Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Internal Bus Architecture | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Barrel Shifter | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
19 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
4.75 V |
85 Cel |
0 Cel |
BOTTOM |
1.4 mm |
12 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
16 |
50 MHz |
MULTIPLE |
12 mm |
CMOS |
5 V |
.8 mm |
FIXED POINT |
S-PBGA-B144 |
Not Qualified |
YES |
YES |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.25 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75 MHz |
30 |
260 |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
240 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.65 V |
16 |
22 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA240,17X17,32 |
1.55 V |
85 Cel |
6 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
163840 |
15 mm |
YES |
32 |
200 MHz |
30 |
260 |
MULTIPLE |
15 mm |
2 |
CMOS |
112 mA |
1.6 V |
6 |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B240 |
3 |
YES |
NO |
e1 |
16 |
|||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
8 |
23 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.95 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.3 mm |
327680 |
13 mm |
ALSO OPEARTES AT 1.1V AND 1.2V SUPLLY |
YES |
16 |
30 MHz |
30 |
260 |
SINGLE |
13 mm |
8 |
CMOS |
1 V |
80 |
.65 mm |
FLOATING POINT |
S-PBGA-B361 |
3 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
23 |
32 |
1.1,3.3 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
0 Cel |
BOTTOM |
3.3 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.18 MHz |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
16 |
16 |
16 |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP80,.55SQ,20 |
4.5 V |
85 Cel |
4 |
0 Cel |
QUAD |
1.6 mm |
544 |
12 mm |
YES |
16 |
40.96 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
12 mm |
1 |
CMOS |
76 mA |
5 V |
0 |
0 |
Digital Signal Processors |
MROM |
.5 mm |
FIXED POINT |
S-PQFP-G80 |
Not Qualified |
YES |
YES |
16 |
|||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
697 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.236 V |
20 |
32 |
1.2 |
GRID ARRAY, FINE PITCH |
BGA697,29X29,32 |
1.164 V |
90 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
3.242 mm |
32768 |
24 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66.6 MHz |
20 |
220 |
MULTIPLE |
24 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B697 |
4 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.31 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.19 V |
105 Cel |
4 |
-55 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
3.3 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
33 MHz |
NOT SPECIFIED |
220 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.25 V |
64 |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
0 Cel |
BOTTOM |
3.25 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
PIN/PEG |
570 |
SPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
1.44 V |
MIL-STD-883 Class Q |
23 |
32 |
GRID ARRAY, SHRINK PITCH |
1.36 V |
115 Cel |
4 |
-55 Cel |
PERPENDICULAR |
6 mm |
33.275 mm |
YES |
64 |
75 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
33.275 mm |
3 |
CMOS |
1.4 V |
64 |
1.27 mm |
FIXED POINT |
S-CPGA-P570 |
Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.35 V |
8 |
15 |
1.3,1.8/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.25 V |
70 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.05 mm |
499712 |
17 mm |
YES |
16 |
30 MHz |
30 |
260 |
SINGLE |
17 mm |
3 |
CMOS |
1.3 V |
40 |
Other Microprocessor ICs |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
456 rpm |
YES |
NO |
e1 |
||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
384 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
22 |
32 |
1.5,3.3 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
BGA384,22X22,32 |
1.425 V |
90 Cel |
0 Cel |
BOTTOM |
2.8 mm |
32768 |
18 mm |
YES |
32 |
250 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
18 mm |
CMOS |
1.5 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B384 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||
Texas Instruments |
OTHER |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
16 |
3.3 |
FLATPACK |
QFP100,.7X.9 |
85 Cel |
0 Cel |
QUAD |
1056 |
CMOS |
88 mA |
3.3 V |
Digital Signal Processors |
.635 mm |
FIXED POINT |
R-PQFP-G100 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
FLAT |
132 |
GQFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
5.25 V |
32 |
MIL-PRF-38535 Class Q |
24 |
32 |
5 |
FLATPACK, GUARD RING |
SPGA141,19X19 |
4.75 V |
95 Cel |
4 |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
2.92 mm |
2048 |
24.19 mm |
-55 TO 105 OPERATING CASE TEMPERATURE |
NO |
32 |
60 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
24.19 mm |
2 |
CMOS |
475 mA |
5 V |
1 |
Digital Signal Processors |
.64 mm |
FLOATING POINT |
S-CQFP-F132 |
Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
16 |
32 |
1.2,1.8,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.05 mm |
8192 |
17 mm |
YES |
16 |
30 MHz |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.2 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
