Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Internal Bus Architecture | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Barrel Shifter | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
23 |
32 |
1.4,3.3 |
GRID ARRAY |
BGA548,26X26,40 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.8 mm |
4096 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.19 MHz |
30 |
260 |
MULTIPLE |
27 mm |
CMOS |
1.2 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
AUTOMOTIVE |
BALL |
100 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
0 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.71 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
10 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
0 |
100 MHz |
30 |
260 |
MULTIPLE |
10 mm |
CMOS |
1.8 V |
.8 mm |
FIXED POINT |
S-PBGA-B100 |
3 |
YES |
NO |
e1 |
|||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA548,26X26,32 |
1.14 V |
90 Cel |
0 Cel |
BOTTOM |
2.8 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.19 MHz |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B548 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
548 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA548,26X26,40 |
1.14 V |
BOTTOM |
2.8 mm |
16384 |
27 mm |
YES |
32 |
75 MHz |
MULTIPLE |
27 mm |
CMOS |
1.2 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B548 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
105 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
3.3 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.19 MHz |
20 |
220 |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
625 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
24 |
GRID ARRAY, FINE PITCH |
BOTTOM |
2.99 mm |
21 mm |
YES |
16 |
MULTIPLE |
21 mm |
CMOS |
.8 mm |
FLOATING POINT |
S-PBGA-B625 |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
529 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA529,23X23,32 |
1.14 V |
90 Cel |
-40 Cel |
BOTTOM |
3.3 mm |
8192 |
19 mm |
IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY |
YES |
32 |
900 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
19 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B529 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
176 |
BGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.89 V |
16 |
20 |
32 |
1.9,3.3 |
GRID ARRAY |
BGA176,14X14,40 |
1.71 V |
85 Cel |
8 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.05 mm |
52 |
15 mm |
ALSO OPERATES AT 3.3V SUPPLY |
YES |
32 |
100 MHz |
30 |
260 |
MULTIPLE |
15 mm |
19 |
CMOS |
315 mA |
1.8 V |
6 |
Digital Signal Processors |
FLASH |
1 mm |
FIXED POINT |
S-PBGA-B176 |
3 |
Not Qualified |
YES |
NO |
e1 |
16 |
|||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
625 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
24 |
GRID ARRAY, FINE PITCH |
BOTTOM |
2.99 mm |
21 mm |
YES |
16 |
MULTIPLE |
21 mm |
CMOS |
.8 mm |
FLOATING POINT |
S-PBGA-B625 |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
22 |
32 |
1.8,3.3 |
GRID ARRAY |
BGA272,20X20,50 |
1.71 V |
90 Cel |
0 Cel |
BOTTOM |
2.32 mm |
1024 |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
167 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
27 mm |
CMOS |
1.8 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-PBGA-B256 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
376 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
13 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA376,22X22,40 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
20480 |
YES |
32 |
30 |
260 |
MULTIPLE |
5 |
CMOS |
1.2 V |
72 |
Digital Signal Processors |
MROM |
1 mm |
FIXED POINT |
S-PBGA-B376 |
3 |
Not Qualified |
NO |
NO |
e1 |
8 |
||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
23 |
16 |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,13X13,32 |
3 V |
BOTTOM |
1.4 mm |
32768 |
12 mm |
YES |
16 |
100 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
12 mm |
CMOS |
3.3 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B144 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
BOTTOM |
16384 |
CMOS |
125 mA |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.43 V |
21 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.24 V |
70 Cel |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
1.3 mm |
10 mm |
ALSO OPERATES AT 60 MHZ WITH 1.05 V SUPPLY; IT ALSO HAS AN ADDITIONAL 16-BIT ALU |
YES |
16 |
12 MHz |
30 |
260 |
MULTIPLE |
10 mm |
CMOS |
1.3 V |
.65 mm |
FIXED POINT |
S-PBGA-B196 |
3 |
YES |
NO |
e1 |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
32 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.02 mm |
262144 |
17 mm |
32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY |
YES |
32 |
25 MHz |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.2 V |
16 |
Digital Signal Processors |
MROM |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
NO |
NO |
e1 |
8 |
||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
529 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
32 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA529,23X23,32 |
1.14 V |
90 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
8192 |
19 mm |
IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY |
YES |
32 |
720 MHz |
30 |
245 |
MULTIPLE |
19 mm |
8 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B529 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
|||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
23 |
16 |
1.5,3/3.3,5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,13X13,32 |
1.42 V |
BOTTOM |
