OTHER Digital Signal Processors (DSPs) 1,031

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

ADSP-21566KBCZ4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

16

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

.95 V

110 Cel

0 Cel

BOTTOM

1.38 mm

163840

17 mm

YES

16

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

17 mm

10

CMOS

1 V

FLASH

.8 mm

FLOATING POINT

S-PBGA-B400

YES

YES

ADSP-BF525ABCZ-6

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,23X23,20

1.7 V

70 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

YES

16

50 MHz

260

MULTIPLE

12 mm

CMOS

1.8 V

Microprocessors

.5 mm

FIXED POINT

S-PBGA-B289

3

Not Qualified

600 rpm

YES

YES

e1

ADSP-21563BSWZ8

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

GULL WING

120

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

16

32

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP120,.63SQ,16

.95 V

110 Cel

0 Cel

DUAL

1.6 mm

163840

14 mm

YES

16

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

14 mm

6

CMOS

1 V

FLASH

.4 mm

FLOATING POINT

S-PQFP-G120

YES

YES

ADSP-21567KBCZ6

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

16

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

.95 V

110 Cel

0 Cel

BOTTOM

1.38 mm

163840

17 mm

YES

16

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

17 mm

10

CMOS

1 V

FLASH

.8 mm

FLOATING POINT

S-PBGA-B400

YES

YES

ADSP-BF525ABCZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,23X23,20

1.7 V

70 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

YES

16

100 MHz

260

MULTIPLE

12 mm

CMOS

1.8 V

Microprocessors

.5 mm

FIXED POINT

S-PBGA-B289

3

Not Qualified

500 rpm

YES

YES

e1

ADSP-21062KBZ-160

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

225

BGA

SQUARE

PLASTIC/EPOXY

YES

5.25 V

32

32

5

GRID ARRAY

BGA225,15X15,50

4.75 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.7 mm

2097152

23 mm

YES

48

40 MHz

260

MULTIPLE

23 mm

CMOS

5 V

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B225

3

Not Qualified

YES

YES

e1

ADSP-21062KSZ-133

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

GULL WING

240

HFQFP

SQUARE

PLASTIC/EPOXY

NO

YES

5.25 V

1

32

32

5

FLATPACK, HEAT SINK/SLUG, FINE PITCH

QFP240,1.3SQ,20

4.75 V

85 Cel

3

0 Cel

Matte Tin (Sn)

QUAD

4.1 mm

2M

32 mm

16/32 BIT PARALLEL HOST INTFC PORT; SINGLE CY INSTR EXECUTION; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED

YES

48

33.33 MHz

40

260

MULTIPLE

32 mm

1

CMOS

850 mA

5 V

10

2

Digital Signal Processors

.5 mm

FLOATING POINT

S-PQFP-G240

3

Not Qualified

YES

YES

e3

ADSP-21161N-KB-100X

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

OTHER

BALL

225

BGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

24

GRID ARRAY

1.71 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

1.9 mm

17 mm

YES

48

50 MHz

MULTIPLE

17 mm

CMOS

1.8 V

1 mm

FLOATING POINT

S-PBGA-B225

Not Qualified

NO

YES

e0

MSC8144EVT1000A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1.2,2.5,3.3

GRID ARRAY

BGA783,28X28,40

.97 V

90 Cel

0 Cel

Tin/Silver (Sn/Ag)

BOTTOM

3.176 mm

32768

29 mm

YES

133 MHz

30

245

MULTIPLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

NO

NO

e2

MSC8254SAG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1,1.5/1.8,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

105 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.94 mm

8192

29 mm

YES

30

245

SINGLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

e1

XCB56364PV100

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

GULL WING

112

LQFP

SQUARE

PLASTIC/EPOXY

YES

3.46 V

18

24

3.3

FLATPACK, LOW PROFILE

QFP112(UNSPEC)

3.14 V

105 Cel

0 Cel

QUAD

1.6 mm

2560

20 mm

YES

8

100 MHz

MULTIPLE

20 mm

CMOS

181 mA

3.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PQFP-G112

Not Qualified

YES

YES

MSC8144ESVT800A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1.2,2.5,3.3

GRID ARRAY

BGA783,28X28,40

.97 V

105 Cel

0 Cel

Tin/Silver (Sn/Ag)

