Analog Devices Digital Signal Processors (DSPs) 1,436

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code
ADSP-BF536BBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	400 MHz		260	MULTIPLE	12 mm	CMOS		1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF536BBCZ3BRL	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	300 MHz	30	260	MULTIPLE	17 mm	CMOS		1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF537KBCZ-6BV	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.43 V		19	32	1.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA208,20X20,32	.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	600 MHz		260	MULTIPLE	17 mm	CMOS		1.3 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF547KBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.43 V		22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.3 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm	CMOS			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF561SBB600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY	YES	1.4185 V		23	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	2.43 mm		27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		225	MULTIPLE	27 mm	CMOS		1.35 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B297	3	Not Qualified	600 rpm	YES	YES	e0
ADSP-BF561SBBZ500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY	YES	1.375 V		23	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.43 mm		27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	27 mm	CMOS		1.25 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B297	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-BF561SKBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1.375 V		23	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm		17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	17 mm	CMOS		1.25 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-TS101SAB2Z100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	32		GRID ARRAY, FINE PITCH		1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm		19 mm		YES	64			260	SINGLE	19 mm	CMOS		1.2 V		.8 mm	FLOATING POINT	S-PBGA-B484	3			YES	YES	e1
AD73411BB-40	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	119	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		14	16	3.3	GRID ARRAY	BGA119,7X17,50	3 V	85 Cel	-20 Cel	TIN LEAD	BOTTOM	2.27 mm	8192	14 mm		NO	24	16.384 MHz			MULTIPLE	22 mm	CMOS		3.3 V	Digital Signal Processors	1.27 mm	FIXED POINT	R-PBGA-B119		Not Qualified		YES	YES	e0
AD73522-40	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	119	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		24	16	3.3	GRID ARRAY	BGA119,7X17,50	3 V	85 Cel	-20 Cel	TIN LEAD	BOTTOM	2.27 mm	8192	14 mm		NO	16	16.384 MHz			MULTIPLE	22 mm	CMOS		3.3 V	Digital Signal Processors	1.27 mm	FIXED POINT	R-PBGA-B119		Not Qualified		YES	YES	e0
AD21364WYSWZ2XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.05 V		16			FLATPACK, LOW PROFILE, FINE PITCH		.95 V	105 Cel	-40 Cel		QUAD	1.6 mm		20 mm		YES	16	33.33 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	20 mm	CMOS		1 V		.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES
ASDP-21060LCW-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	240	HFQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	3.45 V		32	32	3.3	FLATPACK, HEAT SINK/SLUG, FINE PITCH	HQFP240,1.37SQ,20	3.15 V	100 Cel	-40 Cel		QUAD	4.2 mm	4194304	32 mm		YES	48	33.33 MHz			MULTIPLE	32 mm	CMOS		3.3 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-CQFP-G240	1	Not Qualified		YES	YES
ADBF539WBBCZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		19			GRID ARRAY, LOW PROFILE, FINE PITCH		2.7 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm	CMOS		3.3 V		.8 mm	FIXED POINT	S-PBGA-B316				YES	YES
AD21366WYSWZ2XXA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.05 V		16			FLATPACK, LOW PROFILE, FINE PITCH		.95 V	105 Cel	-40 Cel		QUAD	1.6 mm		20 mm		YES	16	33.33 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	20 mm	CMOS		1 V		.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES
ADMCF328BN	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.25 V		0			IN-LINE		4.75 V	85 Cel	-40 Cel	TIN LEAD	DUAL	6.35 mm		15.24 mm		NO	0	10 MHz			MULTIPLE	37.4 mm	CMOS		5 V		2.54 mm	FIXED POINT	R-PDIP-T28		Not Qualified		NO	YES	e0
AD80066KRSZRL	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V					SMALL OUTLINE, SHRINK PITCH		4.75 V	70 Cel	0 Cel	MATTE TIN	DUAL	2 mm		5.3 mm		NO	8					10.2 mm	CMOS		5 V		.65 mm	FIXED POINT	R-PDSO-G28	1	Not Qualified		YES	NO	e3
ADBF533WBBZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	169	BGA	SQUARE	PLASTIC/EPOXY	YES	1.45 V		19			GRID ARRAY		.95 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm		19 mm		YES	16	40 MHz			MULTIPLE	19 mm	CMOS		1.25 V		1 mm	FIXED POINT	S-PBGA-B169		Not Qualified		YES	YES	e1
ADMC340VST-XXX-XXXX	Analog Devices		AUTOMOTIVE	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES				16	5	FLATPACK	QFP64,.66SQ,32		125 Cel	-40 Cel		QUAD		512											60 mA	5 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PQFP-G64		Not Qualified
AD21365WYSWZ2XXA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.05 V		16			FLATPACK, LOW PROFILE, FINE PITCH		.95 V	105 Cel	-40 Cel		QUAD	1.6 mm		20 mm		YES	16	33.33 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	20 mm	CMOS		1 V		.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES
