HFBGA Digital Signal Processors (DSPs) 202

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS32C6415EGLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V	90 Cel	4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3	CMOS		1.2 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6203GLSA250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.43 V					BOTTOM	2.8 mm		18 mm	-40 TO 105 OPERATING CASE TEMPERATURE	YES	32	250 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202GLSA-167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	167 MHz			MULTIPLE	18 mm		CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203BGLS250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.75 V		22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.65 V	90 Cel		0 Cel		BOTTOM	2.8 mm	524288	18 mm		YES	32	250 MHz			MULTIPLE	18 mm		CMOS		1.7 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6414GLZ400	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		32			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.16 V					BOTTOM	3.3 mm		23 mm	0 TO 90 OPERATING CASE TEMPERATURE	YES	32	75.18 MHz			MULTIPLE	23 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6415EZLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V		23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6202GLSA-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	150 MHz			MULTIPLE	18 mm		CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6414EZLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V		23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.19 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.25 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6202GLS-167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	167 MHz			MULTIPLE	18 mm		CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS32C6415DGLZA6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6416EGLZA6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V		23	32		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS32C6414DGLZW5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V				TIN LEAD	BOTTOM	3.3 mm	4096	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS32C6414EGLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.31 V		32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.19 V	105 Cel	4	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3	CMOS	125 mA	1.25 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6202BGLS-167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	167 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6204GLWA-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.095 mm		18 mm		YES	32	100 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS32C6415DGLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS32C6415EGLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel	4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3	CMOS		1.4 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6414EGLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V		23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6416TGLZWA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES			23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH						TIN LEAD	BOTTOM	3.3 mm		23 mm		YES	64				MULTIPLE	23 mm		CMOS						.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6202GLSA-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	233 MHz			MULTIPLE	18 mm		CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202BGLSA-250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	250 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
SM320C6455BGTZSEP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2875 V		20	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA697,29X29,32	1.2125 V	105 Cel		-55 Cel	TIN LEAD	BOTTOM	3.1 mm	32768	24 mm	IT ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	66.6 MHz	20	220	MULTIPLE	24 mm	4	CMOS		1.25 V	64	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified	YES	NO	e0	8
TMS320C6411AZLZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		23	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75.19 MHz	30	260	MULTIPLE	23 mm	3	CMOS		1.2 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS320C647ZUN	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	561	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.155 V		14			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.045 V					BOTTOM	3.3 mm		23 mm		YES	32	61.44 MHz			MULTIPLE	23 mm		CMOS		1.1 V				.8 mm	FIXED POINT	S-PBGA-B561		Not Qualified	YES	NO
TMS320C6415TBCLZ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.16 V		23	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.05 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.18 MHz	30	260	MULTIPLE	23 mm	3	CMOS		1.1 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1	8
TMS320C6411AGLZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		23	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V	90 Cel	4	0 Cel	TIN LEAD	BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75.19 MHz	20	220	MULTIPLE	23 mm	3	CMOS		1.2 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS32C6416DGLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320TCI6482ZTZA8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	697	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		20	32	1.2,1.5/1.8,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA697,29X29,32	1.17 V					BOTTOM	3.3 mm	8192	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified	YES	NO
TMS320C6416TBGLZA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		23	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS32C6203BGLS173A	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.75 V		22	32	1.7,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.65 V					BOTTOM	2.8 mm	131072	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32				MULTIPLE	18 mm		CMOS		1.7 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6416GLZ500	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.16 V					BOTTOM	3.3 mm		23 mm	0 TO 90 OPERATING CASE TEMPERATURE	YES	32	75.18 MHz			MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS32C6415DGLZW5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V				TIN LEAD	BOTTOM	3.3 mm	4096	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6416EZLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V		23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6457GMH	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	688	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.133 V		20	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA688,28X28,32	1.067 V					BOTTOM	3.3 mm	8192	23 mm		YES	64	62.5 MHz			MULTIPLE	23 mm		CMOS		1.1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B688		Not Qualified	NO	NO
TMS32C6414DGLZW6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V				TIN LEAD	BOTTOM	3.3 mm	4096	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	20	220	MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6415TBCLZ1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V		23	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.18 MHz	30	260	MULTIPLE	23 mm	3	CMOS		1.2 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1	8
TMS320C647CUN	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	561	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.155 V		14			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.045 V					BOTTOM	3.3 mm		23 mm		YES	32	61.44 MHz			MULTIPLE	23 mm		CMOS		1.1 V				.8 mm	FIXED POINT	S-PBGA-B561		Not Qualified	YES	NO
TMS320C6204GLW-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.095 mm		18 mm		YES	32	233 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6204GLWA-300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.095 mm		18 mm		YES	32	300 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6202GLSA-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	200 MHz			MULTIPLE	18 mm		CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202GLS200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.71 V				TIN LEAD	BOTTOM	2.8 mm	32768	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	18 mm		CMOS		1.8 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384	4	Not Qualified	YES	NO	e0
TMS32C6414DGLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V		32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.19 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.25 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6202GLS250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	8	22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.71 V	90 Cel	4	0 Cel	TIN LEAD	BOTTOM	2.8 mm	32768	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	20	220	MULTIPLE	18 mm	2	CMOS		1.8 V	4	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B384	4	Not Qualified	YES	NO	e0	8
TMS320C6415EGLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V		23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS32C6416DGLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6203GLS-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	200 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203BGLSA250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.75 V		22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.65 V	90 Cel		0 Cel		BOTTOM	2.8 mm	524288	18 mm		YES	32	250 MHz			MULTIPLE	18 mm		CMOS		1.7 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203GLS250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V		22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.43 V				TIN LEAD	BOTTOM	2.8 mm	98304	18 mm	0 TO 90 OPERATING CASE TEMPERATURE	YES	32	250 MHz			MULTIPLE	18 mm		CMOS		1.5 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO	e0

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.