BOTTOM

3.176 mm

32768

29 mm

YES

133 MHz

30

245

MULTIPLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

NO

NO

e2

XCB56364FU100

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.46 V

18

24

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

3.14 V

105 Cel

0 Cel

QUAD

1.7 mm

2560

14 mm

YES

8

100 MHz

MULTIPLE

14 mm

CMOS

181 mA

3.3 V

Digital Signal Processors

.5 mm

FIXED POINT

S-PQFP-G100

Not Qualified

YES

YES

MSC8252SAG1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1,1.5/1.8,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

105 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.94 mm

8192

29 mm

YES

30

245

SINGLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

e1

MSC8144ESVT1000A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1.2,2.5,3.3

GRID ARRAY

BGA783,28X28,40

.97 V

90 Cel

0 Cel

BOTTOM

3.176 mm

32768

29 mm

YES

133 MHz

30

245

MULTIPLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

NO

NO

MSC8144EVT800A

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

1.2,2.5,3.3

GRID ARRAY

BGA783,28X28,40

.97 V

105 Cel

0 Cel

Tin/Silver (Sn/Ag)

BOTTOM

3.176 mm

32768

29 mm

YES

133 MHz

30

245

MULTIPLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

NO

NO

e2

XCB56012BU95

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

0

24

5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

4.75 V

90 Cel

0 Cel

QUAD

1.7 mm

8448

14 mm

NO

0

95 MHz

MULTIPLE

14 mm

HCMOS

150 mA

5 V

Digital Signal Processors

.5 mm

FIXED POINT

S-PQFP-G100

Not Qualified

YES

MSC8156SVT1000B

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

32

1,2.5

GRID ARRAY

BGA783,28X28,40

.97 V

105 Cel

0 Cel

TIN SILVER COPPER OVER NICKEL

BOTTOM

3.94 mm

8192

29 mm

YES

0

30

245

MULTIPLE

29 mm

CMOS

1 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

YES

NO

MSC8103M1200F

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

332

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.7 V

32

16

1.6,3.3

GRID ARRAY, FINE PITCH

BGA332,19X19,32

1.55 V

75 Cel

-40 Cel

Tin/Lead/Silver (Sn/Pb/Ag)

BOTTOM

3.18 mm

262144

17 mm

YES

64

75 MHz

30

220

MULTIPLE

17 mm

CMOS

1.6 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B332

3

Not Qualified

YES

NO

e0

MSC8103VT1200F

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

332

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.7 V

32

16

1.6,3.3

GRID ARRAY, FINE PITCH

BGA332,19X19,32

1.55 V

75 Cel

-40 Cel

TIN SILVER COPPER OVER NICKEL

BOTTOM

3.18 mm

262144

17 mm

YES

64

75 MHz

30

250

MULTIPLE

17 mm

CMOS

1.6 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B332

3

Not Qualified

YES

NO

LSI403LP

Broadcom

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

1.35 V

18

FLATPACK, FINE PITCH

1.05 V

85 Cel

0 Cel

TIN LEAD

QUAD

4.1 mm

28 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

16 MHz

30

225

MULTIPLE

28 mm

CMOS

1.2 V

.5 mm

FIXED POINT

S-PQFP-G208

Not Qualified

YES

NO

e0

LSI403ZUP

Broadcom

OTHER

GULL WING

208

QFP

SQUARE

PLASTIC/EPOXY

YES

16

1.8,3.3

FLATPACK

QFP208,1.2SQ,20

85 Cel

0 Cel

QUAD

16384

CMOS

Digital Signal Processors

.5 mm

FIXED POINT

S-PQFP-G208

Not Qualified

LSI403Z

Broadcom

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

1.95 V

18

16

1.8,3.3

FLATPACK, FINE PITCH

QFP208,1.2SQ,20

1.65 V

85 Cel

0 Cel

TIN LEAD

QUAD

4.1 mm

16384

28 mm

TWO IDENTICAL 16-BIT ALUS OR A SINGLE 32-BIT ALU

YES

32

40 MHz

MULTIPLE

28 mm

CMOS

1.8 V

Digital Signal Processors

.5 mm

FIXED POINT

S-PQFP-G208

Not Qualified

YES

NO

e0

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.