25 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6411GLZA300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V	23			GRID ARRAY, FINE PITCH		.95 V					BOTTOM	3.3 mm		23 mm		YES	32	300 MHz			MULTIPLE	23 mm		CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS32C6416DZLZ5E0	Texas Instruments			BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32						BOTTOM		16384											CMOS	125 mA			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified
SM32C6414EGLZ50AEP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V	23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.19 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	33 MHz	20	220	MULTIPLE	23 mm		CMOS		1.25 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6416TBCLZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V	20	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	4096	23 mm		YES	64	75 MHz	30	260	MULTIPLE	23 mm	3	CMOS		1.2 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1	8
TMS320TCI100BZLZA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	30	260	MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS320C6414TBCLZW8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32					TIN SILVER COPPER	BOTTOM		4096						30	260				CMOS				Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified			e1
TMS32C6414DZLZ7E3	Texas Instruments			BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES			32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32						BOTTOM		16384											CMOS	125 mA			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified
TMS32C6416EGLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.31 V	32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.19 V	105 Cel	4	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3	CMOS	125 mA	1.25 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320TCI100BCLZA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	30	260	MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS320C6414GLZ600	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	32			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	0 TO 90 OPERATING CASE TEMPERATURE	YES	32	75.18 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6416EGLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320TCI100QZLZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	20			GRID ARRAY, FINE PITCH		1.16 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY FOR I/O	YES	64	850 MHz	30	260	MULTIPLE	23 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS32C6415DZLZ7E3	Texas Instruments			BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES			32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32						BOTTOM		16384											CMOS	125 mA			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified
TMS32C6414DGLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6414EZLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6415EGLZA6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS32C6416EGLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel	4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3	CMOS		1.4 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS32C6415DZLZ6E3	Texas Instruments			BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES			32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32						BOTTOM		16384											CMOS	125 mA			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified
TMS320C6414TGLZA8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel		BOTTOM	3.25 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS32C6414EGLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel	4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3	CMOS		1.4 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6415CGLZ5E0	Texas Instruments			BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32						BOTTOM		16384											CMOS				Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified
TMS320C6411ZLZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	23	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V					BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75.75 MHz			MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6415GLZ600	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V					BOTTOM	3.3 mm	16384	23 mm	0 TO 90 OPERATING CASE TEMPERATURE	YES	32	75.18 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6415TBZLZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	30	260	MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS32C6414EZLZA6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	105 Cel	4	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3	CMOS	125 mA	1.4 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS320C6416TBZLZA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	30	260	MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS32C6415DGLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS32C6415CGLZW6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	23	32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.36 V					BOTTOM	3.3 mm	4096	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6415TBGLZA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	23	32	1.1,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel		BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6415EGLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
SM32C6416TBGLZI1EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V	32	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	85 Cel	4	-40 Cel	TIN LEAD	BOTTOM	3.25 mm	4096	23 mm		YES	32	100 MHz	20	220	MULTIPLE	23 mm	3	CMOS		1.2 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS32C6415ECLZA6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES			32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32						BOTTOM		4096						NOT SPECIFIED	NOT SPECIFIED				CMOS				Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified
TMS320C6411GLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V	32			GRID ARRAY, FINE PITCH		.95 V					BOTTOM	3.3 mm		23 mm		YES	32	75.18 MHz			MULTIPLE	23 mm		CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6416TBZLZA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V	23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	30	260	MULTIPLE	23 mm		CMOS		1.1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS320TCI100QZLZA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	20			GRID ARRAY, FINE PITCH		1.16 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY FOR I/O	YES	64	850 MHz	30	260	MULTIPLE	23 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS32C6416DGLZA6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	23	32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.36 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6416TGLZA8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel		BOTTOM	3.25 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6416EGLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.14 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS32C6415CGLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel		0 Cel		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS32C6416DGLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V	32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.19 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	20	220	MULTIPLE	23 mm		CMOS		1.25 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6414TBZLZ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V	23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.05 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	30	260	MULTIPLE	23 mm		CMOS		1.1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS320C6415TBZLZ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	30	260	MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS320C6414TZLZA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V	23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.05 V	105 Cel		-40 Cel		BOTTOM	3.25 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm		CMOS		1.1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.