BGA Digital Signal Processors (DSPs) 787

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-21060KB-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	5.25 V		32	32	5	GRID ARRAY	BGA225,15X15,50	4.75 V	85 Cel	0 Cel	TIN LEAD SILVER	BOTTOM	2.7 mm	131072	23 mm		YES	48	40 MHz		225	MULTIPLE	23 mm		CMOS	850 mA	5 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		YES	YES	e0
ADSP-BF535PKB-350	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	260	BGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V		26	32	1.6,3.3	GRID ARRAY	BGA260,18X18,40	.95 V	70 Cel	0 Cel	TIN LEAD SILVER	BOTTOM	2.5 mm		19 mm		YES	32	40 MHz			MULTIPLE	19 mm		CMOS		1.6 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B260	3	Not Qualified	350 rpm	YES	YES	e0
ADSP-BF535PKBZ-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	260	BGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		26			GRID ARRAY		.95 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm		19 mm		YES	32	40 MHz			MULTIPLE	19 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B260	3	Not Qualified		YES	YES	e1
ADSP-BF561WBBZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V		26	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.43 mm		27 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	32	133 MHz			MULTIPLE	27 mm		CMOS		1.25 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B297		Not Qualified	500 rpm	YES	YES	e1
ADSP-BF531SBB400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	169	BGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19	32	1.2,2.5/3.3	GRID ARRAY	BGA169,17X17,40	.8 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.5 mm		19 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz			MULTIPLE	19 mm		CMOS		1.2 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B169	3	Not Qualified	400 rpm	YES	YES	e0
ADSP-21990BCA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V		0	16	2.5,3.3	GRID ARRAY	BGA196,14X14,40	2.37 V	85 Cel	-40 Cel		BOTTOM	1.9 mm	4096	15 mm		YES	0	160 MHz			MULTIPLE	15 mm		CMOS		2.5 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B196		Not Qualified		YES	YES
ADSP-21992BBC	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES	2.625 V		20	16	2.5,3.3	GRID ARRAY	BGA196,14X14,40	2.375 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1.85 mm	16384	15 mm		YES	16	150 MHz		240	MULTIPLE	15 mm		CMOS		2.5 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e0
ADSP-21062KBZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	5.25 V		32	32	5	GRID ARRAY	BGA225,15X15,50	4.75 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.7 mm	2097152	23 mm		YES	48	40 MHz		260	MULTIPLE	23 mm		CMOS		5 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		YES	YES	e1
ADSP-21161N-KB-100X	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	OTHER	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		24			GRID ARRAY		1.71 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	1.9 mm		17 mm		YES	48	50 MHz			MULTIPLE	17 mm		CMOS		1.8 V				1 mm	FLOATING POINT	S-PBGA-B225		Not Qualified		NO	YES	e0
ADSP-21990BBC	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES	2.625 V		20	16	2.5,3.3	GRID ARRAY	BGA196,14X14,40	2.375 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1.85 mm	4096	15 mm		YES	16	150 MHz			MULTIPLE	15 mm		CMOS		2.5 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e0
ADSP-21594KBPZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	0 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-SC594KBPZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	0 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-SC594KBPZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	0 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-21591BBPZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	1MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-21591KBPZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	0 Cel		BOTTOM	1.75 mm	655360	17 mm	1MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-21593BBPZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-21593KBPZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	0 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-21594KBPZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	0 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-21594BBPZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-SC592BBPZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-SC594BBPZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-SC592KBPZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	0 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-21594BBPZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-SC594BBPZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-21593BBPZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-SC591KBPZ6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	0 Cel		BOTTOM	1.75 mm	655360	17 mm	1MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-SC591BBPZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	1MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-SC591BBPZ6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	1MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-SC591KBPZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	0 Cel		BOTTOM	1.75 mm	655360	17 mm	1MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS		1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
MSC8156EETAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm		YES					SINGLE	29 mm		CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783				YES	NO
MSC8154EETAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm		YES					SINGLE	29 mm		CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783				YES	NO
MSC8157TAG1000A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1,1.5,2.5	GRID ARRAY	BGA783,28X28,40				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		8192						30	245				CMOS				Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified				e1
MSC8256SAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			TIN SILVER COPPER	BOTTOM	3.94 mm	8192	29 mm		YES			30	245	SINGLE	29 mm		CMOS		1 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified		YES	NO	e1
MSC8144EVT1000A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32	1.2,2.5,3.3	GRID ARRAY	BGA783,28X28,40	.97 V	90 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	3.176 mm	32768	29 mm		YES		133 MHz	30	245	MULTIPLE	29 mm		CMOS		1 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified		NO	NO	e2
MSC8252TVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		0			GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm		YES	0				MULTIPLE	29 mm		CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783				YES	NO
MSC8154ETAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32	1,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm		YES			30	245	SINGLE	29 mm		CMOS		1 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified		YES	NO	e1
MSC8157ETVT1000A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		0			GRID ARRAY		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	3.94 mm		29 mm		YES	0	667 MHz	30	245	SINGLE	29 mm		CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783	3			YES	NO
MSC8144TVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.97 V				BOTTOM	3.176 mm		29 mm		YES		133 MHz			MULTIPLE	29 mm		CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783				NO	NO
MSC8144SVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.97 V				BOTTOM	3.176 mm		29 mm		YES		133 MHz			MULTIPLE	29 mm		CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783				NO	NO
MSC8254SAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40	.97 V	105 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm		YES			30	245	SINGLE	29 mm		CMOS		1 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified		YES	NO	e1
MSC8156ETAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40				TIN SILVER COPPER	BOTTOM		8192						30	245				CMOS				Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified				e1
MSC8154ESAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32	1,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm		YES			30	245	SINGLE	29 mm		CMOS		1 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified		YES	NO	e1
MSC8254TAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40	.97 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm		YES			30	245	SINGLE	29 mm		CMOS		1 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified		YES	NO	e1
PC56651GC	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES	2.5 V		22			GRID ARRAY		2.3 V	85 Cel	-40 Cel		BOTTOM	1.75 mm		17 mm		YES	16	16.8 MHz			MULTIPLE	17 mm		CMOS		2.4 V				1 mm	FIXED POINT	S-PBGA-B196		Not Qualified		YES	YES
MSC8156VT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm		YES					SINGLE	29 mm		CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783				YES	NO
MSC8154TVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		0			GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm		YES	0				MULTIPLE	29 mm		CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783				YES	NO
MSC8144ETVT1000A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.97 V			Tin/Silver (Sn/Ag)	BOTTOM	3.176 mm		29 mm		YES		133 MHz	30	245	MULTIPLE	29 mm		CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified		NO	NO	e2
MSC8154EESVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm		YES					SINGLE	29 mm		CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783				YES	NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.