23 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
100 Cel |
-55 Cel |
QUAD |
1.6 mm |
20 mm |
YES |
16 |
50 MHz |
MULTIPLE |
20 mm |
CMOS |
3.3 V |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
20 |
GRID ARRAY, FINE PITCH |
1.16 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
23 mm |
ALSO REQUIRES 3.3V SUPPLY FOR I/O |
YES |
64 |
850 MHz |
30 |
260 |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
144 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
13 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
QUAD |
1.2 mm |
20 mm |
YES |
32 |
25 MHz |
MULTIPLE |
20 mm |
CMOS |
1.2 V |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
NO |
NO |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
376 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
32 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA376,22X22,40 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
20480 |
23 mm |
YES |
32 |
30 MHz |
30 |
260 |
MULTIPLE |
23 mm |
5 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
MROM |
1 mm |
FIXED POINT |
S-PBGA-B376 |
3 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
|
Texas Instruments |
OTHER |
BALL |
697 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.25,1.5/1.8,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA697,29X29,32 |
90 Cel |
0 Cel |
BOTTOM |
8192 |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B697 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
GRID ARRAY |
1.14 V |
90 Cel |
0 Cel |
BOTTOM |
ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY |
YES |
0 |
300 MHz |
MULTIPLE |
CMOS |
1.2 V |
FLOATING POINT |
S-PBGA-B361 |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.16 V |
23 |
32 |
1.1,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.05 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.19 MHz |
30 |
260 |
MULTIPLE |
23 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
625 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
24 |
GRID ARRAY, FINE PITCH |
85 Cel |
0 Cel |
BOTTOM |
2.99 mm |
21 mm |
YES |
16 |
MULTIPLE |
21 mm |
CMOS |
.8 mm |
FLOATING POINT |
S-PBGA-B625 |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
23 |
32 |
1.4,3.3 |
GRID ARRAY, FINE PITCH |
BGA548,26X26,32 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.8 mm |
4096 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.19 MHz |
30 |
260 |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
32 |
24 |
32 |
5 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
4.75 V |
85 Cel |
4 |
0 Cel |
QUAD |
4.1 mm |
1024 |
28 mm |
NO |
32 |
40 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
28 mm |
2 |
CMOS |
600 mA |
5 V |
1 |
2 |
Digital Signal Processors |
MROM |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
NO |
YES |
32 |
|||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.44 V |
20 |
32 |
1.4,3.3 |
GRID ARRAY |
BGA548,26X26,40 |
1.36 V |
90 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.8 mm |
16384 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
133 MHz |
20 |
220 |
MULTIPLE |
27 mm |
CMOS |
1.4 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
20 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA548,26X26,32 |
1.14 V |
90 Cel |
4 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.8 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
100 MHz |
30 |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||
Texas Instruments |
OTHER |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
3.3 |
FLATPACK |
QFP144,.87SQ,20 |
85 Cel |
0 Cel |
QUAD |
7200 |
CMOS |
88 mA |
3.3 V |
Digital Signal Processors |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
24 |
32 |
5 |
GRID ARRAY |
BGA388,26X26,50 |
4.75 V |
85 Cel |
0 Cel |
BOTTOM |
2.5 mm |
8192 |
35 mm |
YES |
32 |
60 MHz |
20 |
220 |
MULTIPLE |
35 mm |
CMOS |
950 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B388 |
4 |
Not Qualified |
YES |
YES |
||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
256 |
GQFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1.32 V |
13 |
FLATPACK, GUARD RING |
1.14 V |
115 Cel |
-55 Cel |
GOLD |
QUAD |
3.21 mm |
36 mm |
NO |
32 |
25 MHz |
MULTIPLE |
36 mm |
CMOS |
1.2 V |
.5 mm |
FLOATING POINT |
S-CQFP-G256 |
Not Qualified |
YES |
NO |
e4 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
23 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
100 Cel |
-55 Cel |
QUAD |
1.6 mm |
14 mm |
YES |
16 |
40 MHz |
MULTIPLE |
14 mm |
CMOS |
3.3 V |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.44 V |
20 |
32 |
1.4,3.3 |
GRID ARRAY, FINE PITCH |
BGA179,14X14,32 |
1.36 V |
90 Cel |
4 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.8 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
133 MHz |
30 |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.4 V |
64 |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
240 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
22 |
16 |
1.6,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA240,17X17,32 |
1.55 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
1.4 mm |
32768 |
15 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
50 MHz |
MULTIPLE |
