Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Internal Bus Architecture | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Barrel Shifter | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
16 |
14 |
CHIP CARRIER |
4.5 V |
85 Cel |
1 |
-40 Cel |
Matte Tin (Sn) |
QUAD |
4.45 mm |
512 |
24.18 mm |
NO |
24 |
20 MHz |
40 |
260 |
MULTIPLE |
24.18 mm |
1 |
CMOS |
31 mA |
5 V |
0 |
1 |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
5 |
Not Qualified |
YES |
YES |
e3 |
|||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
PIN/PEG |
223 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.5 V |
0 |
24 |
32 |
5 |
GRID ARRAY |
PGA223,18X18 |
4.5 V |
70 Cel |
4 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
SINGLE CYCLE INSTR EXECUTION; 100 MFLOPS PEAK; 66 MFLOPS SUSTAINED; ADDRESSING OF PAGE MODE DRAM |
YES |
48 |
20 MHz |
MULTIPLE |
1 |
CMOS |
370 mA |
5 V |
0 |
0 |
Digital Signal Processors |
2.54 mm |
FLOATING POINT |
S-CPGA-P223 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
529 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
8 |
26 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA529,23X23,32 |
1.05 V |
85 Cel |
-40 Cel |
BOTTOM |
1.5 mm |
917504 |
19 mm |
YES |
16 |
450 MHz |
30 |
260 |
MULTIPLE |
19 mm |
8 |
CMOS |
1.1 V |
1 |
SPI; UART |
.8 mm |
FLOATING POINT |
S-PBGA-B529 |
3 |
YES |
NO |
8 |
||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
16 |
14 |
FLATPACK, LOW PROFILE, FINE PITCH |
4.5 V |
85 Cel |
4 |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
4096 |
14 mm |
NO |
24 |
14.4 MHz |
260 |
MULTIPLE |
14 mm |
1 |
CMOS |
100 mA |
5 V |
2 |
2 |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
3 |
Not Qualified |
YES |
YES |
e3 |
||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
MATTE TIN |
260 |
CMOS |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
14 |
16 |
5 |
FLATPACK |
QFP100,.63SQ,20 |
4.5 V |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
8196 |
NO |
24 |
40 MHz |
MULTIPLE |
CMOS |
5 V |
Digital Signal Processors |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.47 V |
19 |
32 |
1.3,1.8/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.164 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
24 mm |
YES |
16 |
400 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
24 mm |
CMOS |
1.4 V |
Microprocessors |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
Not Qualified |
400 rpm |
YES |
YES |
|||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
208 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
20 |
32 |
1.2,2.5/3.3 |
GRID ARRAY, FINE PITCH |
BGA208,20X20,32 |
.8 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.75 mm |
17 mm |
ALSO REQUIRES 2.5V OR 3V SUPPLY |
YES |
16 |
50 MHz |
MULTIPLE |
17 mm |
CMOS |
1.2 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B208 |
Not Qualified |
400 rpm |
YES |
YES |
e1 |
||||||||||||||||||||||||||||||
Analog Devices |
MILITARY |
PIN/PEG |
100 |
PGA |
SQUARE |
CERAMIC |
NO |
16 |
5 |
GRID ARRAY |
PGA100M,13X13 |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
0 |
CMOS |
100 mA |
5 V |
Digital Signal Processors |
2.54 mm |
FIXED POINT |
S-XPGA-P100 |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
32 |
3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
3.13 V |
TIN LEAD |
QUAD |
4.1 mm |
16384 |
28 mm |
YES |
32 |
30 MHz |
240 |
MULTIPLE |
28 mm |
CMOS |
470 mA |
3.3 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
3 |
Not Qualified |
NO |
YES |
e0 |
||||||||||||||||||||||||||||||||
Analog Devices |
COMMERCIAL |
PIN/PEG |
223 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
32 |
5 |
GRID ARRAY |
PGA223,18X18 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
0 |
CMOS |
490 mA |
5 V |
Digital Signal Processors |
2.54 mm |
FLOATING POINT |
S-PPGA-P223 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
MILITARY |
PIN/PEG |
100 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
0 |
38535Q/M;38534H;883B |
14 |
16 |
5 |
GRID ARRAY |
PGA100M,13X13 |
125 Cel |
5 |
-55 Cel |
GOLD |
PERPENDICULAR |
0 |
NO |
24 |
32.786 MHz |
MULTIPLE |
0 |
CMOS |
130 mA |
5 V |
0 |
0 |
Digital Signal Processors |
2.54 mm |
FIXED POINT |
S-CPGA-P100 |
Not Qualified |
YES |
YES |
e4 |
|||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
16 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-40 Cel |
TIN |
QUAD |
1.6 mm |
20 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
16 |
55.55 MHz |
