BALL Digital Signal Processors (DSPs) 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320C6201GJLA200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			22	32	1.8,3.3	GRID ARRAY	BGA352,26X26,40	1.71 V	105 Cel	4	-40 Cel	TIN LEAD	BOTTOM	3.8 mm	16384	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	27 mm	2	CMOS		1.8 V	4	Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
TMS320VC5402AZWS16	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1.65 V	16		23	16		GRID ARRAY	BGA144,13X13,32	1.55 V	100 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	12 mm	ALSO OPERATES AT 3.3V SUPPLY	YES	16	20 MHz	30	260	MULTIPLE	12 mm	2	CMOS	.8 mA	1.6 V	6		MROM	.8 mm	FIXED POINT	R-PBGA-B144	3		YES	YES	e1	16
TMS320C6211BZFN167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			22	32	1.8,3.3	GRID ARRAY	BGA256,20X20,50	1.71 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	2.32 mm	4096	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	167 MHz	30	260	MULTIPLE	27 mm	2	CMOS		1.8 V	16	Digital Signal Processors		1.27 mm	FIXED POINT	S-PBGA-B256	4	Not Qualified	YES	NO	e1
TMS320C6203GJLA250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V			22			GRID ARRAY, HEAT SINK/SLUG		1.43 V					BOTTOM	3.8 mm		27 mm	-40 TO 105 OPERATING CASE TEMPERATURE	YES	32	250 MHz			MULTIPLE	27 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS32C6415DGLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V			32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320BLC549GGUS-66	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			23			GRID ARRAY, LOW PROFILE, FINE PITCH		3 V	100 Cel		-55 Cel		BOTTOM	1.4 mm		12 mm		YES	16	66 MHz			MULTIPLE	12 mm		CMOS		3.3 V				.8 mm	FIXED POINT	S-PBGA-B144		Not Qualified	YES	YES
TMS320TCI6482DZTZ8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.236 V			20	32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.164 V	90 Cel		0 Cel		BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified	YES	NO
TMS320C6203BGNY173	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.75 V	8		22	32	1.7,3.3	GRID ARRAY, FINE PITCH	BGA384,22X22,32	1.65 V	90 Cel	4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.35 mm	524288	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	300 MHz	NOT SPECIFIED	220	MULTIPLE	18 mm	2	CMOS		1.7 V	4	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B384	4	Not Qualified	YES	NO	e0	8
TMS320TCI6482BCTZ2	Texas Instruments		OTHER	BALL	697	HBGA	SQUARE	PLASTIC/EPOXY		YES					32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA697,29X29,32		90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		8192						30	245				CMOS				Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified			e1
TMS320C5504AZCHA10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.15 V	8		21	16	1.05/1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	.998 V	85 Cel	2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	10 mm		YES	16	12 MHz	30	260	SINGLE	10 mm	3	CMOS		1.05 V	16	Digital Signal Processors	MROM	.65 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	NO	e1	8
TMS320DM6437ZDU5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	376	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			0	32	1.2,1.8,3.3	GRID ARRAY	BGA376,22X22,40	1.71 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	81920	23 mm		YES	0	27 MHz	30	260	MULTIPLE	23 mm		CMOS		1.8 V		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B376	3	Not Qualified	NO	NO	e1
TMS320TCI6604CYPA25	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	841	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			0			GRID ARRAY		.95 V					BOTTOM					YES	0				MULTIPLE			CMOS		1 V					FLOATING POINT	S-PBGA-B841			YES	NO
TMS320C6457CGMH8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	688	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.133 V			20	32	1.1,1.8,3.3	GRID ARRAY	BGA688,28X28,32	1.067 V					BOTTOM	3.3 mm	8192	23 mm		YES	64	100 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm		CMOS		1.1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B688		Not Qualified	YES	NO
TMS320C6416TBCLZ1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V			20	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	4096	23 mm		YES	64	75 MHz	30	260	MULTIPLE	23 mm	3	CMOS		1.2 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1	8
TMS320C6416TZLZA8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V			23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel		BOTTOM	3.25 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320F2809GBAA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.89 V	16		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32	1.71 V	85 Cel	3	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	18432	10 mm	ALSO REQUIRES 3.3V SUPPLY	YES	0	100 MHz	20	220	MULTIPLE	10 mm	13	CMOS	230 mA	1.8 V			FLASH	.8 mm	FIXED POINT	S-PBGA-B100	3		YES	NO	e0	16
