FBGA Digital Signal Processors (DSPs) 886

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code
TMS320C6457CGMH2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	688	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.236 V	20	32	1.2,1.8,3.3	GRID ARRAY	BGA688,28X28,32	1.164 V				BOTTOM	3.3 mm	8192	23 mm		YES	64	100 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm	CMOS		1.2 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B688		Not Qualified		YES	NO
ADSP-BF524BBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V	19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm	CMOS		1.8 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF534WBBCZ-5B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm	CMOS		1.26 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208		Not Qualified	500 rpm	YES	YES	e1
ADSP-BF534BBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	400 MHz	30	260	MULTIPLE	17 mm	CMOS		1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF526BBCZ-4AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel	-40 Cel		BOTTOM	1.75 mm		17 mm	ALSO OPERATES AT 2.5 AND 3.3 V TYP	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	CMOS		1.8 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208		Not Qualified	400 rpm	YES	YES
ADSP-BF524BBCZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V	19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm	CMOS		1.8 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF523KBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V	19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm	CMOS		1.8 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF522BBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V	19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm	CMOS		1.8 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-TS101SAB2Z000	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32			GRID ARRAY, FINE PITCH		1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm		19 mm		YES	64			260	SINGLE	19 mm	CMOS		1.25 V		.8 mm	FLOATING POINT	S-PBGA-B484	3			YES	YES	e1
ADSP-21532SKCA-300	Analog Devices			BALL	160	FBGA	SQUARE	PLASTIC/EPOXY	YES			16	3.3	GRID ARRAY, FINE PITCH	BGA160,14X14,32					BOTTOM		16384												3.3 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B160		Not Qualified
ADSP-TS101SAB2-000	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA484,22X22,32	1.14 V	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	2.5 mm	196608	19 mm		YES	64	250 MHz		225	MULTIPLE	19 mm	CMOS		1.2 V	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified		YES	YES	e0
ADSP-21266SKBC-200X	Analog Devices		COMMERCIAL	BALL	136	FBGA	SQUARE	PLASTIC/EPOXY	YES			32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA136,14X14,32		70 Cel	0 Cel		BOTTOM		65536										CMOS	500 mA		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified
ADSP-21479KBCZ-3AX	Analog Devices		COMMERCIAL	BALL	196	FBGA	SQUARE	PLASTIC/EPOXY	YES			32	1.3,3.3	GRID ARRAY, FINE PITCH	BGA196,14X14,32		70 Cel	0 Cel		BOTTOM		163840													Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B196		Not Qualified
ADSP-21366	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	136	FBGA	SQUARE	PLASTIC/EPOXY	YES			32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA136,14X14,32		85 Cel	-40 Cel		BOTTOM		98304										CMOS			Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B136	1	Not Qualified
ADSP-BF534WBBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm	CMOS		1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208		Not Qualified	400 rpm	YES	YES	e1
ADSP-BF526BBCZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V	19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm	CMOS		1.8 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-TS101SAB2-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA484,22X22,32	1.14 V	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	2.5 mm	196608	19 mm		YES	64	100 MHz	30	225	MULTIPLE	19 mm	CMOS		1.2 V	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified		YES	YES	e0
ADSP-BF534WYBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm	CMOS		1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208		Not Qualified	400 rpm	YES	YES	e1