MULTIPLE |
20 mm |
CMOS |
1.2 V |
.5 mm |
FLOATING POINT |
S-PQFP-G144 |
Not Qualified |
NO |
YES |
e3 |
||||||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
182 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
20 |
32 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA182,14X14,32 |
.8 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1.7 mm |
12 mm |
ALSO REQUIRES 2.5V OR 3.3V SUPPLY |
YES |
16 |
40 MHz |
MULTIPLE |
12 mm |
CMOS |
1.2 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B182 |
Not Qualified |
300 rpm |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
GULL WING |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
16 |
14 |
16 |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.63X.87,20 |
4.5 V |
70 Cel |
4 |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
8192 |
14 mm |
33 MIPS SUSTAINED; SINGLE CYCLE INSTRUCTION EXECUTION |
NO |
24 |
16.67 MHz |
260 |
MULTIPLE |
20 mm |
1 |
CMOS |
100 mA |
5 V |
2 |
2 |
Digital Signal Processors |
.5 mm |
FIXED POINT |
R-PQFP-G128 |
3 |
Not Qualified |
YES |
YES |
e3 |
|||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
240 |
HFQFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
3.45 V |
32 |
32 |
3.3 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
HQFP240,1.37SQ,20 |
3.15 V |
100 Cel |
-40 Cel |
TIN LEAD SILVER |
QUAD |
4.2 mm |
131072 |
32 mm |
YES |
48 |
33.3 MHz |
MULTIPLE |
32 mm |
CMOS |
540 mA |
3.3 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-CQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
15 |
16 |
5 |
FLATPACK |
SPQFP100,.9SQ |
4.75 V |
70 Cel |
4 |
0 Cel |
TIN LEAD |
QUAD |
0 |
SINGLE CYCLE INSTRUCTION EXECUTION |
NO |
24 |
50 MHz |
MULTIPLE |
0 |
CMOS |
150 mA |
5 V |
0 |
0 |
Digital Signal Processors |
.635 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
32 |
5 |
GRID ARRAY |
BGA225,15X15,50 |
4.75 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.7 mm |
131072 |
23 mm |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
23 mm |
CMOS |
850 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
136 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
16 |
32 |
1.2,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA136,14X14,32 |
1.14 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
1.7 mm |
98304 |
12 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
16 |
55.55 MHz |
MULTIPLE |
12 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B136 |
3 |
Not Qualified |
NO |
YES |
e0 |
||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.1 V |
85 Cel |
-40 Cel |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.15 V |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
YES |
YES |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
19 |
32 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,23X23,20 |
1.7 V |
70 Cel |
0 Cel |
BOTTOM |
1.4 mm |
12 mm |
YES |
16 |
50 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
12 mm |
CMOS |
1.8 V |
Microprocessors |
.5 mm |
FIXED POINT |
S-PBGA-B289 |
Not Qualified |
600 rpm |
YES |
YES |
|||||||||||||||||||||||||||||||
Analog Devices |
MILITARY |
GULL WING |
100 |
QFP |
SQUARE |
CERAMIC |
YES |
16 |
5 |
FLATPACK |
QFP100,.9SQ |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
0 |
CMOS |
130 mA |
5 V |
Digital Signal Processors |
.635 mm |
FIXED POINT |
S-XQFP-G100 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
16 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.14 V |
105 Cel |
-40 Cel |
TIN |
QUAD |
1.6 mm |
20 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
16 |
55.55 MHz |
MULTIPLE |
20 mm |
CMOS |
1.2 V |
.5 mm |
FLOATING POINT |
S-PQFP-G144 |
Not Qualified |
NO |
YES |
e3 |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
120 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.47 V |
0 |
FLATPACK, LOW PROFILE, FINE PITCH |
1.33 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
14 mm |
YES |
0 |
50 MHz |
40 |
260 |
MULTIPLE |
14 mm |
CMOS |
1.4 V |
.4 mm |
FIXED POINT |
S-PQFP-G120 |
Not Qualified |
YES |
YES |
||||||||||||||||||||||||||||||||||||
Analog Devices |
MILITARY |
GULL WING |
100 |
QFP |
SQUARE |
CERAMIC |
YES |
38535Q/M;38534H;883B |
16 |
5 |
FLATPACK |
QFP100,.9SQ |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
0 |
CMOS |
200 mA |
5 V |
Digital Signal Processors |
.635 mm |
FIXED POINT |
S-XQFP-G100 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
14 |
16 |
2/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,32 |
