HFBGA Digital Signal Processors (DSPs) 202

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code
TMS320C6416EZLZA6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V			.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6202GLS-300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	300 MHz			MULTIPLE	18 mm		CMOS		1.8 V			.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203GLSA-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	150 MHz			MULTIPLE	18 mm		CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202BGLS-300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	300 MHz			MULTIPLE	18 mm		CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202BGLS-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	100 MHz			MULTIPLE	18 mm		CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS32C6415EZLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V	90 Cel	4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3	CMOS	125 mA	1.2 V	64	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS320C6415EGLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.14 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.2 V			.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6414EGLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V	23	32		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.19 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.25 V			.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6203BGLSH	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V	22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.43 V					BOTTOM	2.8 mm	524288	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	300 MHz			MULTIPLE	18 mm		CMOS		1.5 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203BGLS-3H	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V	22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.43 V					BOTTOM	2.8 mm	524288	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	300 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	18 mm		CMOS		1.5 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6416EZLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.14 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.2 V			.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6204GLWA-167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.095 mm		18 mm		YES	32	167 MHz			MULTIPLE	18 mm		CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6415EGLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.19 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.25 V			.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6414EGLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V			.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6457GMHA2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	688	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.236 V	20			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.164 V					BOTTOM	3.3 mm		23 mm		YES	64	62.5 MHz			MULTIPLE	23 mm		CMOS		1.2 V			.8 mm	FIXED POINT	S-PBGA-B688		Not Qualified	NO	NO
TMS320C6457CMH	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	688	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.133 V	20	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA688,28X28,32	1.067 V					BOTTOM	3.3 mm	8192	23 mm		YES	64	62.5 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm		CMOS		1.1 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B688		Not Qualified	NO	NO
TMS320C6204GLW-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.095 mm		18 mm		YES	32	100 MHz			MULTIPLE	18 mm		CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6202GLSA-250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	250 MHz			MULTIPLE	18 mm		CMOS		1.8 V			.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS32C6415DGLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V	32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.19 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.25 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6414GLZ500	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	32			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.16 V					BOTTOM	3.3 mm		23 mm	0 TO 90 OPERATING CASE TEMPERATURE	YES	32	75.18 MHz			MULTIPLE	23 mm		CMOS		1.2 V			.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6415EZLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.19 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.25 V			.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6416EZLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.19 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.25 V			.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6203GLSA-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	200 MHz			MULTIPLE	18 mm		CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6204GLW-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.095 mm		18 mm		YES	32	150 MHz			MULTIPLE	18 mm		CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6457GMH2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	688	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.236 V	20			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.164 V					BOTTOM	3.3 mm		23 mm		YES	64	62.5 MHz			MULTIPLE	23 mm		CMOS		1.2 V			.8 mm	FIXED POINT	S-PBGA-B688		Not Qualified	NO	NO
TMS32C6414DGLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS32C6416EZLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel	4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3	CMOS	125 mA	1.4 V	64	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMS32C6415EGLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	20	220	MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS32C6203BGLS173H	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.75 V	22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.65 V	90 Cel		0 Cel		BOTTOM	2.8 mm	524288	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	300 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	18 mm		CMOS		1.7 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6415TBZLZA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	23	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6203GLS-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	150 MHz			MULTIPLE	18 mm		CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6415GLZ500	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.16 V					BOTTOM	3.3 mm	16384	23 mm	0 TO 90 OPERATING CASE TEMPERATURE	YES	32	75.18 MHz			MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320DM648ZUTA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	529	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	32	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm		YES	32	66 MHz	30	245	MULTIPLE	19 mm		CMOS		1.2 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	YES	NO	e1
TMS320C6204GLW-250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.095 mm		18 mm		YES	32	250 MHz			MULTIPLE	18 mm		CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6202GLS-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	150 MHz			MULTIPLE	18 mm		CMOS		1.8 V			.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6415EZLZA6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V	23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V			.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6202BGLSA-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	100 MHz			MULTIPLE	18 mm		CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202BGLSA-300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	300 MHz			MULTIPLE	18 mm		CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6204GLW-300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.095 mm		18 mm		YES	32	300 MHz			MULTIPLE	18 mm		CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6202GLSA-300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	300 MHz			MULTIPLE	18 mm		CMOS		1.8 V			.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6204GLWA-250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.095 mm		18 mm		YES	32	250 MHz			MULTIPLE	18 mm		CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6202BGLSA-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	233 MHz			MULTIPLE	18 mm		CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202BGLSA-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	200 MHz			MULTIPLE	18 mm		CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202GLS-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	100 MHz			MULTIPLE	18 mm		CMOS		1.8 V			.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202GLSA-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	100 MHz			MULTIPLE	18 mm		CMOS		1.8 V			.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6414EZLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	23	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V					BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS	125 mA	1.2 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320TCI6482GTZ8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	697	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	20	32	1.2,1.5/1.8,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA697,29X29,32	1.17 V					BOTTOM	3.1 mm	65536	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz			MULTIPLE	24 mm		CMOS		1.2 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified	YES	NO
TMS320C6203BGLS300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.75 V	22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.65 V	90 Cel		0 Cel		BOTTOM	2.8 mm	524288	18 mm		YES	32	300 MHz			MULTIPLE	18 mm		CMOS		1.7 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.