Analog Devices Digital Signal Processors (DSPs) 1,436

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-21992BSTZ	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.625 V		20	16		FLATPACK, LOW PROFILE, FINE PITCH		2.375 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES	16	160 MHz		260	MULTIPLE	24 mm		CMOS		2.5 V					.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified		YES	YES	e3
ADSP-21061LKSZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL EXTENDED	GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY		YES	3.45 V		32	32	3.3	FLATPACK, FINE PITCH	QFP240,1.3SQ,20	3.15 V	85 Cel	0 Cel	MATTE TIN	QUAD	4.1 mm	32768	32 mm		YES	48	40 MHz		260	MULTIPLE	32 mm		CMOS	480 mA	3.3 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240	3	Not Qualified		NO	YES	e3
ADSP-BF537BBCZ-5B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	500 MHz		260	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-21060LCW-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	240	HFQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	3.45 V		32	32	3.3	FLATPACK, HEAT SINK/SLUG, FINE PITCH	HQFP240,1.37SQ,20	3.15 V	100 Cel	-40 Cel	GOLD	QUAD	4.2 mm	131072	32 mm		YES	48	40 MHz			MULTIPLE	32 mm		CMOS	600 mA	3.3 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-CQFP-G240		Not Qualified		YES	YES	e4
ADSP-BF537BBCZ-5BV	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V		19	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA208,20X20,32	1.2 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	533 MHz		260	MULTIPLE	17 mm		CMOS		1.25 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-2191MBCA-140	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V		22	16	2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	2.37 V	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	1.7 mm	32768	10 mm		YES	16	100 MHz		240	MULTIPLE	10 mm		CMOS		2.5 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e0
ADSP-21479BBCZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	24	40		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	5242880	12 mm		YES	16	16.67 MHz		260	MULTIPLE	12 mm	1	CMOS		1.2 V	65	1		FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3			YES	YES	e1	8
ADSP-BF537BBCZ-5AV	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V		19	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	533 MHz		260	MULTIPLE	12 mm		CMOS		1.25 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-21479BBCZ-2AX	Analog Devices		INDUSTRIAL	BALL	196	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA196,14X14,32		85 Cel	-40 Cel		BOTTOM		163840																Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B196		Not Qualified
ADSP-BF534BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	500 MHz	30	260	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-BF536BBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	400 MHz		260	MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-21469BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V		24	32	1.05,1.8,3.3	GRID ARRAY	BGA324,18X18,40	1 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.8 mm	163840	19 mm		YES	8	66.66 MHz	30	260	MULTIPLE	19 mm		CMOS	10 mA	1.05 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B324	3	Not Qualified		NO	YES	e1
ADSP-BF538BBCZ-5F8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-2186BSTZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		14	16	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	4.5 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	8196	14 mm		NO	24	20 MHz	30	260	MULTIPLE	14 mm		CMOS		5 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-BF537BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	500 MHz		260	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-TS201SABPZ060	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.1 mm		25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64				MULTIPLE	25 mm		CMOS		1.2 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES	e1
ADSP-TS201SABP-050	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V		32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	1 V	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	3.1 mm	786432	25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64	125 MHz		225	MULTIPLE	25 mm		CMOS		1.05 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES	e0
ADSP-BF527BBCZ-5AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		0	32	1,1.8/3.3,3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1 V	85 Cel	-40 Cel		BOTTOM	1.75 mm		17 mm		YES	0	133 MHz			MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208		Not Qualified	533 rpm	NO	YES
ADSP-BF533SBBZ500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	169	BGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19	32	1.2,2.5/3.3	GRID ARRAY	BGA169,17X17,40	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm		19 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	19 mm		CMOS		1.2 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B169	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-BF706BCPZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS		1.8 V					.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-BF548BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V		22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.188 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS		1.25 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF532SBSTZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19	32	1.2,2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	.8 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm		24 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	24 mm		CMOS		1.2 V			Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	400 rpm	YES	YES	e3