1.71 V |
85 Cel |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
1.4 mm |
8192 |
10 mm |
NO |
24 |
40 MHz |
MULTIPLE |
10 mm |
CMOS |
1.8 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B144 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||||
|
Analog Devices |
COMMERCIAL |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.2,3.3 |
FLATPACK |
QFP144,.87SQ,20 |
70 Cel |
0 Cel |
QUAD |
65536 |
CMOS |
500 mA |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G144 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
16 |
32 |
1.2,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
1.14 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
98304 |
20 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
16 |
55.55 MHz |
MULTIPLE |
20 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G144 |
Not Qualified |
NO |
YES |
e3 |
||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.05 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.1 V |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
YES |
YES |
e1 |
|||||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
16 |
14 |
16 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
85 Cel |
1 |
-40 Cel |
TIN LEAD |
QUAD |
4.45 mm |
512 |
24.18 mm |
20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION |
NO |
24 |
16.67 MHz |
MULTIPLE |
24.18 mm |
1 |
CMOS |
51 mA |
5 V |
0 |
2 |
Digital Signal Processors |
MROM |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
YES |
YES |
e0 |
24 |
||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
16 |
14 |
16 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.68X.85,20 |
3 V |
85 Cel |
1 |
-40 Cel |
TIN LEAD |
QUAD |
1.6 mm |
1024 |
14 mm |
8/16 BIT PARALLEL HOST INTERFACE PORT |
NO |
24 |
10 MHz |
MULTIPLE |
20 mm |
1 |
CMOS |
27 mA |
3.3 V |
0 |
2 |
Digital Signal Processors |
.5 mm |
FIXED POINT |
R-PQFP-G128 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
136 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-40 Cel |
BOTTOM |
1.7 mm |
12 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
16 |
55.55 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
12 mm |
CMOS |
1.2 V |
.8 mm |
FLOATING POINT |
S-PBGA-B136 |
Not Qualified |
NO |
YES |
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|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
32 |
1.3,1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
1.7 V |
70 Cel |
0 Cel |
QUAD |
1 mm |
9 mm |
ALSO OPERATES AT 2.5 AND 3.3 V TYP |
YES |
50 MHz |
30 |
260 |
MULTIPLE |
9 mm |
CMOS |
1.8 V |
Microprocessors |
.5 mm |
FIXED POINT |
S-XQCC-N64 |
3 |
Not Qualified |
400 rpm |
YES |
YES |
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|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL EXTENDED |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
32 |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
HQFP240,1.37SQ,20 |
4.75 V |
85 Cel |
3 |
0 Cel |
Matte Tin (Sn) |
QUAD |
4.1 mm |
16384 |
32 mm |
YES |
48 |
40 MHz |
40 |
260 |
MULTIPLE |
32 mm |
1 |
CMOS |
850 mA |
5 V |
6 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
NO |
YES |
e3 |
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Analog Devices |
DIGITAL SIGNAL PROCESSOR, MIXED |
INDUSTRIAL |
BALL |
136 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA136,14X14,32 |
85 Cel |
-40 Cel |
BOTTOM |
98304 |
CMOS |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B136 |
1 |
Not Qualified |
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Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
16 |
14 |
FLATPACK |
4.5 V |
85 Cel |
1 |
-40 Cel |
TIN LEAD |
QUAD |
1024 |
8/16 BIT PARALLEL HOST INTERFACE PORT |
NO |
24 |
16.67 MHz |
MULTIPLE |
1 |
CMOS |
75 mA |
5 V |
0 |
2 |
MROM |
FIXED POINT |
S-PQFP-G128 |
Not Qualified |
YES |
YES |
e0 |
24 |
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Analog Devices |
MILITARY |
PIN/PEG |
100 |
PGA |
SQUARE |
CERAMIC |
NO |
38535Q/M;38534H;883B |
16 |
5 |
GRID ARRAY |
PGA100M,13X13 |
125 Cel |
-55 Cel |
PERPENDICULAR |
0 |
CMOS |
100 mA |
5 V |
Digital Signal Processors |
2.54 mm |
FIXED POINT |
S-XPGA-P100 |
Not Qualified |
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|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
AUTOMOTIVE |
GULL WING |
120 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
32 |
AEC-Q100 |
16 |
32 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP120,.63SQ,16 |
.95 V |
125 Cel |