15 mm |
CMOS |
1.6 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B240 |
3 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
32 |
32 |
1.2,3.3 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
BGA532,26X26,32 |
1.14 V |
90 Cel |
4 |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
3.3 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3VI/O SUPPLY |
YES |
64 |
75.18 MHz |
NOT SPECIFIED |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
125 mA |
1.2 V |
64 |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
24 |
FLATPACK, FINE PITCH |
4.75 V |
85 Cel |
0 Cel |
QUAD |
4.1 mm |
28 mm |
NO |
32 |
27 MHz |
MULTIPLE |
28 mm |
CMOS |
5 V |
.5 mm |
FIXED POINT |
S-PQFP-G208 |
Not Qualified |
NO |
YES |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.16 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.05 V |
90 Cel |
0 Cel |
BOTTOM |
3.25 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
23 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
697 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2875 V |
32 |
32 |
1.25,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA697,29X29,32 |
1.2125 V |
90 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
3.242 mm |
262144 |
24 mm |
YES |
32 |
50 MHz |
20 |
220 |
MULTIPLE |
24 mm |
CMOS |
1.25 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B697 |
4 |
Not Qualified |
YES |
NO |
e0 |
|||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
352 |
HLBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
32 |
GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
1.7 mm |
35 mm |
YES |
64 |
120 MHz |
20 |
220 |
MULTIPLE |
35 mm |
CMOS |
3.3 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B352 |
4 |
Not Qualified |
NO |
YES |
e0 |
||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
23 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
3 V |
100 Cel |
-55 Cel |
BOTTOM |
1.4 mm |
12 mm |
YES |
16 |
50 MHz |
MULTIPLE |
12 mm |
CMOS |
3.3 V |
.8 mm |
FIXED POINT |
S-PBGA-B144 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.44 V |
20 |
32 |
1.4,3.3 |
GRID ARRAY, FINE PITCH |
BGA179,14X14,32 |
1.36 V |
90 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.8 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
133 MHz |
20 |
220 |
MULTIPLE |
23 mm |
CMOS |
1.4 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
384 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
22 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
1.425 V |
90 Cel |
0 Cel |
BOTTOM |
2.8 mm |
18 mm |
YES |
32 |
233 MHz |
MULTIPLE |
18 mm |
CMOS |
1.5 V |
.8 mm |
FIXED POINT |
S-PBGA-B384 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.89 V |
8 |
32 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA361,19X19,32 |
1.71 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
81920 |
16 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
27 MHz |
30 |
260 |
MULTIPLE |
16 mm |
5 |
CMOS |
1.8 V |
72 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
Not Qualified |
YES |
NO |
e1 |
8 |
|||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
14 |
16 |
3.3 |
GRID ARRAY |
BGA119,7X17,50 |
3 V |
85 Cel |
-20 Cel |
TIN LEAD |
BOTTOM |
2.27 mm |
8192 |
14 mm |
NO |
24 |
16.384 MHz |
MULTIPLE |
22 mm |
CMOS |
3.3 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
R-PBGA-B119 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
16 |
3.3 |
GRID ARRAY |
BGA119,7X17,50 |
3 V |
85 Cel |
-20 Cel |
TIN LEAD |
BOTTOM |
2.27 mm |
8192 |
14 mm |
NO |
16 |
16.384 MHz |
MULTIPLE |
22 mm |
CMOS |
3.3 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
R-PBGA-B119 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
452 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.25 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA452,36X36,50 |
4.75 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
5.08 mm |
524288 |
46.995 mm |
YES |
48 |
40 MHz |
MULTIPLE |
46.995 mm |
CMOS |
2200 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-CBGA-B452 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
16 |
3.3 |
GRID ARRAY |
BGA119,7X17,50 |
3 V |
85 Cel |
-20 Cel |
TIN LEAD |
BOTTOM |
2.27 mm |
16384 |
14 mm |
NO |
0 |
16.384 MHz |
MULTIPLE |
22 mm |
CMOS |
3.3 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
R-PBGA-B119 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
16 |
3.3 |
GRID ARRAY |
BGA119,7X17,50 |
3 V |
85 Cel |
-20 Cel |
TIN LEAD |
BOTTOM |
2.27 mm |
16384 |
14 mm |
NO |
16 |
16.384 MHz |
MULTIPLE |
22 mm |
CMOS |
3.3 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
R-PBGA-B119 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, MIXED |
OTHER |
BALL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
14 |
16 |
3.3 |
GRID ARRAY |
BGA119,7X17,50 |
3 V |
85 Cel |
-20 Cel |
TIN LEAD |
BOTTOM |
2.27 mm |
8192 |
14 mm |
ALSO REQUIRES 3.3V SUPPLY |
NO |
24 |
52 MHz |
225 |
MULTIPLE |
22 mm |
CMOS |
3.3 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
R-PBGA-B119 |
5 |
Not Qualified |
YES |
YES |
e0 |
Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.
DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.
DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.