Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Internal Bus Architecture | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Barrel Shifter | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
288 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.57 V |
8 |
32 |
32 |
1.5,3.3,5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA288,19X19,32 |
1.43 V |
90 Cel |
4 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16384 |
16 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
200 MHz |
30 |
260 |
MULTIPLE |
16 mm |
2 |
CMOS |
1.5 V |
4 |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B288 |
3 |
Not Qualified |
YES |
NO |
e1 |
8 |
|||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
23 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
100 Cel |
-55 Cel |
QUAD |
1.6 mm |
14 mm |
YES |
16 |
50 MHz |
MULTIPLE |
14 mm |
CMOS |
3.3 V |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
32 |
1.2,1.8,3.3 |
GRID ARRAY |
BGA376,22X22,40 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
61440 |
23 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
27 MHz |
30 |
260 |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B376 |
3 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
32 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.02 mm |
262144 |
17 mm |
32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY |
YES |
32 |
25 MHz |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.2 V |
16 |
Digital Signal Processors |
MROM |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
NO |
NO |
e1 |
8 |
||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
625 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
24 |
GRID ARRAY, FINE PITCH |
85 Cel |
0 Cel |
BOTTOM |
2.99 mm |
21 mm |
YES |
16 |
MULTIPLE |
21 mm |
CMOS |
.8 mm |
FLOATING POINT |
S-PBGA-B625 |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
OTHER |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
23 |
16 |
1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA257,19X19,32 |
1.71 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16384 |
16 mm |
ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY |
YES |
32 |
100 MHz |
30 |
260 |
MULTIPLE |
16 mm |
CMOS |
1.8 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B257 |
3 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.44 V |
32 |
32 |
1.4,3.3 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
BGA532,26X26,32 |
1.36 V |
90 Cel |
0 Cel |
BOTTOM |
3.3 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3VI/O SUPPLY |
YES |
64 |
75.18 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
23 mm |
CMOS |
1.4 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
352 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
22 |
GRID ARRAY, HEAT SINK/SLUG |
1.71 V |
90 Cel |
0 Cel |
BOTTOM |
3.8 mm |
27 mm |
YES |
32 |
300 MHz |
MULTIPLE |
27 mm |
CMOS |
1.8 V |
1 mm |
FIXED POINT |
S-PBGA-B352 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
23 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
100 Cel |
-55 Cel |
QUAD |
1.6 mm |
20 mm |
YES |
16 |
66 MHz |
MULTIPLE |
20 mm |
CMOS |
3.3 V |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.16 V |
23 |
32 |
1.1,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.05 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.25 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75 MHz |
30 |
260 |
MULTIPLE |
23 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
23 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
100 Cel |
-55 Cel |
QUAD |
1.6 mm |
14 mm |
YES |
16 |
40 MHz |
MULTIPLE |
14 mm |
CMOS |
3.3 V |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
NO LEAD |
325 |
DIE |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
31 |
32 |
5 |
UNCASED CHIP |
TAB,325PINS,.01 |
4.75 V |
85 Cel |
-25 Cel |
UPPER |
8192 |
YES |
32 |
50 MHz |
MULTIPLE |
CMOS |
850 mA |
5 V |
Digital Signal Processors |
.254 mm |
FLOATING POINT |
S-XUUC-N325 |
Not Qualified |
YES |
YES |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
737 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.16 V |
0 |
32 |
1,1.2,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA737,29X29,32 |
1.05 V |
85 Cel |
0 Cel |
BOTTOM |
3.242 mm |
8192 |
24 mm |
YES |
0 |
50 MHz |
MULTIPLE |
24 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B737 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
144 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
32 |
32 |
1.2,3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP144,.9SQ |
1.14 V |
90 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.2 mm |
262144 |
20 mm |
32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY |
YES |
32 |
25 MHz |
30 |
260 |
MULTIPLE |
20 mm |
CMOS |
1.2 V |
16 |
Digital Signal Processors |
MROM |
.5 mm |
FLOATING POINT |
S-PQFP-G144 |
4 |
Not Qualified |
NO |
NO |
e4 |
8 |
||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
23 |
32 |
1.1,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.25 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75 MHz |
30 |
260 |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
240 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.65 V |
16 |
