Analog Devices Digital Signal Processors (DSPs) 1,436

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-2189MBSTZ-266	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.75 V			14	16	2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	2.25 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	49152	14 mm	ALSO REQUIRES 3.3V SUPPLY	NO	24	33 MHz	30	260	MULTIPLE	14 mm		CMOS		2.5 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-BF504BCPZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V			0	32	1.3,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	.85 mm		12 mm		NO	0	50 MHz	30	260	MULTIPLE	12 mm		CMOS		3 V			Microprocessors		.5 mm	FIXED POINT	S-XQCC-N88	3	Not Qualified	400 rpm	YES	YES	e3
ADSP-BF525KBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm		CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF538BBCZ-4F8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF547MBBCZ-5M	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.188 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS		1.25 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF706KCPZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V			0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel		0 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm		CMOS		1.8 V					.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-TS101SAB1-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	625	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			32	32	1.2,3.3	GRID ARRAY	BGA625,25X25,40	1.14 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.5 mm	196608	27 mm		YES	64	100 MHz		225	MULTIPLE	27 mm		CMOS		1.2 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B625	3	Not Qualified		YES	YES	e0
ADSP-TS201SWBPZ050	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V			32			GRID ARRAY		1 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.1 mm		25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64	125 MHz			MULTIPLE	25 mm		CMOS		1.05 V					1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES	e1
ADSP-21161NYCAZ110	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			24	32	1.8,3.3	GRID ARRAY	BGA225,15X15,40	1.71 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.85 mm	32768	17 mm		YES	48	27.5 MHz			MULTIPLE	17 mm		CMOS	965 mA	1.8 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		NO	YES	e1
ADSP-BF531SBST400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.32 V			20	32	1.2,2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	.8 V	85 Cel		-40 Cel	TIN LEAD	QUAD	1.6 mm		24 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz			MULTIPLE	24 mm		CMOS		1.2 V			Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	400 rpm	YES	YES	e0
ADSP-BF512BSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.47 V			19	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.164 V	85 Cel		-40 Cel		QUAD	1.6 mm		24 mm		YES	16	400 MHz	30	260	MULTIPLE	24 mm		CMOS		1.4 V			Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	400 rpm	YES	YES
ADSP-BF523BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF547BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.188 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS		1.25 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-SC572KBCZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS		1.1 V					.8 mm	FIXED POINT	S-PBGA-B400	3			YES	YES	e1
ADSP-BF537KBCZ-6AV	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			19	32	1.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	600 MHz		260	MULTIPLE	12 mm		CMOS		1.3 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-21369BSWZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V			24	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.14 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	65536	28 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	44.44 MHz	30	260	MULTIPLE	28 mm		CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G208	3	Not Qualified		NO	YES	e3
ADSP-21571BSWZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.2 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.1 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS		1.15 V					.5 mm	FIXED POINT	S-PQFP-G176	3			YES	YES	e3
ADSP-21369KBPZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V			24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.25 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.67 MHz			MULTIPLE	27 mm		CMOS		1.3 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e1
ADSP-21565WCSWZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	GULL WING	120	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP120,.63SQ,16	.95 V	125 Cel		-40 Cel		DUAL	1.6 mm	163840	14 mm		YES	16				MULTIPLE	14 mm	6	CMOS		1 V				FLASH	.4 mm	FLOATING POINT	S-PQFP-G120				YES	YES
ADSP-21593KBPZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel		0 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	16	CMOS		1 V		6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-2181KST-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	16		14	16	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	4.5 V	70 Cel	4	0 Cel	TIN LEAD	QUAD	1.6 mm	8192	14 mm		NO	24	20 MHz			MULTIPLE	20 mm	1	CMOS		5 V	2	2	Digital Signal Processors		.5 mm	FIXED POINT	R-PQFP-G128	3	Not Qualified		YES	YES	e0
ADSP-2185NKSTZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V			14	16	1.8,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	16384	14 mm		NO	24	40 MHz	30	260	MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-BF561SKBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.4185 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm		17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		260	MULTIPLE	17 mm		CMOS		1.35 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-21565BSWZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	GULL WING	120	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP120,.63SQ,16	.95 V	125 Cel		-40 Cel		DUAL	1.6 mm	163840	14 mm		YES	16		NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	14 mm	6	CMOS		1 V				FLASH	.4 mm	FLOATING POINT	S-PQFP-G120				YES	YES
ADSP-BF707BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS		1.8 V					.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-2105KP-55	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16		14	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	70 Cel	1	0 Cel	TIN LEAD	QUAD	4.45 mm	512	24.18 mm	20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	13.824 MHz			MULTIPLE	24.18 mm	1	CMOS	24 mA	5 V	0	1	Digital Signal Processors		1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified		YES	YES	e0