-40 Cel |
DUAL |
1.6 mm |
163840 |
14 mm |
YES |
16 |
MULTIPLE |
14 mm |
6 |
CMOS |
1 V |
FLASH |
.4 mm |
FLOATING POINT |
S-PQFP-G120 |
YES |
YES |
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|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
208 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
19 |
32 |
1.2,2.5/3.3 |
GRID ARRAY, FINE PITCH |
BGA208,20X20,32 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.75 mm |
17 mm |
YES |
16 |
50 MHz |
MULTIPLE |
17 mm |
CMOS |
1.8 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B208 |
3 |
Not Qualified |
400 rpm |
YES |
YES |
e1 |
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Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
16 |
14 |
16 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
1 |
0 Cel |
TIN LEAD |
QUAD |
4.45 mm |
512 |
24.18 mm |
20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION |
NO |
24 |
16.67 MHz |
MULTIPLE |
24.18 mm |
1 |
CMOS |
48 mA |
5 V |
0 |
2 |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
YES |
YES |
e0 |
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Analog Devices |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC |
NO |
16 |
5 |
GRID ARRAY |
PGA68,11X11 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
512 |
CMOS |
5 V |
Digital Signal Processors |
2.54 mm |
FIXED POINT |
S-XPGA-P68 |
Not Qualified |
e0 |
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|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
19 |
32 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,23X23,20 |
1.7 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
12 mm |
YES |
16 |
50 MHz |
30 |
260 |
MULTIPLE |
12 mm |
CMOS |
1.8 V |
Microprocessors |
.5 mm |
FIXED POINT |
S-PBGA-B289 |
3 |
Not Qualified |
300 rpm |
YES |
YES |
e1 |
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|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
208 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
20 |
32 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA208,20X20,32 |
.8 V |
85 Cel |
-40 Cel |
BOTTOM |
1.7 mm |
17 mm |
ALSO REQUIRES 2.5V OR 3.3V SUPPLY |
YES |
16 |
40 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
17 mm |
CMOS |
1.2 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B208 |
Not Qualified |
300 rpm |
YES |
YES |
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|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.43 V |
22 |
32 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA400,20X20,32 |
1.14 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.7 mm |
17 mm |
YES |
16 |
50 MHz |
MULTIPLE |
17 mm |
CMOS |
1.2 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
Not Qualified |
400 rpm |
YES |
YES |
e1 |
||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
160 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.45 V |
19 |
32 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA160,14X14,32 |
.8 V |
85 Cel |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
1.7 mm |
12 mm |
ALSO REQUIRES 3V OR 3.3V SUPPLY |
YES |
16 |
40 MHz |
240 |
MULTIPLE |
12 mm |
CMOS |
1.2 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B160 |
3 |
Not Qualified |
500 rpm |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
3.15 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
4194304 |
32 mm |
YES |
48 |
33.33 MHz |
MULTIPLE |
32 mm |
CMOS |
3.3 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
Not Qualified |
YES |
YES |
e3 |
|||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, MIXED |
COMMERCIAL |
GULL WING |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
14 |
16 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.63X.87,20 |
3 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
1.6 mm |
8192 |
14 mm |
NO |
24 |
49 MHz |
MULTIPLE |
20 mm |
CMOS |
3.3 V |
Digital Signal Processors |
.5 mm |
FIXED POINT |
R-PQFP-G128 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
16 |
14 |
16 |
3.3 |
FLATPACK |
QFP80,.7SQ |
3 V |
85 Cel |
1 |
-40 Cel |
TIN LEAD |
QUAD |
2.45 mm |
512 |
14 mm |
20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION |
NO |
24 |
10.24 MHz |
MULTIPLE |
14 mm |
1 |
CMOS |
20 mA |
3.3 V |
0 |
2 |
Digital Signal Processors |
MROM |
.65 mm |
FIXED POINT |
S-PQFP-G80 |
Not Qualified |
YES |
YES |
e0 |
24 |
Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.
DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.
DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.