Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Internal Bus Architecture | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Barrel Shifter | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
OTHER |
BALL |
352 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
32 |
GRID ARRAY, HEAT SINK/SLUG |
3.165 V |
85 Cel |
0 Cel |
BOTTOM |
1.7 mm |
35 mm |
YES |
64 |
MULTIPLE |
35 mm |
CMOS |
3.3 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B352 |
Not Qualified |
NO |
YES |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
NO LEAD |
325 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
5.25 V |
38535Q/M;38534H;883B |
31 |
32 |
5 |
UNCASED CHIP |
TAB,325PINS,.01 |
4.75 V |
100 Cel |
-55 Cel |
UPPER |
8192 |
YES |
32 |
60 MHz |
MULTIPLE |
CMOS |
850 mA |
5 V |
Digital Signal Processors |
.254 mm |
FLOATING POINT |
X-XUUC-N325 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
13 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
YES |
32 |
30 MHz |
30 |
260 |
MULTIPLE |
16 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
14 |
GRID ARRAY, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
19 mm |
YES |
32 |
900 MHz |
30 |
245 |
MULTIPLE |
19 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
4 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
OTHER |
BALL |
841 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
32 |
1,1.5,1.8 |
GRID ARRAY, FINE PITCH |
BGA841,29X29,32 |
.95 V |
85 Cel |
0 Cel |
BOTTOM |
3.39 mm |
32768 |
24 mm |
YES |
MULTIPLE |
24 mm |
CMOS |
1 V |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B841 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
144 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
32 |
32 |
1.2,3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
1.14 V |
90 Cel |
0 Cel |
QUAD |
1.2 mm |
262144 |
20 mm |
32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
20 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G144 |
Not Qualified |
NO |
NO |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
13 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
YES |
32 |
30 MHz |
30 |
260 |
MULTIPLE |
16 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA361,19X19,32 |
1.14 V |
90 Cel |
0 Cel |
BOTTOM |
1.4 mm |
81920 |
16 mm |
YES |
32 |
30 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
16 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
14 |
GRID ARRAY, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
19 mm |
YES |
32 |
30 |
245 |
MULTIPLE |
19 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
4 |
YES |
NO |
e1 |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
14 |
GRID ARRAY, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
19 mm |
YES |
32 |
900 MHz |
30 |
245 |
MULTIPLE |
19 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
4 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
737 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
14 |
32 |
1.2,1.5/1.8,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA737,29X29,32 |
1.14 V |
85 Cel |
0 Cel |
BOTTOM |
3.242 mm |
8192 |
24 mm |
ALSO REQUIRES 3.3 V I/O SUPPLY |
YES |
32 |
700 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
24 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B737 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
376 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA376,22X22,40 |
1.14 V |
90 Cel |
0 Cel |
BOTTOM |
2.48 mm |
81920 |
23 mm |
YES |
32 |
30 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B376 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
24 |
GRID ARRAY |
1.14 V |
90 Cel |
0 Cel |
BOTTOM |
2.48 mm |
23 mm |
YES |
16 |
30 MHz |
SINGLE |
23 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B376 |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
NO LEAD |
325 |
DIE |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
38535Q/M;38534H;883B |
31 |
32 |
5 |
UNCASED CHIP |
TAB,325PINS,.01 |
4.75 V |
100 Cel |
-55 Cel |
UPPER |
8192 |
YES |
32 |
60 MHz |
MULTIPLE |
CMOS |
850 mA |
5 V |
Digital Signal Processors |
.254 mm |
FIXED POINT |
S-XUUC-N325 |
Not Qualified |
NO |
YES |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
23 |
32 |
1,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
.95 V |
90 Cel |
0 Cel |
BOTTOM |
3.3 mm |
16384 |
23 mm |
YES |
32 |
300 MHz |
MULTIPLE |
23 mm |
CMOS |
1 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
288 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA288,22X22,20 |
1.14 V |
90 Cel |
0 Cel |
BOTTOM |
2.8 mm |
