FBGA Digital Signal Processors (DSPs) 886

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

MSC8101M1250F

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

332

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.7 V

32

16

1.6,3.3

GRID ARRAY, FINE PITCH

BGA357,19X19,50

1.5 V

Tin/Lead/Silver (Sn/Pb/Ag)

BOTTOM

3.18 mm

262144

17 mm

YES

64

62.5 MHz

30

220

SINGLE

17 mm

CMOS

1.6 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B332

3

Not Qualified

YES

NO

e0

MSC8122VT4800

NXP Semiconductors

BALL

431

FBGA

SQUARE

PLASTIC/EPOXY

YES

16

1.2,3.3

GRID ARRAY, FINE PITCH

BGA431,21X21,32

BOTTOM

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B431

Not Qualified

MSC8126MP6400

NXP Semiconductors

BALL

431

FBGA

SQUARE

PLASTIC/EPOXY

YES

16

1.2,3.3

GRID ARRAY, FINE PITCH

BGA431,21X21,32

BOTTOM

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B431

Not Qualified

MSC8122VT4800V

NXP Semiconductors

BALL

431

FBGA

SQUARE

PLASTIC/EPOXY

YES

16

1.1,3.3

GRID ARRAY, FINE PITCH

BGA431,21X21,32

BOTTOM

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B431

Not Qualified

MSC8101VT1375F

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

332

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.7 V

32

16

1.6,3.3

GRID ARRAY, FINE PITCH

BGA332,19X19,32

1.5 V

TIN SILVER COPPER OVER NICKEL

BOTTOM

3.18 mm

262144

17 mm

YES

64

68.75 MHz

30

250

SINGLE

17 mm

CMOS

1.6 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B332

3

Not Qualified

YES

NO

MSC8122MP8000

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

431

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

32

GRID ARRAY, FINE PITCH

1.16 V

BOTTOM

3.3 mm

20 mm

YES

32

500 MHz

MULTIPLE

20 mm

CMOS

1.2 V

.8 mm

FIXED POINT

S-PBGA-B431

YES

NO

MSC8126TMP6400

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

431

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

0

GRID ARRAY, FINE PITCH

1.14 V

BOTTOM

3.3 mm

20 mm

YES

0

400 MHz

30

250

MULTIPLE

20 mm

CMOS

1.2 V

.8 mm

FIXED POINT

S-PBGA-B431

3

NO

NO

MSC8126MP8000

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

431

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

0

GRID ARRAY, FINE PITCH

1.16 V

BOTTOM

3.3 mm

20 mm

YES

0

500 MHz

MULTIPLE

20 mm

CMOS

1.2 V

.8 mm

FIXED POINT

S-PBGA-B431

NO

NO

MSC8103M1200F

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

332

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.7 V

32

16

1.6,3.3

GRID ARRAY, FINE PITCH

BGA332,19X19,32

1.55 V

75 Cel

-40 Cel

Tin/Lead/Silver (Sn/Pb/Ag)

BOTTOM

3.18 mm

262144

17 mm

YES

64

75 MHz

30

220

MULTIPLE

17 mm

CMOS

1.6 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B332

3

Not Qualified

YES

NO

e0

MSC8103VT1200F

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

332

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.7 V

32

16

1.6,3.3

GRID ARRAY, FINE PITCH

BGA332,19X19,32

1.55 V

75 Cel

-40 Cel

TIN SILVER COPPER OVER NICKEL

BOTTOM

3.18 mm

262144

17 mm

YES

64

75 MHz

30

250

MULTIPLE

17 mm

CMOS

1.6 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B332

3

Not Qualified

YES

NO

MSC7119VF800

NXP Semiconductors

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

16

1.2,2.5,3.3

GRID ARRAY, FINE PITCH

BGA400,20X20,32

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

229376

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B400

Not Qualified

e0

MSC7119VM800

NXP Semiconductors

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

16

1.2,2.5,3.3

GRID ARRAY, FINE PITCH

BGA400,20X20,32

-40 Cel

BOTTOM

229376

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B400

Not Qualified

PT8R1202ND

Diodes Incorporated

INDUSTRIAL

BALL

144

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3

GRID ARRAY, FINE PITCH

BGA144,12X12,32

105 Cel

-40 Cel

BOTTOM

131072

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B144

Not Qualified

PT8R1202NDEX

Diodes Incorporated

INDUSTRIAL

BALL

144

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3

GRID ARRAY, FINE PITCH

BGA144,12X12,32

105 Cel

-40 Cel

BOTTOM

131072

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B144

Not Qualified

PT8R1202NDE

Diodes Incorporated

INDUSTRIAL

BALL

144

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3

GRID ARRAY, FINE PITCH

BGA144,12X12,32

105 Cel

-40 Cel

BOTTOM

131072

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B144

Not Qualified

PT8R1202NDX

Diodes Incorporated

INDUSTRIAL

BALL

144

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3

GRID ARRAY, FINE PITCH

BGA144,12X12,32

105 Cel

-40 Cel

BOTTOM

131072

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B144

Not Qualified

UPD77113AF1-XXX-CN1

Renesas Electronics

INDUSTRIAL

BALL

80

FBGA

SQUARE

PLASTIC/EPOXY

YES

16

2/2.5,3/3.3

GRID ARRAY, FINE PITCH

BGA80,9X9,32

85 Cel

-40 Cel

BOTTOM

32768

CMOS

75 mA

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B80

Not Qualified

UPD77115F1-CN1

Renesas Electronics

BALL

80

FBGA

SQUARE

PLASTIC/EPOXY

YES

16

2/2.5,3/3.3

GRID ARRAY, FINE PITCH

BGA80,9X9,32

BOTTOM

32768

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B80

Not Qualified

UPD77115AF1-XXX-CN6-A

Renesas Electronics

INDUSTRIAL

BALL

80

FBGA

SQUARE

PLASTIC/EPOXY

YES

16

2/2.5,3/3.3

GRID ARRAY, FINE PITCH

BGA80,9X9,32

85 Cel

-40 Cel

BOTTOM

32768

CMOS

75 mA

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B80

Not Qualified

UPD77115AF1-XXX-CN6

Renesas Electronics

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

80

FBGA

SQUARE

PLASTIC/EPOXY

YES

16

2/2.5,3/3.3

GRID ARRAY, FINE PITCH

BGA80,9X9,32

85 Cel

-40 Cel

BOTTOM

32768

CMOS

75 mA

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B80

Not Qualified

UPD77115F1-CN6

Renesas Electronics

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

80

FBGA

SQUARE

PLASTIC/EPOXY

YES

16

2/2.5,3/3.3

GRID ARRAY, FINE PITCH

BGA80,9X9,32

85 Cel

-40 Cel

BOTTOM

32768

CMOS

75 mA

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B80

Not Qualified

UPD77111F1-XXX-CN1

Renesas Electronics

INDUSTRIAL

BALL

80

FBGA

SQUARE

PLASTIC/EPOXY

YES

16

2/2.5,3/3.3

GRID ARRAY, FINE PITCH

BGA80,9X9,32

85 Cel

-40 Cel

BOTTOM

6144

CMOS

75 mA

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B80

Not Qualified

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.