22 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA240,17X17,32 |
1.55 V |
85 Cel |
6 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
163840 |
15 mm |
YES |
32 |
50 MHz |
30 |
260 |
MULTIPLE |
15 mm |
2 |
CMOS |
1.6 V |
6 |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B240 |
3 |
YES |
NO |
e1 |
16 |
||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
FLAT |
132 |
GQFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.25 V |
MIL-PRF-38535 Class Q |
24 |
FLATPACK, GUARD RING |
4.75 V |
95 Cel |
-55 Cel |
QUAD |
2.92 mm |
24.19 mm |
-55 TO 105 OPERATING CASE TEMPERATURE |
NO |
32 |
60 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
24.19 mm |
CMOS |
5 V |
.635 mm |
FLOATING POINT |
S-CQFP-F132 |
Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
841 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
24 |
32 |
1,1.5,1.8 |
GRID ARRAY, FINE PITCH |
BGA841,29X29,32 |
.95 V |
85 Cel |
0 Cel |
BOTTOM |
3.39 mm |
8192 |
24 mm |
YES |
16 |
312.5 MHz |
MULTIPLE |
24 mm |
CMOS |
1 V |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B841 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.44 V |
20 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA548,26X26,40 |
1.36 V |
90 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.8 mm |
16384 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
100 MHz |
20 |
220 |
MULTIPLE |
27 mm |
CMOS |
1.4 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
OTHER |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
23 |
16 |
1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA257,19X19,32 |
1.71 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
1.4 mm |
16384 |
16 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
50 MHz |
20 |
220 |
MULTIPLE |
16 mm |
CMOS |
1.8 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B257 |
3 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.16 V |
23 |
32 |
1.1,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.05 V |
90 Cel |
4 |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
3.25 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75 MHz |
NOT SPECIFIED |
220 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.1 V |
64 |
Digital Signal Processors |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e0 |
8 |
||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
23 |
32 |
1.1,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
0 Cel |
BOTTOM |
3.25 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.75 V |
23 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
2.4 V |
100 Cel |
-55 Cel |
BOTTOM |
1.4 mm |
12 mm |
IC ALSO REQUIRES 3.3V FOR I/O |
YES |
16 |
66 MHz |
MULTIPLE |
12 mm |
CMOS |
2.5 V |
.8 mm |
FIXED POINT |
S-PBGA-B144 |
Not Qualified |
YES |
YES |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
352 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
22 |
GRID ARRAY, HEAT SINK/SLUG |
1.425 V |
90 Cel |
0 Cel |
BOTTOM |
3.8 mm |
27 mm |
YES |
32 |
200 MHz |
MULTIPLE |
27 mm |
CMOS |
1.5 V |
1 mm |
FIXED POINT |
S-PBGA-B352 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
32 |
24 |
FLATPACK |
4.75 V |
85 Cel |
4 |
0 Cel |
QUAD |
4.1 mm |
512 |
28 mm |
220 MOPS; 40 MFLOPS; 20 MIPS |
NO |
32 |
40 MHz |
SINGLE |
28 mm |
2 |
CMOS |
390 mA |
5 V |
2 |
1 |
.65 mm |
FLOATING POINT |
S-PQFP-G144 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
688 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.133 V |
8 |
20 |
32 |
1.1,1.8,3.3 |
GRID ARRAY |
BGA688,28X28,32 |
1.067 V |
100 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
8192 |
23 mm |
YES |
64 |
100 MHz |
30 |
245 |
MULTIPLE |
23 mm |
4 |
CMOS |
1.1 V |
64 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B688 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
697 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
20 |
32 |
1.2 |
GRID ARRAY, FINE PITCH |
BGA697,29X29,32 |
1.71 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
32768 |
24 mm |
YES |
64 |
66.6 MHz |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
1.8 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B697 |
4 |
Not Qualified |
NO |
YES |
e1 |
||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.44 V |
23 |
32 |
1.4,3.3 |
GRID ARRAY, FINE PITCH |
BGA548,26X26,32 |
1.36 V |
90 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.8 mm |
4096 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.19 MHz |
20 |
220 |
MULTIPLE |
23 mm |
CMOS |
1.4 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
384 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
22 |
32 |
1.8,3.3 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
BGA384,22X22,32 |
1.71 V |
90 Cel |
0 Cel |
BOTTOM |
2.8 mm |
32768 |
18 mm |
YES |
32 |
233 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
18 mm |
CMOS |
1.8 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B384 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
0 Cel |
BOTTOM |
3.3 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.18 MHz |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
NO LEAD |
325 |
DIE |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
MIL-PRF-38535 Class Q |
31 |
UNCASED CHIP |
4.75 V |
100 Cel |
-55 Cel |
UPPER |
YES |
32 |
60 MHz |
MULTIPLE |
CMOS |
5 V |
