OTHER Digital Signal Processors (DSPs) 1,031

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-21160MKBZ-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V			32	32	2.5,3.3	GRID ARRAY	BGA400,20X20,50	2.37 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.49 mm		131072	27 mm		YES	64	80 MHz		260	MULTIPLE	27 mm		CMOS		2.5 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B400	3	Not Qualified	YES	YES	e1
ADSP-21565KSWZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	120	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		16	32		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP120,.63SQ,16	.95 V	110 Cel		0 Cel		DUAL	1.6 mm		163840	14 mm		YES	16		30	260	MULTIPLE	14 mm	6	CMOS		1 V				FLASH	.4 mm	FLOATING POINT	S-PQFP-G120	3		YES	YES
SM320C6678ACYPW	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	OTHER	BALL	841	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			24			GRID ARRAY, FINE PITCH		.95 V	115 Cel		-55 Cel	TIN SILVER COPPER	BOTTOM	3.39 mm			24 mm		YES	16	312.5 MHz	30	245	SINGLE	24 mm	16	CMOS		1 V	80				.8 mm	FLOATING POINT	S-PBGA-B841	4		YES	NO	e1
TMS320C6472ECTZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		14	32	1.1,1.8,3.3	GRID ARRAY, FINE PITCH	BGA737,29X29,32	.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm		8192	24 mm		YES	32	50 MHz	30	245	MULTIPLE	24 mm	14	CMOS		1 V	64		Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B737	4	Not Qualified	YES	NO	e1	8
TMS320C6747DZKBD4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			15	32	1.3,1.8,3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	70 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm		8192	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	4	CMOS		1.3 V	40		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	YES	NO	e1
TMS32C6415EZLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V			32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel	4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm		16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3	CMOS	125 mA	1.4 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1
TMX320C80GF60	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	PIN/PEG	305	HIPGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		NO	3.465 V			32			GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH		3.135 V	85 Cel		0 Cel		PERPENDICULAR	5.59 mm			47.245 mm		YES	64	120 MHz			MULTIPLE	47.245 mm		CMOS		3.3 V					2.54 mm	FLOATING POINT	S-CPGA-P305		Not Qualified	NO	YES
SMJ32010FDS	Texas Instruments		OTHER	NO LEAD	44	QCCN	SQUARE	CERAMIC		YES			38535Q/M;38534H;883B		16	5	CHIP CARRIER	LCC44,.65SQ		100 Cel		-55 Cel		QUAD			144											MOS	275 mA	5 V			Digital Signal Processors		1.27 mm	FIXED POINT	S-XQCC-N44		Not Qualified
TMX320C30PPM	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V			24			FLATPACK, FINE PITCH		4.75 V	85 Cel		0 Cel		QUAD	4.1 mm			28 mm		NO	32				MULTIPLE	28 mm		CMOS		5 V					.5 mm	FIXED POINT	S-PQFP-G208		Not Qualified	NO	YES
TNETV2665FIBZWT6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TMX320C6670AXCYP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	841	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V						GRID ARRAY, FINE PITCH		.95 V	85 Cel		0 Cel		BOTTOM	3.39 mm			24 mm		YES					SINGLE	24 mm		CMOS		1 V					.8 mm	FLOATING POINT	S-PBGA-B841			YES	NO
TNETV2665ZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
SMJ320C40GFS60	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	PIN/PEG	325	SPGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	5.25 V		MIL-PRF-38535	31	32	5	GRID ARRAY, SHRINK PITCH	SPGA325,35X35MOD	4.75 V	100 Cel		-55 Cel	TIN LEAD	PERPENDICULAR	5.08 mm	4G	8192	47.245 mm		YES	32	60 MHz			MULTIPLE	47.245 mm	2	CMOS	850 mA	5 V	6		Digital Signal Processors		1.27 mm	FLOATING POINT	S-CPGA-P325		Not Qualified	YES	YES	e0
TNETV2685FIDZUT5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			14			GRID ARRAY, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm			19 mm		YES	32		30	245	MULTIPLE	19 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B520	4		YES	NO	e1
V62/04603-03XA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			22	32	1.3,3.3	GRID ARRAY	BGA272,20X20,50	1.2 V	105 Cel	4	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.57 mm		65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	NOT SPECIFIED	220	MULTIPLE	27 mm	2	CMOS		1.26 V	16		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	YES	NO	e0
