Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Internal Bus Architecture | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Barrel Shifter | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
OTHER |
BALL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
16 |
3.3 |
GRID ARRAY |
BGA119,7X17,50 |
85 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
16384 |
CMOS |
3.3 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
R-PBGA-B119 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, MIXED |
OTHER |
BALL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
14 |
GRID ARRAY |
3 V |
85 Cel |
-20 Cel |
MATTE TIN |
BOTTOM |
2.27 mm |
14 mm |
ALSO REQUIRES 3.3V SUPPLY |
NO |
24 |
52 MHz |
MULTIPLE |
22 mm |
CMOS |
3.3 V |
1.27 mm |
FIXED POINT |
R-PBGA-B119 |
Not Qualified |
YES |
YES |
e3 |
|||||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
14 |
16 |
3.3 |
GRID ARRAY |
BGA119,7X17,50 |
3 V |
85 Cel |
-20 Cel |
TIN LEAD |
BOTTOM |
2.27 mm |
16384 |
14 mm |
NO |
24 |
16.384 MHz |
MULTIPLE |
22 mm |
CMOS |
3.3 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
R-PBGA-B119 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, MIXED |
OTHER |
BALL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
14 |
16 |
3.3 |
GRID ARRAY |
BGA119,7X17,50 |
3 V |
85 Cel |
-20 Cel |
TIN LEAD |
BOTTOM |
2.27 mm |
16384 |
14 mm |
ALSO REQUIRES 3.3V SUPPLY |
NO |
24 |
52 MHz |
225 |
MULTIPLE |
22 mm |
CMOS |
3.3 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
R-PBGA-B119 |
5 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
452 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.25 V |
32 |
32 |
5 |
GRID ARRAY |
BGA452,36X36,50 |
4.75 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
5.08 mm |
524288 |
46.995 mm |
YES |
48 |
40 MHz |
MULTIPLE |
46.995 mm |
CMOS |
3400 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-CBGA-B452 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, MIXED |
OTHER |
BALL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
14 |
GRID ARRAY |
3 V |
85 Cel |
-20 Cel |
TIN SILVER COPPER |
BOTTOM |
2.27 mm |
14 mm |
ALSO REQUIRES 3.3V SUPPLY |
NO |
24 |
52 MHz |
MULTIPLE |
22 mm |
CMOS |
3.3 V |
1.27 mm |
FIXED POINT |
R-PBGA-B119 |
3 |
Not Qualified |
YES |
YES |
e1 |
||||||||||||||||||||||||||||||||||
Analog Devices |
OTHER |
BALL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
16 |
3.3 |
GRID ARRAY |
BGA119,7X17,50 |
85 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
8192 |
CMOS |
3.3 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
R-PBGA-B119 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
16 |
3.3 |
GRID ARRAY |
BGA119,7X17,50 |
3 V |
85 Cel |
-20 Cel |
TIN LEAD |
BOTTOM |
2.27 mm |
8192 |
14 mm |
NO |
0 |
16.384 MHz |
MULTIPLE |
22 mm |
CMOS |
3.3 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
R-PBGA-B119 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
32 |
3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
3.13 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
16384 |
28 mm |
YES |
32 |
33.33 MHz |
240 |
MULTIPLE |
28 mm |
CMOS |
510 mA |
3.3 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
3 |
Not Qualified |
NO |
YES |
e0 |
|||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
260 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
26 |
32 |
1.5,3.3 |
GRID ARRAY |
BGA260,18X18,40 |
.86 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.5 mm |
32768 |
19 mm |
YES |
32 |
33.33 MHz |
MULTIPLE |
19 mm |
CMOS |
1.5 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B260 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA225,15X15,50 |
3.15 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.7 mm |
2097152 |
23 mm |
YES |
48 |
40 MHz |
260 |
MULTIPLE |
23 mm |
CMOS |
3.3 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
YES |
YES |
e1 |
|||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
32 |
3.3 |
GRID ARRAY |
BGA196,14X14,40 |
3.13 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
17408 |
15 mm |
YES |
32 |
33.33 MHz |
30 |
260 |
MULTIPLE |
15 mm |
CMOS |
3.3 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B196 |
3 |
Not Qualified |
NO |
YES |
e1 |
||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
4.75 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
4194304 |
32 mm |
16/32 BIT PARALLEL HOST INTFC PORT; SINGLE CY INSTR EXECUTION; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED |
YES |
48 |
33.33 MHz |
MULTIPLE |
32 mm |
CMOS |
5 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
Not Qualified |
YES |
YES |
e3 |
||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
1 |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
4.75 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
4M |
32 mm |
16/32 BIT PARALLEL HOST INTFC PORT; SINGLE CY INSTR EXECUTION; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED |
YES |
48 |
33.33 MHz |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
850 mA |
5 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
32 |
3.3 |
FLATPACK |
QFP208,1.2SQ,20 |
3 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
16384 |
YES |
32 |
30 MHz |
MULTIPLE |
CMOS |
3.3 V |
Digital Signal Processors |
.5 mm |
FIXED POINT |
S-PQFP-G208 |
Not Qualified |
NO |
YES |