ADSP-21060KS-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	1		32	32	5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	QFP240,1.3SQ,20	4.75 V	85 Cel	3	0 Cel	TIN LEAD	QUAD	4.1 mm	4M	32 mm	40 MIPS; 16/32 BIT PARALLEL HOST INTERFACE PORT; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED	YES	48	40 MHz		225	MULTIPLE	32 mm	1	CMOS	850 mA	5 V	10	2	Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240	3	Not Qualified		YES	YES	e0
ADSP-21062LCS-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY		YES	3.45 V			32	32	3.3	FLATPACK, HEAT SINK/SLUG, FINE PITCH	QFP240,1.3SQ,20	3.15 V				TIN LEAD	QUAD	4.1 mm	65536	32 mm		YES	48	40 MHz		225	MULTIPLE	32 mm		CMOS	600 mA	3.3 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240	3	Not Qualified		YES	YES	e0
ADSP-21065LKS-240	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V			24	32	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	3.13 V	85 Cel		0 Cel	TIN LEAD	QUAD	4.1 mm	16384	28 mm		YES	32	30 MHz		240	MULTIPLE	28 mm		CMOS	470 mA	3.3 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G208	3	Not Qualified		NO	YES	e0
ADSP-21160MKBZ-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V			32	32	2.5,3.3	GRID ARRAY	BGA400,20X20,50	2.37 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.49 mm	131072	27 mm		YES	64	80 MHz		260	MULTIPLE	27 mm		CMOS		2.5 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B400	3	Not Qualified		YES	YES	e1
ADSP-21262SBBC-150	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	1.7 mm	65536	12 mm		YES	16	50 MHz		240	MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e0
ADSP-21262SKBC-200	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.26 V	32		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	1.7 mm	65536	12 mm		YES	16	200 MHz		240	MULTIPLE	12 mm	3	CMOS		1.2 V	22		Digital Signal Processors	MROM	.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e0	32
ADSP-21363YSWZ-2AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.05 V			16	32	1,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	.95 V	105 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	33.33 MHz		260	MULTIPLE	20 mm		CMOS		1 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21375KSWZ-2B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V			24	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.14 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	16384	28 mm		YES	32	16.67 MHz		260	MULTIPLE	28 mm		CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G208	3	Not Qualified		NO	YES	e3
ADSP-21565KSWZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	120	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		16	32		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP120,.63SQ,16	.95 V	110 Cel		0 Cel		DUAL	1.6 mm	163840	14 mm		YES	16		30	260	MULTIPLE	14 mm	6	CMOS		1 V				FLASH	.4 mm	FLOATING POINT	S-PQFP-G120	3			YES	YES
ADSP-2181KSZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	128	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16		14	16	5	FLATPACK	QFP128,1.2SQ,32	4.5 V	70 Cel	4	0 Cel	Matte Tin (Sn) - annealed	QUAD	4.07 mm	8192	28 mm		NO	24	20 MHz		260	MULTIPLE	28 mm	1	CMOS		5 V	2	2	Digital Signal Processors		.8 mm	FIXED POINT	S-PQFP-G128	3	Not Qualified		YES	YES	e3
ADSP-2186MBSTZ-266	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.75 V			14			FLATPACK, LOW PROFILE, FINE PITCH		2.25 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm		14 mm		NO	24	33 MHz	30	260	MULTIPLE	14 mm		CMOS		2.5 V					.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-2187LBSTZ-210	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16		14			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	3 V	85 Cel	6	-40 Cel	MATTE TIN	QUAD	1.6 mm	16384	14 mm		NO	24		30	260	MULTIPLE	14 mm		CMOS		3.3 V				FLASH	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3	24
ADSP-2187NBSTZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V			14	16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	32768	14 mm		NO	24	40 MHz	30	260	MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-2189NBST-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V			14	16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	TIN LEAD	QUAD	1.6 mm	49152	14 mm		NO	24	40 MHz			MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e0
ADSP-2191MBCAZ-140	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V			22	16	2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	2.37 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	32768	10 mm		YES	16	100 MHz		260	MULTIPLE	10 mm		CMOS		2.5 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e1
ADSP-BF506BSWZ-3F	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	120	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V			0	32	1.3,1.8/3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP120,.63SQ,16	2.7 V	85 Cel		-40 Cel		QUAD	1.6 mm		14 mm		NO	0	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	14 mm		CMOS		3 V			Microprocessors		.4 mm	FIXED POINT	S-PQFP-G120		Not Qualified	300 rpm	YES	YES
ADSP-BF512BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V			19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	300 MHz	30	260	MULTIPLE	12 mm		CMOS		1.225 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF512BSWZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.47 V			19	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.164 V	85 Cel		-40 Cel		QUAD	1.6 mm		24 mm		YES	16	300 MHz	30	260	MULTIPLE	24 mm		CMOS		1.225 V			Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	300 rpm	YES	YES
ADSP-BF518BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V			19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	400 MHz			MULTIPLE	12 mm		CMOS		1.4 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF525BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz		260	MULTIPLE	17 mm		CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF531SBBCZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz		260	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF533SBBCZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	400 rpm	YES	YES	e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.