1.4 mm |
40960 |
12 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
16 |
14.7456 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
12 mm |
CMOS |
1.5 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B144 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
529 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA529,23X23,32 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
8192 |
19 mm |
IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY |
YES |
32 |
1100 MHz |
30 |
245 |
MULTIPLE |
19 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B529 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
532 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.44 V |
32 |
32 |
1.4,3.3 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
BGA532,26X26,32 |
1.36 V |
TIN LEAD |
BOTTOM |
3.3 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3VI/O SUPPLY |
YES |
64 |
75.18 MHz |
MULTIPLE |
23 mm |
CMOS |
1.4 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e0 |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
697 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
20 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA697,29X29,32 |
1.71 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
32768 |
24 mm |
YES |
64 |
66.6 MHz |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
1.8 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B697 |
4 |
Not Qualified |
NO |
YES |
e1 |
||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
20 |
32 |
1.4,3.3 |
GRID ARRAY |
BGA548,26X26,40 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.8 mm |
16384 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
100 MHz |
30 |
260 |
MULTIPLE |
27 mm |
CMOS |
1.2 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
697 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2875 V |
20 |
32 |
1.25,1.5/1.8,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA697,29X29,32 |
1.2125 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.242 mm |
8192 |
24 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66.6 MHz |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
1.25 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B697 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
529 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
32 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA529,23X23,32 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
8192 |
19 mm |
IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY |
YES |
32 |
720 MHz |
30 |
245 |
MULTIPLE |
19 mm |
8 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B529 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
|||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.35 V |
8 |
15 |
1.3,1.8/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.25 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.05 mm |
499712 |
17 mm |
YES |
16 |
30 MHz |
30 |
260 |
SINGLE |
17 mm |
3 |
CMOS |
1.3 V |
40 |
Other Microprocessor ICs |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
456 rpm |
YES |
NO |
e1 |
||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.16 V |
20 |
32 |
1.1,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.05 V |
105 Cel |
4 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.25 mm |
4096 |
23 mm |
YES |
64 |
75 MHz |
30 |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.1 V |
64 |
Digital Signal Processors |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.44 V |
20 |
32 |
1.4,3.3 |
GRID ARRAY, FINE PITCH |
BGA548,26X26,32 |
1.36 V |
90 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.8 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
133 MHz |
MULTIPLE |
23 mm |
CMOS |
1.4 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.91 V |
32 |
1.1,1.8,3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,26X26,20 |
1.71 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
.9 mm |
32768 |
12 mm |
YES |
59 MHz |
30 |
260 |
SINGLE |
12 mm |
15 |
CMOS |
1.8 V |
32 |
Graphics Processors |
MROM |
.4 mm |
FLOATING POINT |
S-PBGA-B515 |
3 |
Not Qualified |
YES |
NO |
e1 |
32 |
|||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.15 V |
16 |
0 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,14X14,32 |
.998 V |
85 Cel |
2 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
65536 |
12 mm |
YES |
0 |
12 MHz |
30 |
260 |
MULTIPLE |
12 mm |
4 |
CMOS |
1.05 V |
16 |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B144 |
3 |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||||
Texas Instruments |
BALL |
384 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.7,3.3 |
GRID ARRAY, FINE PITCH |
BGA384,22X22,32 |
BOTTOM |
98304 |
CMOS |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B384 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.65 V |
16 |
23 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,13X13,32 |
1.55 V |
100 Cel |
4 |
-40 Cel |
TIN LEAD |
BOTTOM |
1.4 mm |
65536 |
12 mm |
YES |
16 |
20 MHz |
20 |
220 |
MULTIPLE |
12 mm |
1 |
CMOS |
1.6 V |
6 |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B144 |
3 |
YES |
YES |
e0 |
16 |
|||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
841 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY |
.95 V |
BOTTOM |
YES |
0 |
MULTIPLE |
CMOS |
1 V |
FLOATING POINT |
S-PBGA-B841 |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
8 |
23 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.95 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
16 mm |
IT ALSO OPERATES AT 1.1V, 1.2V NOMINAL SUPLY |
YES |
