HFBGA Digital Signal Processors (DSPs) 202

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320C6414GLZ600	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	32			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	0 TO 90 OPERATING CASE TEMPERATURE	YES	32	75.18 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6457CMH2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	688	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.236 V	20			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.164 V					BOTTOM	3.3 mm		23 mm		YES	64	62.5 MHz			MULTIPLE	23 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B688		Not Qualified	NO	NO
TMS320TCI6482GTZA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	697	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V	20	32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA697,29X29,32	1.2 V					BOTTOM	3.1 mm	65536	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz			MULTIPLE	24 mm		CMOS		1.25 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified	YES	NO
TMS320C6416EGLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6203GLS-167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	167 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320TCI6482ZTZA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	697	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V	20	32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA697,29X29,32	1.2 V					BOTTOM	3.3 mm	65536	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz			MULTIPLE	24 mm		CMOS		1.25 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified	YES	NO
TMS32C6414DGLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6414EZLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6415EGLZA6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6204GLWA-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.095 mm		18 mm		YES	32	150 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS32C6416EGLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel	4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3	CMOS		1.4 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6202BGLS-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	150 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS32C6414EGLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel	4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3	CMOS		1.4 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6203GLSA-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	233 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6411ZLZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	23	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V					BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75.75 MHz			MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6415GLZ600	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V					BOTTOM	3.3 mm	16384	23 mm	0 TO 90 OPERATING CASE TEMPERATURE	YES	32	75.18 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS32C6414EZLZA6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	105 Cel	4	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3	CMOS	125 mA	1.4 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS320C647GUN	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	561	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.155 V	14			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.045 V					BOTTOM	3.3 mm		23 mm		YES	32	61.44 MHz			MULTIPLE	23 mm		CMOS		1.1 V				.8 mm	FIXED POINT	S-PBGA-B561		Not Qualified	YES	NO
TMS32C6415DGLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6415TBGLZA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	23	32	1.1,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel		BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6415EGLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6416EGLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.14 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS32C6415CGLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel		0 Cel		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS32C6416DGLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V	32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.19 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	20	220	MULTIPLE	23 mm		CMOS		1.25 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6415EZLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.14 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6202GLS-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V	22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.71 V	90 Cel		0 Cel		BOTTOM	2.8 mm	32768	18 mm		YES	32	233 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	18 mm		CMOS		1.8 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6415TBZLZ8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	23	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel		0 Cel		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS32C6414EZLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V	90 Cel	4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3	CMOS	125 mA	1.2 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS32C6416EGLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	20	220	MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS32C6416EZLZA6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	105 Cel	4	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3	CMOS	125 mA	1.4 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS32C6416EZLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V				TIN SILVER COPPER	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	30	260	MULTIPLE	23 mm		CMOS	125 mA	1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS320C6204GLW-167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.095 mm		18 mm		YES	32	167 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS32C6414EZLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel	4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3	CMOS	125 mA	1.4 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS320C6202GLS	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	3.46 V	32			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		3.14 V					BOTTOM	2.8 mm		18 mm		YES	32	250 MHz			MULTIPLE	18 mm		CMOS		3.3 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
SM320C6455BGTZEP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2875 V	20	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA697,29X29,32	1.2125 V	90 Cel		0 Cel	TIN LEAD	BOTTOM	3.1 mm	32768	24 mm	IT ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	66.6 MHz	20	220	MULTIPLE	24 mm	4	CMOS		1.25 V	64	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified	YES	NO	e0	8
TMS32C6414EGLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V	90 Cel	4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3	CMOS		1.2 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6202BGLS-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	200 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203GLSA300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.43 V					BOTTOM	2.8 mm		18 mm	-40 TO 105 OPERATING CASE TEMPERATURE	YES	32	300 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS32C6414EZLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.31 V	32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.19 V	105 Cel	4	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3	CMOS	125 mA	1.25 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS320C6414EZLZA6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6203GLS300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V	22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.43 V				TIN LEAD	BOTTOM	2.8 mm	98304	18 mm	0 TO 90 OPERATING CASE TEMPERATURE	YES	32	300 MHz			MULTIPLE	18 mm		CMOS		1.5 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO	e0
TMS320C6202BGLSA-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	150 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202GLS250X	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V	22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.71 V					BOTTOM	2.8 mm	32768	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	18 mm		CMOS		1.8 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203GLSA-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	100 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6416TBGLZA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.16 V	23	32	1.1,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.05 V	105 Cel	4	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3	CMOS		1.1 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0	8
TMS320C6203GLS-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	100 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS32C6415EZLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.31 V	32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.19 V	105 Cel	4	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3	CMOS	125 mA	1.25 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS320C6416EGLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.19 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.25 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.