ADSP-BF527BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-21478BBCZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	24	40		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	3145728	12 mm		YES	16	16.67 MHz		260	MULTIPLE	12 mm	1	CMOS		1.2 V	65	1		FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3			YES	YES	e1	8
ADSP-21479BSWZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	24	40	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.14 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	5242880	14 mm		YES	16	16.67 MHz	30	260	MULTIPLE	14 mm	1	CMOS		1.2 V	65	1	Digital Signal Processors	FLASH	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3	8
ADSP-21469KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V		24	32	1.1,1.8,3.3	GRID ARRAY	BGA324,18X18,40	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.8 mm	163840	19 mm		YES	8	75.41 MHz	30	260	MULTIPLE	19 mm		CMOS	10 mA	1.1 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B324	3	Not Qualified		NO	YES	e1
ADSP-21364BSWZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	20 mm		CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-BF534BBCZ-5B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	500 MHz	30	260	MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-BF533SKBCZ-6V	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	12 mm		CMOS		1.3 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF533SBBCZ500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-TS201SYBPZ050	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V		32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	1 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.1 mm		25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64	125 MHz	40	260	MULTIPLE	25 mm		CMOS		1.05 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES	e1
ADSP-21478BBCZ-2AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		BOTTOM	1.5 mm		12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm		CMOS		1.2 V					.8 mm	FLOATING POINT	S-PBGA-B196				YES	YES
ADSP-TS201SABP-060	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		32	32	1.2,1.6,2.5	GRID ARRAY	BGA576,24X24,40	1.14 V	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	3.1 mm	786432	25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64	125 MHz		225	MULTIPLE	25 mm		CMOS		1.2 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES	e0
ADSP-21479KBCZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	24	40	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.14 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	5242880	12 mm		YES	16	16.67 MHz	30	260	MULTIPLE	12 mm	1	CMOS		1.2 V	65	1	Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e1	8
ADSP-TS101SAB1Z000	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	625	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		32			GRID ARRAY		1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm		27 mm		YES	64			260	SINGLE	27 mm		CMOS		1.25 V					1 mm	FLOATING POINT	S-PBGA-B625	3			YES	YES	e1
ADSP-21363KSWZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel	0 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	20 mm		CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21469KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V		24	32	1.05,1.8,3.3	GRID ARRAY	BGA324,18X18,40	1 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.8 mm	163840	19 mm		YES	8	66.66 MHz	30	260	MULTIPLE	19 mm		CMOS	10 mA	1.05 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B324	3	Not Qualified		NO	YES	e1
ADSP-21371KSWZ-2B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.14 V	70 Cel	0 Cel	MATTE TIN	QUAD	1.6 mm	32768	28 mm		YES	32	16.67 MHz		260	MULTIPLE	28 mm		CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G208	3	Not Qualified		NO	YES	e3
ADSP-21569KBCZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	110 Cel	0 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16		30	260	MULTIPLE	17 mm	10	CMOS		1 V				FLASH	.8 mm	FLOATING POINT	S-PBGA-B400	3			YES	YES
ADSP-BF514BBCZ4F16	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER																			Tin/Silver/Copper (Sn/Ag/Cu)									30	260				CMOS										3					e1
ADSP-21479BSWZ-2AX	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY		YES				32	1.2,3.3	FLATPACK	QFP100,.63SQ,20		85 Cel	-40 Cel		QUAD		163840																Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G100		Not Qualified
ADSP-2185BSTZ-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		24			FLATPACK, LOW PROFILE, FINE PITCH		4.5 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm		14 mm		NO	16	16.67 MHz	30	260	MULTIPLE	14 mm		CMOS		5 V					.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-2191MBSTZ-140	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.63 V		22	16	2.5,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	2.37 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	32768	20 mm		YES	16	100 MHz		260	MULTIPLE	20 mm		CMOS		2.5 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G144	3	Not Qualified		YES	YES	e3
ADSP-BF532SBST400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	.8 V	85 Cel	-40 Cel	TIN LEAD	QUAD	1.6 mm		24 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz			MULTIPLE	24 mm		CMOS		1.2 V			Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	400 rpm	YES	YES	e0
ADSP-BF706BCPZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm		CMOS		1.8 V					.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-2191MKSTZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.63 V		22	16	2.5,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	2.37 V	70 Cel	0 Cel	MATTE TIN	QUAD	1.6 mm	32768	20 mm		YES	16	100 MHz		260	MULTIPLE	20 mm		CMOS		2.5 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G144	3	Not Qualified		YES	YES	e3
ADSP-BF518BSWZ4F16	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER																												30	260				CMOS										3
ADSP-2186NBSTZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	8192	14 mm		NO	24	40 MHz	30	260	MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.