16 |
30 MHz |
30 |
260 |
SINGLE |
16 mm |
4 |
CMOS |
1 V |
80 |
.8 mm |
FLOATING POINT |
S-PBGA-B361 |
3 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
352 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
22 |
32 |
1.8,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA352,26X26,40 |
1.71 V |
90 Cel |
0 Cel |
BOTTOM |
3.8 mm |
16384 |
27 mm |
YES |
32 |
167 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
27 mm |
CMOS |
1.8 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B352 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
429 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
3.46 V |
32 |
GRID ARRAY |
3.14 V |
BOTTOM |
YES |
32 |
150 MHz |
MULTIPLE |
CMOS |
3.3 V |
FLOATING POINT |
S-CBGA-B429 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
841 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY |
.95 V |
BOTTOM |
YES |
0 |
MULTIPLE |
CMOS |
1 V |
FLOATING POINT |
S-PBGA-B841 |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
384 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
22 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
1.425 V |
90 Cel |
0 Cel |
BOTTOM |
2.8 mm |
18 mm |
YES |
32 |
200 MHz |
MULTIPLE |
18 mm |
CMOS |
1.5 V |
.8 mm |
FIXED POINT |
S-PBGA-B384 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
384 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.75 V |
22 |
32 |
1.5,3.3 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
BGA384,22X22,32 |
1.65 V |
90 Cel |
0 Cel |
BOTTOM |
2.8 mm |
524288 |
18 mm |
YES |
32 |
250 MHz |
MULTIPLE |
18 mm |
CMOS |
1.7 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B384 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
625 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
24 |
GRID ARRAY, FINE PITCH |
85 Cel |
0 Cel |
BOTTOM |
2.99 mm |
21 mm |
YES |
16 |
MULTIPLE |
21 mm |
CMOS |
.8 mm |
FLOATING POINT |
S-PBGA-B625 |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
0 Cel |
BOTTOM |
3.25 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
22 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA361,19X19,32 |
1.14 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
49152 |
16 mm |
ALSO OPERATES AT 1.05V NOMINAL SUPPLY AT400MHZ |
YES |
8 |
500 MHz |
30 |
260 |
MULTIPLE |
16 mm |
5 |
CMOS |
1.2 V |
72 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
Not Qualified |
NO |
NO |
e1 |
8 |
|||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
688 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.133 V |
8 |
20 |
32 |
1.1,1.8,3.3 |
GRID ARRAY |
BGA688,28X28,32 |
1.067 V |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
8192 |
23 mm |
YES |
64 |
100 MHz |
30 |
245 |
MULTIPLE |
23 mm |
4 |
CMOS |
1.1 V |
64 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B688 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
352 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
22 |
GRID ARRAY, HEAT SINK/SLUG |
1.71 V |
105 Cel |
-40 Cel |
BOTTOM |
3.8 mm |
27 mm |
YES |
32 |
300 MHz |
MULTIPLE |
27 mm |
CMOS |
1.8 V |
1 mm |
FIXED POINT |
S-PBGA-B352 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
INDUSTRIAL |
BALL |
289 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.675 V |
25 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.525 V |
85 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
12 mm |
YES |
16 |
13 MHz |
12 mm |
CMOS |
1.6 V |
.5 mm |
FIXED POINT |
S-PBGA-B289 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
625 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
24 |
GRID ARRAY, FINE PITCH |
85 Cel |
0 Cel |
BOTTOM |
2.99 mm |
21 mm |
YES |
16 |
MULTIPLE |
21 mm |
CMOS |
.8 mm |
FLOATING POINT |
S-PBGA-B625 |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.15 V |
16 |
21 |
16 |
1.05/1.3,1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,25 |
.998 V |
70 Cel |
2 |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
1.3 mm |
131072 |
10 mm |
YES |
16 |
12 MHz |
30 |
260 |
SINGLE |
10 mm |
3 |
CMOS |
1.05 V |
16 |
Digital Signal Processors |
MROM |
.65 mm |
FIXED POINT |
S-PBGA-B196 |
3 |
Not Qualified |
YES |
NO |
e1 |
16 |
|||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
352 |
HLBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.465 V |
8 |
32 |
32 |
3.3 |
GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE |
BGA352,26X26,50 |
3.135 V |
85 Cel |
4 |
0 Cel |
BOTTOM |
1.7 mm |
25600 |
35 mm |
YES |
64 |
100 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
35 mm |
1 |
CMOS |
2300 mA |
3.3 V |
0 |
0 |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B352 |
Not Qualified |
NO |
YES |
|||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
22 |
32 |
1.8,3.3 |
GRID ARRAY |
BGA256,20X20,50 |
1.8 V |
BOTTOM |
2.32 mm |
18432 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
149.25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
27 mm |
CMOS |
1.9 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
169 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.65 V |
19 |
16 |
1.6,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA169,13X13,32 |
1.55 V |
100 Cel |
8 |
-40 Cel |
TIN LEAD |
BOTTOM |
1.4 mm |
65536 |
12 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
16 |
133 MHz |
20 |
220 |
MULTIPLE |
12 mm |
8 |
CMOS |
1.6 V |
24 |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B169 |
3 |
Not Qualified |
YES |
YES |
e0 |
Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.
DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.
DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.