e0 |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
32 |
16 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA400,20X20,32 |
.95 V |
110 Cel |
0 Cel |
BOTTOM |
1.38 mm |
163840 |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
10 |
CMOS |
1 V |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B400 |
3 |
YES |
YES |
||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
32 |
32 |
1.8/2,3.3 |
GRID ARRAY |
BGA400,20X20,50 |
1.8 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.49 mm |
131072 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
50 MHz |
MULTIPLE |
27 mm |
CMOS |
1.9 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B400 |
Not Qualified |
NO |
YES |
e0 |
|||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.45 V |
1 |
32 |
32 |
3.3 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
3.15 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
2M |
32 mm |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
530 mA |
3.3 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
32 |
32 |
1.9,3.3 |
GRID ARRAY |
BGA400,20X20,50 |
1.8 V |
85 Cel |
0 Cel |
BOTTOM |
2.49 mm |
131072 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
50 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
27 mm |
CMOS |
1.9 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B400 |
Not Qualified |
NO |
YES |
||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.63 V |
32 |
32 |
GRID ARRAY |
BGA400,20X20,50 |
2.37 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.49 mm |
131072 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
100 MHz |
MULTIPLE |
27 mm |
CMOS |
2.5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B400 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
32 |
3.3 |
GRID ARRAY |
BGA196,14X14,40 |
3.13 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
1.9 mm |
16384 |
15 mm |
YES |
32 |
30 MHz |
240 |
MULTIPLE |
15 mm |
CMOS |
470 mA |
3.3 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B196 |
3 |
Not Qualified |
NO |
YES |
e0 |
|||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
32 |
32 |
1.8/2,3.3 |
GRID ARRAY |
BGA400,20X20,50 |
1.8 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.49 mm |
131072 |
27 mm |
YES |
64 |
47.5 MHz |
MULTIPLE |
27 mm |
CMOS |
1400 mA |
1.9 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B400 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
32 |
3.3 |
FLATPACK |
QFP208,1.2SQ,20 |
3 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
16384 |
YES |
32 |
30 MHz |
MULTIPLE |
CMOS |
3.3 V |
Digital Signal Processors |
.5 mm |
FIXED POINT |
S-PQFP-G208 |
Not Qualified |
NO |
YES |
e0 |
|||||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
FLATPACK |
QFP240,1.3SQ,20 |
3.15 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
32768 |
YES |
48 |
40 MHz |
MULTIPLE |
CMOS |
600 mA |
3.3 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.63 V |
32 |
32 |
2.5,3.3 |
GRID ARRAY |
BGA400,20X20,50 |
2.37 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.49 mm |
131072 |
27 mm |
YES |
64 |
80 MHz |
225 |
MULTIPLE |
27 mm |
CMOS |
1410 mA |
2.5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B400 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA225,15X15,50 |
3.15 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.7 mm |
4194304 |
23 mm |
YES |
48 |
40 MHz |
MULTIPLE |
23 mm |
CMOS |
3.3 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
YES |
YES |
e1 |
||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
FLATPACK |
QFP240,1.3SQ,20 |
3.15 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
32768 |
YES |
48 |
33 MHz |
MULTIPLE |
CMOS |
600 mA |
3.3 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
1 |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
4.75 V |
85 Cel |
3 |
0 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
4.1 mm |
2M |
32 mm |
16/32 BIT PARALLEL HOST INTFC PORT; SINGLE CY INSTR EXECUTION; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED |
YES |
48 |
33.33 MHz |
30 |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
850 mA |
5 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
136 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
16 |
32 |
1.2,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA136,14X14,32 |
1.14 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
1.7 mm |
65536 |
12 mm |
YES |
16 |
66.66 MHz |
MULTIPLE |
12 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B136 |
Not Qualified |
NO |
YES |
e0 |
||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
16 |
32 |
1.2,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
1.14 V |
85 Cel |
0 Cel |
QUAD |
1.6 mm |
65536 |
20 mm |
YES |
16 |
66.66 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
20 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G144 |
Not Qualified |
NO |
YES |
|||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.45 V |
1 |
32 |
32 |
3.3 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
3.15 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
2M |
32 mm |
YES |
48 |
33.33 MHz |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
530 mA |
3.3 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.45 V |
1 |
32 |
32 |
3.3 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
3.15 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