ADSP-21365	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	136	FBGA	SQUARE	PLASTIC/EPOXY	YES			32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA136,14X14,32		85 Cel	-40 Cel		BOTTOM		98304										CMOS			Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B136	1	Not Qualified
ADSP-BF526BBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V	19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm	CMOS		1.8 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-TS101SKB2250X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32			GRID ARRAY, FINE PITCH		1.14 V	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	2.5 mm		19 mm		YES	64	125 MHz			MULTIPLE	19 mm	CMOS		1.2 V		.8 mm	FIXED POINT	S-PBGA-B484		Not Qualified		YES	YES	e0
ADSP-2186NBCAZ-320	Analog Devices		INDUSTRIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES			16	2/3.3	GRID ARRAY, FINE PITCH	BGA144,12X12,32		85 Cel	-40 Cel	MATTE TIN	BOTTOM		8192										CMOS			Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B144	1	Not Qualified				e3
ADSP-BF526BBCZ-3AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel	-40 Cel		BOTTOM	1.75 mm		17 mm	ALSO OPERATES AT 2.5 AND 3.3 V TYP	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	CMOS		1.8 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208		Not Qualified	300 rpm	YES	YES
R3920-CFAB-E1B	Onsemi	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	25	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES					GRID ARRAY, FINE PITCH	LGA25,3X8,27	.77 V	40 Cel	0 Cel		BOTTOM	1.83 mm		3.18 mm				4.218 MHz		240		5.59 mm	CMOS		1.25 V		.686 mm	FIXED POINT	R-PBGA-B25	4
MSC8126VT6400	NXP Semiconductors			BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES			16	1.2,3.3	GRID ARRAY, FINE PITCH	BGA431,21X21,32					BOTTOM												CMOS			Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B431		Not Qualified
MSC8101M1375F	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	332	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.7 V	32	16	1.6,3.3	GRID ARRAY, FINE PITCH	BGA357,19X19,50	1.5 V			Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	3.18 mm	262144	17 mm		YES	64	68.75 MHz	30	220	SINGLE	17 mm	CMOS		1.6 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B332	3	Not Qualified		YES	NO	e0
MSC8144EC	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	783	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0			GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel		BOTTOM	3.215 mm		29 mm		YES	0	133 MHz			MULTIPLE	29 mm	CMOS		1 V		.5 mm	FIXED POINT	S-PBGA-B783		Not Qualified		YES	NO
MSC8122TVT6400	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32			GRID ARRAY, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.3 mm		20 mm		YES	32	400 MHz	30	250	MULTIPLE	20 mm	CMOS		1.2 V		.8 mm	FIXED POINT	S-PBGA-B431	3			YES	NO	e2
MSC8101VT1500F	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	332	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.7 V	32	16	1.6,3.3	GRID ARRAY, FINE PITCH	BGA332,19X19,32	1.55 V			TIN SILVER COPPER OVER NICKEL	BOTTOM	3.18 mm	262144	17 mm		YES	64	75 MHz	30	250	SINGLE	17 mm	CMOS		1.6 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B332	3	Not Qualified		YES	NO
MSC8103M1100F	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	332	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.7 V	32	16	1.6,3.3	GRID ARRAY, FINE PITCH	BGA332,19X19,32	1.5 V	105 Cel	-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	3.18 mm	262144	17 mm		YES	64	68.75 MHz	30	220	MULTIPLE	17 mm	CMOS		1.6 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B332	3	Not Qualified		YES	NO	e0
MSC8122MP4800	NXP Semiconductors			BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES			16	1.2,3.3	GRID ARRAY, FINE PITCH	BGA431,21X21,32					BOTTOM												CMOS			Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B431		Not Qualified
MSC8122VT8000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.24 V	32			GRID ARRAY, FINE PITCH		1.16 V			TIN SILVER	BOTTOM	3.3 mm		20 mm		YES	32	500 MHz	30	250	MULTIPLE	20 mm	CMOS		1.2 V		.8 mm	FIXED POINT	S-PBGA-B431	3			YES	NO	e2
MSC8122TMP6400V	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32			GRID ARRAY, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	3.3 mm		20 mm		YES	32	400 MHz	30	250	MULTIPLE	20 mm	CMOS		1.2 V		.8 mm	FIXED POINT	S-PBGA-B431	3			YES	NO	e0
