BGA Digital Signal Processors (DSPs) 787

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

MSC8151TAG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.94 mm

8192

29 mm

YES

30

245

SINGLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

e1

MSC8251SAG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1,1.5/1.8,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.94 mm

8192

29 mm

YES

30

245

SINGLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

e1

MSC8156SAG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1,1.5/1.8,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

TIN SILVER COPPER

BOTTOM

3.94 mm

8192

29 mm

YES

30

245

SINGLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

e1

MSC8144VT800A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

BOTTOM

3.176 mm

29 mm

YES

133 MHz

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

NO

NO

MSC8156EEAG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

BOTTOM

3.94 mm

29 mm

YES

SINGLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

YES

NO

MSC8144SVT800A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

BOTTOM

3.176 mm

29 mm

YES

133 MHz

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

NO

NO

MSC8252SVT1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

GRID ARRAY

.97 V

BOTTOM

3.94 mm

29 mm

YES

0

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

YES

NO

MSC8144TVT800B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

BOTTOM

3.176 mm

29 mm

YES

133 MHz

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

NO

NO

MSC8156AG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

TIN SILVER COPPER

BOTTOM

3.94 mm

29 mm

YES

30

245

SINGLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

3

YES

NO

e1

MSC8156EVT1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

BOTTOM

3.94 mm

29 mm

YES

SINGLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

YES

NO

MSC8157ETAG1000A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1,1.5,2.5

GRID ARRAY

BGA783,28X28,40

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

8192

30

245

CMOS

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B783

3

Not Qualified

e1

MSC8144ESVT800A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1.2,2.5,3.3

GRID ARRAY

BGA783,28X28,40

.97 V

105 Cel

0 Cel

Tin/Silver (Sn/Ag)

BOTTOM

3.176 mm

32768

29 mm

YES

133 MHz

30

245

MULTIPLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

NO

NO

e2

MSC8252SAG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1,1.5/1.8,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

105 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.94 mm

8192

29 mm

YES

30

245

SINGLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

e1

MSC8154EETVT1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

BOTTOM

3.94 mm

29 mm

YES

SINGLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

YES

NO

MSC8144ESVT1000A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1.2,2.5,3.3

GRID ARRAY

BGA783,28X28,40

.97 V

90 Cel

0 Cel

BOTTOM

3.176 mm

32768

29 mm

YES

133 MHz

30

245

MULTIPLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

NO

NO

MSC8256TAG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1,1.5/1.8,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

TIN SILVER COPPER

BOTTOM

3.94 mm

8192

29 mm

YES

30

245

SINGLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

e1

MSC8144ETVT800A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

Tin/Silver (Sn/Ag)

BOTTOM

3.176 mm

29 mm

YES

133 MHz

30

245

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

NO

NO

e2

MSC8156ESAG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1,1.5/1.8,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

TIN SILVER COPPER

BOTTOM

3.94 mm

8192

29 mm

YES

30

245

SINGLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

e1

MSC8144EVT1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

Tin/Silver (Sn/Ag)

BOTTOM

3.176 mm

29 mm

YES

133 MHz

30

245

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

NO

NO

e2

MSC8144EVT800A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1.2,2.5,3.3

GRID ARRAY

BGA783,28X28,40

.97 V

105 Cel

0 Cel

Tin/Silver (Sn/Ag)

BOTTOM

3.176 mm

32768

29 mm

YES

133 MHz

30

245

MULTIPLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

NO

NO

e2

MSC8151SAG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.94 mm

8192

29 mm

YES

30

245

SINGLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

e1

MSC8154SAG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.94 mm

8192

29 mm

YES

30

245

SINGLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

e1

MSC8144ESVT1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

Tin/Silver (Sn/Ag)

BOTTOM

3.176 mm

29 mm

YES

133 MHz

30

245

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

NO

NO

e2

MSC8156EESVT1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

BOTTOM

3.94 mm

29 mm

YES

SINGLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

YES

NO

MSC8144TVT1000A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

BOTTOM

3.176 mm

29 mm

YES

133 MHz

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

NO

NO

MSC8144EVT800B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

Tin/Silver (Sn/Ag)