4M |
32 mm |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
530 mA |
3.3 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA225,15X15,50 |
3.15 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.7 mm |
131072 |
23 mm |
YES |
48 |
40 MHz |
30 |
225 |
MULTIPLE |
23 mm |
CMOS |
600 mA |
3.3 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA225,15X15,50 |
3.15 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.7 mm |
65536 |
23 mm |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
23 mm |
CMOS |
600 mA |
3.3 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
1 |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
4.75 V |
85 Cel |
3 |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
2M |
32 mm |
40 MIPS; 16/32 BIT PARALLEL HOST INTERFACE PORT; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED |
YES |
48 |
40 MHz |
260 |
MULTIPLE |
32 mm |
1 |
CMOS |
850 mA |
5 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e3 |
|||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
32 |
32 |
1.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256(UNSPEC) |
.86 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
1.7 mm |
8192 |
27 mm |
YES |
32 |
300 MHz |
SINGLE |
27 mm |
CMOS |
1.5 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-PBGA-B256 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.45 V |
1 |
32 |
32 |
3.3 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
3.15 V |
85 Cel |
3 |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
2M |
32 mm |
YES |
48 |
33.33 MHz |
260 |
MULTIPLE |
32 mm |
1 |
CMOS |
530 mA |
3.3 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e3 |
||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
576 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
32 |
32 |
1.05,1.5,2.5 |
GRID ARRAY |
BGA576,24X24,40 |
1 V |
85 Cel |
0 Cel |
BOTTOM |
3.1 mm |
131072 |
25 mm |
YES |
32 |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
25 mm |
CMOS |
1.05 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B576 |
Not Qualified |
NO |
YES |
||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
32 |
3.3 |
GRID ARRAY |
BGA196,14X14,40 |
3.13 V |
85 Cel |
0 Cel |
Tin/Lead/Silver (Sn/Pb/Ag) |
BOTTOM |
1.9 mm |
17408 |
15 mm |
YES |
32 |
33.33 MHz |
30 |
240 |
MULTIPLE |
15 mm |
CMOS |
510 mA |
3.3 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B196 |
3 |
Not Qualified |
NO |
YES |
e0 |
||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
32 |
5 |
GRID ARRAY |
BGA225,15X15,50 |
4.75 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.7 mm |
65536 |
23 mm |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
23 mm |
CMOS |
850 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.63 V |
32 |
32 |
2.5/3.3 |
GRID ARRAY |
BGA400,20X20,50 |
2.37 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.3 mm |
131072 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
50 MHz |
MULTIPLE |
27 mm |
CMOS |
2.5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B400 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.45 V |
1 |
32 |
32 |
3.3 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
3.15 V |
85 Cel |
3 |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
4M |
32 mm |
YES |
48 |
40 MHz |
260 |
MULTIPLE |
32 mm |
1 |
CMOS |
530 mA |
3.3 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e3 |
||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.45 V |
1 |
32 |
32 |
3.3 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
3.15 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
4M |
32 mm |
YES |
48 |
33.33 MHz |
MULTIPLE |
32 mm |
1 |
CMOS |
530 mA |
3.3 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
1 |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
4.75 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
2M |
32 mm |
40 MIPS; 16/32 BIT PARALLEL HOST INTERFACE PORT; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
850 mA |
5 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
32 |
3.3 |
GRID ARRAY |
BGA196,14X14,40 |
3.13 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
17408 |
15 mm |
YES |
32 |
30 MHz |
260 |
MULTIPLE |
15 mm |
CMOS |
3.3 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B196 |
3 |
Not Qualified |
NO |
YES |
e1 |
|||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
GRID ARRAY |
PGA225,15X15 |
3.15 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.57 mm |
32768 |
23 mm |
YES |
48 |
44 MHz |
MULTIPLE |
23 mm |
CMOS |
535 mA |
3.3 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
Not Qualified |
NO |
YES |
e0 |
|||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
32 |
5 |
GRID ARRAY |
BGA225,15X15,50 |
4.75 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.7 mm |
131072 |
23 mm |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
23 mm |
CMOS |
850 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
3.15 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
4194304 |
32 mm |
YES |
48 |
33.33 MHz |
MULTIPLE |
32 mm |
CMOS |
3.3 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
Not Qualified |
YES |
YES |
e3 |
Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.
DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.
DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.