SMJ32020FJS	Texas Instruments		OTHER	J BEND	68	QCCJ	SQUARE	CERAMIC		YES			38535Q/M;38534H;883B		16		CHIP CARRIER	LDCC68,1.0SQ		100 Cel		-55 Cel		QUAD			544											MOS	400 mA				Digital Signal Processors		1.27 mm	FIXED POINT	S-XQCC-J68		Not Qualified
TMX320DM6435CZDUA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	376	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			24			GRID ARRAY		1.14 V	90 Cel		0 Cel		BOTTOM	2.48 mm			23 mm		YES	8	27 MHz			SINGLE	23 mm		CMOS		1.2 V					1 mm	FIXED POINT	S-PBGA-B376			YES	NO
TMX320C44-50PDB	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	304	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	8		24	32	5	FLATPACK	HQFP304,1.7SQ,20	4.75 V	85 Cel	5	0 Cel		QUAD			4096		4 COMMUNICATION PORTS	YES	32	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE		2	CMOS	850 mA	5 V	6	0	Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G304		Not Qualified	NO	YES
TNETV2665VIDZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2664FIBZWT	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
8405301QX	Texas Instruments		OTHER	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC		NO			38535Q/M;38534H;883B		16	5	IN-LINE	DIP40,.6		110 Cel		-55 Cel		DUAL			144											MOS	300 mA	5 V			Digital Signal Processors		2.54 mm	FIXED POINT	R-XDIP-T40		Not Qualified
TMX320C6727GDH	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			32	32	1.2,3.3	GRID ARRAY	BGA256,16X16,50	1.14 V	90 Cel		0 Cel		BOTTOM	2.02 mm		262144	17 mm	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	YES	32	25 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS		1.2 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	NO
TMX320DM8148BCYE0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V			8			GRID ARRAY, FINE PITCH		1.05 V	90 Cel		0 Cel		BOTTOM				23 mm		YES	16	30 MHz			MULTIPLE	23 mm		CMOS		1.1 V					.8 mm	FLOATING POINT	S-PBGA-B684			YES	NO
TMX320C6211GFN	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			22	32	1.8,3.3	GRID ARRAY	BGA256,20X20,50	1.71 V	90 Cel		0 Cel		BOTTOM	2.32 mm		65536	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32		NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS		1.8 V			Digital Signal Processors		1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	YES	NO
TMX320C6414TGLZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V			23	32	1.1,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel		0 Cel		BOTTOM	3.3 mm		262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			MULTIPLE	23 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
SMJ32020FDS	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	NO LEAD	68	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES				16			CHIP CARRIER			100 Cel		-55 Cel		QUAD	3.05 mm			24.13 mm		NO	16					24.13 mm		NMOS		5 V					1.27 mm	FIXED POINT	S-CQCC-N68		Not Qualified	NO	YES
TNETV2665FIDZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TMX320VC5510AGGW1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	240	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V			22			GRID ARRAY, LOW PROFILE, FINE PITCH		1.55 V	85 Cel		0 Cel		BOTTOM	1.4 mm			15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	50 MHz			MULTIPLE	15 mm		CMOS		1.6 V					.8 mm	FIXED POINT	S-PBGA-B240		Not Qualified	YES	NO
TNETV2685VIDZUT11	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			14			GRID ARRAY, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm			19 mm		YES	32		30	245	MULTIPLE	19 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B520	4		YES	NO	e1
TNETV2685FIBZUT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			14			GRID ARRAY, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm			19 mm		YES	32	720 MHz	30	245	MULTIPLE	19 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B520	4		YES	NO	e1
TNETV6421INZDU4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	376	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			22			GRID ARRAY		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm			23 mm		YES	8	30 MHz	30	260	MULTIPLE	23 mm		CMOS		1.2 V					1 mm	FIXED POINT	S-PBGA-B376	3		YES	NO	e1
TNETV2842VNDGGU	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	169	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.55 V	85 Cel		0 Cel	TIN LEAD	BOTTOM	1.4 mm			12 mm		YES	0		20	220	MULTIPLE	12 mm		CMOS		1.6 V					.8 mm	FIXED POINT	S-PBGA-B169	3		YES	NO	e0
SMJ320C6701GLPW14	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	429	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.99 V		MIL-PRF-38535	22	32	1.9,3.3	GRID ARRAY	BGA429,21X21,50	1.81 V	115 Cel	4	-55 Cel	TIN LEAD	BOTTOM	3.3 mm		16384	27 mm	-55 TO 115 OPERATING CASE TEMPERATURE	YES	32	140.84 MHz			MULTIPLE	27 mm	2	CMOS		1.9 V	4		Digital Signal Processors	FLASH	1.27 mm	FLOATING POINT	S-CBGA-B429		Not Qualified	YES	NO	e0