MSC8112TVT2400V	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.13 V	32	16	1.1,3.3	GRID ARRAY, FINE PITCH	BGA431,23X23,32	1.07 V				BOTTOM	3.3 mm	114688	20 mm		YES	64	100 MHz	30	250	MULTIPLE	20 mm	CMOS		1.1 V	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B431	3	Not Qualified		YES	NO	e2
MSC8122MP4800V	NXP Semiconductors			BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES			16	1.1,3.3	GRID ARRAY, FINE PITCH	BGA431,21X21,32					BOTTOM												CMOS			Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B431		Not Qualified
MSC8144E	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	783	FBGA	SQUARE	PLASTIC/EPOXY	YES	2.625 V	0			GRID ARRAY, FINE PITCH		2.375 V	105 Cel	-40 Cel		BOTTOM	3.215 mm		29 mm		YES	0	150 MHz			MULTIPLE	29 mm	CMOS		2.5 V		.5 mm	FIXED POINT	S-PBGA-B783		Not Qualified		NO	NO
MSC8122TMP4800V	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.13 V	32			GRID ARRAY, FINE PITCH		1.07 V	105 Cel	-40 Cel		BOTTOM	3.3 mm		20 mm		YES	32	300 MHz			MULTIPLE	20 mm	CMOS		1.1 V		.8 mm	FIXED POINT	S-PBGA-B431				YES	NO
MSC8122TMP6400	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32			GRID ARRAY, FINE PITCH		1.14 V	105 Cel	-40 Cel		BOTTOM	3.3 mm		20 mm		YES	32	400 MHz	30	250	MULTIPLE	20 mm	CMOS		1.2 V		.8 mm	FIXED POINT	S-PBGA-B431	3			YES	NO
MSC8126TVT6400	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	0			GRID ARRAY, FINE PITCH		1.14 V				BOTTOM	3.3 mm		20 mm		YES	0	400 MHz			MULTIPLE	20 mm	CMOS		1.2 V		.8 mm	FIXED POINT	S-PBGA-B431				NO	NO
MSC8103VT1100F	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	332	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.7 V	32	16	1.6,3.3	GRID ARRAY, FINE PITCH	BGA332,19X19,32	1.5 V	105 Cel	-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	3.18 mm	262144	17 mm		YES	64	68.75 MHz	30	250	MULTIPLE	17 mm	CMOS		1.6 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B332	3	Not Qualified		YES	NO
MSC8112TMP2400V	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.13 V	32	16	1.1,3.3	GRID ARRAY, FINE PITCH	BGA431,23X23,32	1.07 V			Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	3.3 mm	114688	20 mm		YES	64	100 MHz	30	250	MULTIPLE	20 mm	CMOS		1.1 V	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B431	3	Not Qualified		YES	NO	e0
MSC8101M1500F	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	332	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.7 V	32	16	1.6,3.3	GRID ARRAY, FINE PITCH	BGA357,19X19,50	1.55 V			Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	3.18 mm	262144	17 mm		YES	64	75 MHz	30	220	SINGLE	17 mm	CMOS		1.6 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B332	3	Not Qualified		YES	NO	e0
MSC8122TVT4800V	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.13 V	32			GRID ARRAY, FINE PITCH		1.07 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.3 mm		20 mm		YES	32	300 MHz	30	250	MULTIPLE	20 mm	CMOS		1.1 V		.8 mm	FIXED POINT	S-PBGA-B431	3			YES	NO	e2
MSC8101VT1250F	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	332	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.7 V	32	16	1.6,3.3	GRID ARRAY, FINE PITCH	BGA332,19X19,32	1.5 V			TIN SILVER COPPER OVER NICKEL	BOTTOM	3.18 mm	262144	17 mm		YES	64	62.5 MHz	30	250	SINGLE	17 mm	CMOS		1.6 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B332	3	Not Qualified		YES	NO
MSC8122TVT6400V	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32			GRID ARRAY, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.3 mm		20 mm		YES	32	400 MHz	30	250	MULTIPLE	20 mm	CMOS		1.2 V		.8 mm	FIXED POINT	S-PBGA-B431	3			YES	NO	e2
MSC8126VT8000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.24 V	0			GRID ARRAY, FINE PITCH		1.16 V				BOTTOM	3.3 mm		20 mm		YES	0	500 MHz			MULTIPLE	20 mm	CMOS		1.2 V		.8 mm	FIXED POINT	S-PBGA-B431				NO	NO
MSC8102M4400	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.7 V	32			GRID ARRAY, FINE PITCH		1.55 V				BOTTOM	3.22 mm		20 mm		YES	32	75 MHz			SINGLE	20 mm	CMOS		1.6 V		.8 mm	FIXED POINT	S-CBGA-B431				YES	NO
MSC8102M4000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.7 V	32			GRID ARRAY, FINE PITCH		1.55 V				BOTTOM	3.22 mm		20 mm		YES	32	75 MHz			SINGLE	20 mm	CMOS		1.6 V		.8 mm	FIXED POINT	S-CBGA-B431				YES	NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.