TMS32C6415DGLZK6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32						BOTTOM		4096											CMOS				Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified
SM32C6416TGLZA7EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V			23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel		BOTTOM	3.25 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
OMAPL138BZWTA4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	361	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			0			GRID ARRAY		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM				ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY	YES	0	456 MHz	30	260	MULTIPLE			CMOS		1.2 V					FLOATING POINT	S-PBGA-B361	3		YES	NO	e1
TMS32C6415EGLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V			32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel	4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3	CMOS		1.4 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320DM8147BCYEA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V			8			GRID ARRAY, FINE PITCH		1.05 V	105 Cel		-40 Cel		BOTTOM			23 mm		YES	16	30 MHz			MULTIPLE	23 mm		CMOS		1.1 V				.8 mm	FLOATING POINT	S-PBGA-B684			YES	NO
TMS320C6414EGLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V			23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.36 V					BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.75 MHz			MULTIPLE	23 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6414DZLZ5E0	Texas Instruments			BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32						BOTTOM		16384											CMOS	125 mA			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified
TMS320C6416TGLZWA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES				23			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH						TIN LEAD	BOTTOM	3.3 mm		23 mm		YES	64				MULTIPLE	23 mm		CMOS						.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6654GZHA8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES				0			GRID ARRAY, FINE PITCH							BOTTOM	2.99 mm		21 mm		YES	0				MULTIPLE	21 mm		CMOS						.8 mm	FLOATING POINT	S-PBGA-B625			YES	NO
TMS320VC5510GGWA2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	240	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V			22	16	1.6,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA240,17X17,32	1.55 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.4 mm	32768	15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	50 MHz			MULTIPLE	15 mm		CMOS		1.6 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B240	3	Not Qualified	YES	NO	e0
TMS320C6202GLSA-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	233 MHz			MULTIPLE	18 mm		CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203GJL-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V			22			GRID ARRAY, HEAT SINK/SLUG		1.425 V	90 Cel		0 Cel		BOTTOM	3.8 mm		27 mm		YES	32	233 MHz			MULTIPLE	27 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS32C6416EZLZA5E0	Texas Instruments			BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32						BOTTOM		16384											CMOS	125 mA			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified
TMS32C6211BGFN150F	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			20			GRID ARRAY		1.71 V					BOTTOM	2.32 mm		27 mm		YES	32	150 MHz			MULTIPLE	27 mm		CMOS		1.8 V				1.27 mm	FIXED POINT	S-PBGA-B256			NO	NO
TMS320F28332ZHHA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	179	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			20	32	1.9,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA179,14X14,32	1.71 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm	ALSO OPERATES AT 3.3V SUPPLY	YES	32	100 MHz	30	260	MULTIPLE	12 mm		CMOS		1.8 V		Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B179	3	Not Qualified	YES	NO	e1
TMS320V640AGDK4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	548	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			23			GRID ARRAY, FINE PITCH		1.14 V				TIN LEAD	BOTTOM	2.8 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75.19 MHz	20	220	MULTIPLE	23 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified	YES	NO	e0
TMS320R2812GHHS	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	179	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	2 V	16		19	32	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA179,14X14,32	1.81 V	125 Cel	3	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	20480	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	150 MHz	20	220	MULTIPLE	12 mm	8	CMOS	260 mA	1.9 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B179	3	Not Qualified	YES	NO	e0