TNETV2667FIBZWT	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2685FIDZUT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			14			GRID ARRAY, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm			19 mm		YES	32	720 MHz	30	245	MULTIPLE	19 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B520	4		YES	NO	e1
TNETV1644ZDU6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	376	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm			23 mm	EMIF 22 ADDRESS AND 8 DATA BUS AVAILABLE	YES	32	27 MHz	30	260	MULTIPLE	23 mm		CMOS		1.2 V					1 mm	FIXED POINT	S-PBGA-B376	3		YES	NO	e1
TMX320C6726RFP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	144	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1.32 V			32	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	90 Cel		0 Cel		QUAD	1.2 mm		262144	20 mm	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	YES	32	25 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	20 mm		CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified	NO	NO
TMX320C6472CZTZ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V			14	32	1.2,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA737,29X29,32	1.05 V	85 Cel		0 Cel		BOTTOM	3.242 mm		8192	24 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	YES	32	625 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS		1.1 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B737		Not Qualified	YES	NO
TMX320TCI6486BGTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			0			GRID ARRAY, FINE PITCH		.95 V	85 Cel		0 Cel		BOTTOM	3.242 mm			24 mm		YES	0	50 MHz			MULTIPLE	24 mm		CMOS		1 V					.8 mm	FIXED POINT	S-PBGA-B737			YES	NO
TMX320C82GGP60	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	3.465 V			32			GRID ARRAY, HEAT SINK/SLUG		3.165 V	85 Cel		0 Cel		BOTTOM	1.7 mm			35 mm		YES	64	60 MHz			MULTIPLE	35 mm		CMOS		3.3 V					1.27 mm	FLOATING POINT	S-PBGA-B352		Not Qualified	NO	YES
SMJ320C6201BGLPW15	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	429	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.89 V		MIL-PRF-38535	20	32	1.8,3.3	GRID ARRAY	BGA429,21X21,50	1.71 V	115 Cel	4	-55 Cel	TIN LEAD	BOTTOM	3.3 mm		16384	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	150 MHz			MULTIPLE	27 mm	2	CMOS		1.8 V	4		Digital Signal Processors		1.27 mm	FIXED POINT	S-CBGA-B429		Not Qualified	YES	NO	e0
TNETV2664FIDZWT	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TMX320VC5510GGW2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	240	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V			22			GRID ARRAY, LOW PROFILE, FINE PITCH		1.55 V	85 Cel		0 Cel		BOTTOM	1.4 mm			15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	50 MHz			MULTIPLE	15 mm		CMOS		1.6 V					.8 mm	FIXED POINT	S-PBGA-B240		Not Qualified	YES	NO
SMJ320C31HFGS60	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	FLAT	132	GQFF	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	5.25 V	32	MIL-PRF-38535	24	32	5	FLATPACK, GUARD RING	SPGA141,19X19	4.75 V	95 Cel	4	-55 Cel	Tin/Lead (Sn/Pb)	QUAD	2.92 mm		2048	24.19 mm	-55 TO 105 OPERATING CASE TEMPERATURE	NO	32	60 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24.19 mm	2	CMOS	475 mA	5 V	1		Digital Signal Processors		.64 mm	FLOATING POINT	S-CQFP-F132		Not Qualified	YES	YES	e0
TNETV2667FIDZWT	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TMX320C6472CZTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			14	32	1.2,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA737,29X29,32	.95 V	85 Cel		0 Cel		BOTTOM	3.242 mm		8192	24 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	YES	32	500 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS		1 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B737		Not Qualified	YES	NO
TNETV2685FIBZUT9	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			14			GRID ARRAY, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm			19 mm		YES	32	900 MHz	30	245	MULTIPLE	19 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B520	4		YES	NO	e1
TMX320C6424AZDU	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			32	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	90 Cel		0 Cel		BOTTOM	2.48 mm		81920	23 mm		YES	32	30 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm		CMOS		1.2 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B376		Not Qualified	YES	NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.