131072 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
100 MHz |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B288 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||
Texas Instruments |
OTHER |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
38535Q/M;38534H;883B |
16 |
5 |
IN-LINE |
DIP40,.6 |
100 Cel |
-55 Cel |
DUAL |
144 |
MOS |
275 mA |
5 V |
Digital Signal Processors |
2.54 mm |
FIXED POINT |
R-XDIP-T40 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.26 V |
14 |
16 |
1.2/1.6,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
1.14 V |
85 Cel |
5 |
-55 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
32768 |
20 mm |
YES |
16 |
30 |
260 |
SINGLE |
20 mm |
3 |
CMOS |
1.2 V |
6 |
Digital Signal Processors |
MROM |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
4 |
YES |
NO |
e4 |
16 |
||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
NO LEAD |
325 |
DIE |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
38535Q/M;38534H;883B |
31 |
32 |
5 |
UNCASED CHIP |
TAB,325PINS,.01 |
4.75 V |
100 Cel |
-55 Cel |
UPPER |
8192 |
YES |
32 |
60 MHz |
MULTIPLE |
CMOS |
850 mA |
5 V |
Digital Signal Processors |
.254 mm |
FIXED POINT |
S-XUUC-N325 |
Not Qualified |
NO |
YES |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
NO LEAD |
325 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
31 |
UNCASED CHIP |
100 Cel |
-55 Cel |
UPPER |
YES |
32 |
50 MHz |
MULTIPLE |
CMOS |
FLOATING POINT |
X-XUUC-N325 |
Not Qualified |
NO |
YES |
||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
352 |
HLBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
32 |
GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE |
3.135 V |
85 Cel |
0 Cel |
BOTTOM |
1.7 mm |
35 mm |
YES |
64 |
MULTIPLE |
35 mm |
CMOS |
3.3 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B352 |
Not Qualified |
NO |
YES |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
452 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.62 V |
22 |
GRID ARRAY |
2.38 V |
90 Cel |
0 Cel |
BOTTOM |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
SINGLE |
CMOS |
2.5 V |
FIXED POINT |
S-PBGA-B452 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
13 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
YES |
32 |
30 MHz |
30 |
260 |
MULTIPLE |
16 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
13 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
YES |
32 |
30 MHz |
30 |
260 |
MULTIPLE |
16 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
352 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
22 |
32 |
1.9,3.3 |
GRID ARRAY |
BGA352,26X26,50 |
1.71 V |
90 Cel |
0 Cel |
BOTTOM |
3.5 mm |
65536 |
35 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
120.48 MHz |
MULTIPLE |
35 mm |
CMOS |
1.8 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B352 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
14 |
GRID ARRAY, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
19 mm |
YES |
32 |
900 MHz |
30 |
245 |
MULTIPLE |
19 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
4 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
13 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
YES |
32 |
30 MHz |
30 |
260 |
MULTIPLE |
16 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
32 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA256,16X16,50 |
1.14 V |
90 Cel |
0 Cel |
BOTTOM |
2.02 mm |
262144 |
17 mm |
32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
17 mm |
CMOS |
1.2 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
NO |
NO |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
13 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
YES |
32 |
30 MHz |
30 |
260 |
MULTIPLE |
16 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
13 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
YES |
32 |
30 MHz |
30 |
260 |
MULTIPLE |
16 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
13 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
YES |
32 |
30 MHz |
30 |
260 |
MULTIPLE |
16 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
24 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
BOTTOM |
1.4 mm |
16 mm |
YES |
8 |
27 MHz |
SINGLE |
16 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
23 |
32 |
1.2,1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA361,19X19,25 |
1.14 V |
90 Cel |
0 Cel |
BOTTOM |
1.3 mm |
8192 |
13 mm |
YES |
16 |
30 MHz |
SINGLE |
13 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.65 mm |
FLOATING POINT |