FLOATING POINT |
S-XUUC-N325 |
Not Qualified |
YES |
YES |
||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.35 V |
23 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA361,19X19,32 |
1.25 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
8192 |
16 mm |
YES |
16 |
30 MHz |
30 |
260 |
SINGLE |
16 mm |
CMOS |
1.3 V |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B361 |
3 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.3 V |
16 |
16 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.7 V |
85 Cel |
4 |
0 Cel |
QUAD |
1.6 mm |
544 |
14 mm |
4K WORDS DATA/PROG RAM |
YES |
16 |
40.96 MHz |
MULTIPLE |
14 mm |
1 |
CMOS |
3 V |
0 |
2 |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
32 |
32 |
1.2,3.3 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
BGA532,26X26,32 |
1.14 V |
90 Cel |
4 |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
3.3 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3VI/O SUPPLY |
YES |
64 |
75.18 MHz |
NOT SPECIFIED |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
125 mA |
1.2 V |
64 |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
376 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
32 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA376,22X22,40 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
20480 |
23 mm |
YES |
32 |
30 MHz |
30 |
260 |
MULTIPLE |
23 mm |
5 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
MROM |
1 mm |
FIXED POINT |
S-PBGA-B376 |
3 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.44 V |
23 |
32 |
1.4,3.3 |
GRID ARRAY |
BGA548,26X26,40 |
1.36 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.8 mm |
4096 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.19 MHz |
30 |
260 |
MULTIPLE |
27 mm |
CMOS |
1.4 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
0 Cel |
BOTTOM |
3.25 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
23 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
100 Cel |
-55 Cel |
QUAD |
1.6 mm |
14 mm |
YES |
16 |
40 MHz |
MULTIPLE |
14 mm |
CMOS |
3.3 V |
.4 mm |
FIXED POINT |
S-PQFP-G128 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
132 |
BQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
32 |
24 |
FLATPACK, BUMPER |
4.75 V |
85 Cel |
4 |
0 Cel |
QUAD |
4.57 mm |
1024 |
24.13 mm |
NO |
32 |
27 MHz |
MULTIPLE |
24.13 mm |
2 |
CMOS |
260 mA |
5 V |
1 |
1 |
.635 mm |
FLOATING POINT |
S-PQFP-G132 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.14 V |
90 Cel |
0 Cel |
BOTTOM |
3.3 mm |
16384 |
23 mm |
YES |
64 |
75.19 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
169 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.65 V |
19 |
16 |
1.6,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA169,13X13,32 |
1.55 V |
85 Cel |
8 |
0 Cel |
TIN LEAD |
BOTTOM |
1.4 mm |
65536 |
12 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
16 |
133 MHz |
20 |
220 |
MULTIPLE |
12 mm |
8 |
CMOS |
1.6 V |
24 |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B169 |
3 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
23 |
32 |
1.1,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.25 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75 MHz |
30 |
260 |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA548,26X26,40 |
1.14 V |
90 Cel |
4 |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
2.8 mm |
262144 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.19 MHz |
NOT SPECIFIED |
220 |
MULTIPLE |
27 mm |
3 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
20 |
GRID ARRAY, FINE PITCH |
1.16 V |
90 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
3.3 mm |
23 mm |
ALSO REQUIRES 3.3V SUPPLY FOR I/O |
YES |
64 |
850 MHz |
20 |
220 |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e0 |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
288 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA288,22X22,40 |
1.14 V |
90 Cel |
4 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.8 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
30 MHz |
30 |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B288 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
697 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2875 V |
8 |
32 |
32 |
1.25,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA697,29X29,32 |
1.2125 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.242 mm |
8192 |
24 mm |
YES |
32 |
50 MHz |
30 |
245 |
MULTIPLE |
24 mm |
4 |
CMOS |
1.25 V |
64 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B697 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
340 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
22 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
1.425 V |
90 Cel |
0 Cel |
BOTTOM |
2.095 mm |
18 mm |
YES |
32 |
167 MHz |
MULTIPLE |
18 mm |
CMOS |
1.5 V |
.8 mm |
FIXED POINT |
S-PBGA-B340 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
GRID ARRAY |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY |
YES |
0 |
300 MHz |
30 |
260 |
MULTIPLE |
CMOS |
1.2 V |
FLOATING POINT |
S-PBGA-B361 |
3 |
YES |
NO |
e1 |
Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.
DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.
DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.