BOTTOM

3.176 mm

29 mm

YES

133 MHz

30

245

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

NO

NO

e2

MSC8144VT800B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

BOTTOM

3.176 mm

29 mm

YES

133 MHz

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

NO

NO

MSC8144

NXP Semiconductors

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,2.5,3.3

GRID ARRAY

BGA783,28X28,40

BOTTOM

32768

CMOS

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

Not Qualified

MSC8144VT1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

BOTTOM

3.176 mm

29 mm

YES

133 MHz

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

NO

NO

MSC8144SVT800B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

BOTTOM

3.176 mm

29 mm

YES

133 MHz

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

NO

NO

MSC8144TVT800A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

BOTTOM

3.176 mm

29 mm

YES

133 MHz

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

NO

NO

MSC8144SVT1000A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

BOTTOM

3.176 mm

29 mm

YES

133 MHz

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

NO

NO

MSC8156TVT1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

32

1,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

105 Cel

-40 Cel

TIN SILVER COPPER OVER NICKEL

BOTTOM

3.94 mm

8192

29 mm

YES

0

30

245

MULTIPLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

MSC8144VT1000A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

BOTTOM

3.176 mm

29 mm

YES

133 MHz

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

NO

NO

MSC8144ESVT800B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

Tin/Silver (Sn/Ag)

BOTTOM

3.176 mm

29 mm

YES

133 MHz

30

245

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

NO

NO

e2

XC56602GC60

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

3.3 V

16

GRID ARRAY

2.7 V

85 Cel

-40 Cel

BOTTOM

1.75 mm

13 mm

YES

24

60 MHz

MULTIPLE

13 mm

CMOS

3 V

1 mm

FIXED POINT

S-PBGA-B144

Not Qualified

YES

YES

MSC8154TAG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.94 mm

8192

29 mm

YES

30

245

SINGLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

e1

MSC8154SVT1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

GRID ARRAY

.97 V

BOTTOM

3.94 mm

29 mm

YES

0

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

YES

NO

MSC8252TAG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1,1.5/1.8,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.94 mm

8192

29 mm

YES

30

245

SINGLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

e1

MSC8154EESAG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

BOTTOM

3.94 mm

29 mm

YES

SINGLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

YES

NO

MSC8157LVT1000A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

GRID ARRAY

.97 V

105 Cel

-40 Cel

BOTTOM

3.94 mm

29 mm

YES

0

667 MHz

SINGLE

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

YES

NO

MSC8157ESVT1000A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

GRID ARRAY

.97 V

105 Cel

-40 Cel

TIN SILVER COPPER OVER NICKEL

BOTTOM

3.94 mm

29 mm

YES

0

667 MHz

30

245

SINGLE

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

3

YES

NO

MSC8251TAG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1,1.5/1.8,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.94 mm

8192

29 mm

YES

30

245

SINGLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

e1

MSC8157ESAG1000A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1,1.5,2.5

GRID ARRAY

BGA783,28X28,40

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

8192

30

245

CMOS

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B783

3

Not Qualified

e1

MSC8144ETVT800B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

Tin/Silver (Sn/Ag)

BOTTOM

3.176 mm

29 mm

YES

133 MHz

30

245

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

NO

NO

e2

MSC8144ETVT1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.97 V

Tin/Silver (Sn/Ag)

BOTTOM

3.176 mm

29 mm

YES

133 MHz

30

245

MULTIPLE

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

NO

NO

e2

MSC8156SVT1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

32

1,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

105 Cel

0 Cel

TIN SILVER COPPER OVER NICKEL

BOTTOM

3.94 mm

8192

29 mm

YES

0

30

245

MULTIPLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

MSC8157SAG1000A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1,1.5,2.5

GRID ARRAY

BGA783,28X28,40

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

8192

30

245

CMOS

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B783

3

Not Qualified

e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.