S-PBGA-B361 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
14 |
GRID ARRAY, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
19 mm |
YES |
32 |
30 |
245 |
MULTIPLE |
19 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
4 |
YES |
NO |
e1 |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
13 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
YES |
32 |
30 MHz |
30 |
260 |
MULTIPLE |
16 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
23 |
32 |
1.1,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
0 Cel |
BOTTOM |
3.25 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75 MHz |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
352 |
HLBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
32 |
GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE |
3.135 V |
85 Cel |
0 Cel |
BOTTOM |
1.7 mm |
35 mm |
YES |
64 |
120 MHz |
MULTIPLE |
35 mm |
CMOS |
3.3 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B352 |
Not Qualified |
NO |
YES |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
PIN/PEG |
305 |
HIPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
3.465 V |
32 |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
3.135 V |
85 Cel |
0 Cel |
PERPENDICULAR |
5.59 mm |
47.245 mm |
YES |
64 |
100 MHz |
MULTIPLE |
47.245 mm |
CMOS |
3.3 V |
2.54 mm |
FLOATING POINT |
S-CPGA-P305 |
Not Qualified |
NO |
YES |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
240 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
22 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.55 V |
85 Cel |
0 Cel |
BOTTOM |
1.4 mm |
15 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
50 MHz |
MULTIPLE |
15 mm |
CMOS |
1.6 V |
.8 mm |
FIXED POINT |
S-PBGA-B240 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
FLAT |
164 |
GQFF |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
3.6 V |
MIL-PRF-38535 |
23 |
16 |
3.3 |
FLATPACK, GUARD RING |
QFL164,1.2SQ,25 |
3 V |
115 Cel |
-55 Cel |
QUAD |
3.3 mm |
65536 |
28.705 mm |
YES |
16 |
20 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
28.705 mm |
CMOS |
3.3 V |
Digital Signal Processors |
.64 mm |
FIXED POINT |
S-GQFP-F164 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
737 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY, FINE PITCH |
.95 V |
85 Cel |
0 Cel |
BOTTOM |
3.242 mm |
24 mm |
YES |
0 |
50 MHz |
MULTIPLE |
24 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B737 |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
256 |
GQFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.32 V |
38535V;38534K;883S |
13 |
32 |
1.2 |
FLATPACK, GUARD RING |
TPAK256,3SQ,20 |
1.14 V |
115 Cel |
-55 Cel |
GOLD |
QUAD |
3.21 mm |
65536 |
36 mm |
NO |
32 |
25 MHz |
MULTIPLE |
36 mm |
100k Rad(Si) |
CMOS |
1.2 V |
1 |
Digital Signal Processors |
MROM |
.5 mm |
FLOATING POINT |
S-CQFP-G256 |
Not Qualified |
YES |
NO |
e4 |
8 |
||||||||||||||||||||||||||
Texas Instruments |
OTHER |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
38535Q/M;38534H;883B |
16 |
5 |
IN-LINE |
DIP40,.6 |
100 Cel |
-55 Cel |
DUAL |
144 |
MOS |
275 mA |
5 V |
Digital Signal Processors |
2.54 mm |
FIXED POINT |
R-XDIP-T40 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
23 |
32 |
1.1,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
0 Cel |
BOTTOM |
3.3 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
100 MHz |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
NO |
NO |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
13 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
YES |
32 |
30 MHz |
30 |
260 |
MULTIPLE |
16 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
13 |
GRID ARRAY |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
YES |
32 |
30 MHz |
30 |
260 |
MULTIPLE |
CMOS |
1.2 V |
FIXED POINT |
S-PBGA-B376 |
3 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
304 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
8 |
24 |
32 |
5 |
FLATPACK |
HQFP304,1.7SQ,20 |
4.75 V |
85 Cel |
5 |
0 Cel |
QUAD |
4096 |
4 COMMUNICATION PORTS |
YES |
32 |
40 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
2 |
CMOS |
850 mA |
5 V |
6 |
0 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G304 |
Not Qualified |
NO |
YES |
|||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
0 Cel |
BOTTOM |
3.3 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.18 MHz |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.
DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.
DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.