TMS320VC5409GGU	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			23			GRID ARRAY, LOW PROFILE, FINE PITCH		1.71 V	100 Cel		-40 Cel		BOTTOM	1.4 mm		12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16				MULTIPLE	12 mm		CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B144		Not Qualified	YES	YES
TMS320TCI6482BZTZA2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V			20	32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V	105 Cel		-40 Cel		BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS		1.25 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified	YES	NO
SM320C6201GJCA20EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	32		22	32	1.8,3.3	GRID ARRAY	BGA352,26X26,50	1.71 V	105 Cel	4	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.5 mm	65536	35 mm		YES	32	50 MHz	NOT SPECIFIED	220	MULTIPLE	35 mm	2	CMOS		1.8 V	4	Digital Signal Processors	FLASH	1.27 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
SM320C6701GJC12EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	352	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			22			GRID ARRAY		1.71 V					BOTTOM	3.5 mm		35 mm		YES	32	120.48 MHz			MULTIPLE	35 mm		CMOS		1.8 V				1.27 mm	FLOATING POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320DM642AGNZ5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	548	BGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V			23	32	1.4,3.3	GRID ARRAY	BGA548,26X26,40	1.36 V				TIN LEAD	BOTTOM	2.8 mm	16384	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	20	220	MULTIPLE	27 mm		CMOS		1.4 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified	YES	NO	e0
TMS320DM8168BCYGA2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED		BALL	1031	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			28	32	1	GRID ARRAY, FINE PITCH	BGA1031,37X37,25	.95 V				TIN SILVER COPPER	BOTTOM	3.31 mm	16384	25 mm		YES	16	27 MHz	30	245	MULTIPLE	25 mm		CMOS		1 V		Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320DM647ZUT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		32	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	32768	19 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	YES	32	720 MHz	30	245	MULTIPLE	19 mm	8	CMOS		1.2 V	64	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	YES	NO	e1	8
5962-0051001QXX	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	MILITARY	BALL	429	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1.57 V		MIL-STD-883				GRID ARRAY		1.43 V	125 Cel		-55 Cel		BOTTOM					YES		200 MHz	NOT SPECIFIED	NOT APPLICABLE	MULTIPLE			CMOS							FIXED POINT	S-CBGA-B429		Qualified	YES	NO
TMS320C6674ACYP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	841	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V			16	32	1,1.5,1.8	GRID ARRAY, FINE PITCH	BGA841,29X29,32	1.045 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.39 mm	32768	24 mm		YES	64		30	245	SINGLE	24 mm	24	CMOS		1.1 V	80	Digital Signal Processors	MROM	.8 mm	FLOATING POINT	S-PBGA-B841	4	Not Qualified	YES	NO	e1	8
TMS320C5514AZCHA10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	FBGA	SQUARE	PLASTIC/EPOXY		YES					16	1.05/1.3,1.8/3.3	GRID ARRAY	BGA196,14X14,25						BOTTOM		131072						30	260				CMOS				Digital Signal Processors		.635 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified
TMS320DM6435ZWTQ4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	361	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	1.2,1.8,3.3	GRID ARRAY	BGA361,19X19,32		85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		81920						30	260				CMOS				Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified			e1
TMS320C6415TZLZ1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V			23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel		BOTTOM	3.25 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
TMS320C6202BGLSA-250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V			22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	250 MHz			MULTIPLE	18 mm		CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
SM320C6455BGTZSEP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2875 V			20	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA697,29X29,32	1.2125 V	105 Cel		-55 Cel	TIN LEAD	BOTTOM	3.1 mm	32768	24 mm	IT ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	66.6 MHz	20	220	MULTIPLE	24 mm	4	CMOS		1.25 V	64	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified	YES	NO	e0	8
OMAPL138AZCED3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	361	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			0			GRID ARRAY		1.14 V	90 Cel		-40 Cel		BOTTOM				ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY	YES	0	300 MHz			MULTIPLE			CMOS		1.2 V					FLOATING POINT	S-PBGA-B361			YES	NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.