ASDP-21060CZZ-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	240	HFQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	5.25 V		32	32	5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	HQFP240,1.37SQ,20	4.75 V	100 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	4.3 mm	4194304	32 mm		YES	48	33.33 MHz			MULTIPLE	32 mm	CMOS		5 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-CQFP-G240		Not Qualified		YES	YES	e4
AD14160LKB-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	452	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	5.25 V		32	32	3.3	GRID ARRAY	BGA452,36X36,50	4.75 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	5.08 mm	524288	46.995 mm		YES	48	40 MHz			MULTIPLE	46.995 mm	CMOS	2200 mA	5 V	Digital Signal Processors	1.27 mm	FLOATING POINT	S-CBGA-B452		Not Qualified		YES	YES	e0
ASDP-21365BBC-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm	CMOS		1.2 V	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B136	1	Not Qualified		NO	YES
ADMC330BST	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		0			FLATPACK, LOW PROFILE		4.5 V	85 Cel	-40 Cel	TIN LEAD	QUAD	1.6 mm		14 mm		NO	0	20 MHz			MULTIPLE	14 mm	CMOS		5 V		.65 mm	FIXED POINT	S-PQFP-G80		Not Qualified		YES	YES	e0
ADBF592WYCPZXX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	105 Cel	-40 Cel		QUAD	1 mm		9 mm	ALSO OPERATES AT 2.5 AND 3.3 V TYP	YES		50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	9 mm	CMOS		1.8 V		.5 mm	FIXED POINT	S-XQCC-N64		Not Qualified		YES	YES
AD21364WBBCZ105	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	85 Cel	-40 Cel	MATTE TIN	BOTTOM	1.7 mm	98304	12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm	CMOS		1.2 V	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B136	1	Not Qualified		NO	YES	e3
ADSC570WCSWZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.15 V		0			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		QUAD	1.6 mm		24 mm		YES	0		30	260	MULTIPLE	24 mm	CMOS		1.1 V		.5 mm	FLOATING POINT	S-PQFP-G176				YES	YES
AD21362WBBCZ104	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	85 Cel	-40 Cel	MATTE TIN	BOTTOM	1.7 mm	98304	12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm	CMOS		1.2 V	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B136	1	Not Qualified		NO	YES	e3
AD73511BB-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	119	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0	16	3.3	GRID ARRAY	BGA119,7X17,50	3 V	85 Cel	-20 Cel	TIN LEAD	BOTTOM	2.27 mm	16384	14 mm		NO	0	16.384 MHz			MULTIPLE	22 mm	CMOS		3.3 V	Digital Signal Processors	1.27 mm	FIXED POINT	R-PBGA-B119		Not Qualified		YES	YES	e0
ADMCF340BST	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES			0			FLATPACK, LOW PROFILE			85 Cel	-40 Cel	TIN LEAD	QUAD	1.6 mm		14 mm		NO	0	10 MHz			MULTIPLE	14 mm	CMOS		5 V		.8 mm	FIXED POINT	S-PQFP-G64		Not Qualified		NO	YES	e0
AD73560BB-40	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	119	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V		0	16	3.3	GRID ARRAY	BGA119,7X17,50	2.7 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.27 mm	8192	14 mm		NO	0	16.384 MHz			MULTIPLE	22 mm	CMOS		3 V	Digital Signal Processors	1.27 mm	FIXED POINT	R-PBGA-B119		Not Qualified		YES	YES	e0
AD21573WCSWZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		3.13 V	105 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm	CMOS		3.3 V		.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
AD21362WYSWZ204	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.05 V		16	32	1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	.95 V	105 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm		YES	16	16.67 MHz			MULTIPLE	20 mm	CMOS		1 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G144	1	Not Qualified		NO	YES	e3
ADBF539WBBCZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		19			GRID ARRAY, LOW PROFILE, FINE PITCH		2.7 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	CMOS		3.3 V		.8 mm	FIXED POINT	S-PBGA-B316				YES	YES
AD73460BB-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	119	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		14			GRID ARRAY		3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.27 mm		14 mm		NO	24	26 MHz			MULTIPLE	22 mm	CMOS		3.3 V		1.27 mm	FIXED POINT	R-PBGA-B119	5	Not Qualified		YES	YES	e0
ADSC573WCBCZ3XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm	CMOS		1.1 V		.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ASDP-21060CWZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	240	HFQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	5.25 V		32	32	5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	HQFP240,1.37SQ,20	4.75 V	100 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	4.2 mm	4194304	32 mm		YES	48	40 MHz			MULTIPLE	32 mm	CMOS		5 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-CQFP-G240		Not Qualified		YES	YES	e4
ADMC328BR	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		0			SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	TIN LEAD	DUAL					NO	0	10 MHz			MULTIPLE		CMOS		5 V			FIXED POINT	R-PDSO-G28		Not Qualified		NO	YES	e0
ADMCF326BR	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V		0			SMALL OUTLINE		4.75 V	85 Cel	-40 Cel	TIN LEAD	DUAL	2.65 mm		7.5 mm		NO	0	10 MHz			MULTIPLE	17.9 mm	CMOS		5 V		1.27 mm	FIXED POINT	R-PDSO-G28		Not Qualified		NO	YES	e0
ADMC326TR-XXX-YY	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V		0			SMALL OUTLINE		4.75 V	125 Cel	-40 Cel	TIN LEAD	DUAL	2.65 mm		7.5 mm		NO	0	10 MHz			MULTIPLE	17.9 mm	CMOS		5 V		1.27 mm	FIXED POINT	R-PDSO-G28		Not Qualified		NO	YES	e0
ADBF707WCBCZ411	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V	AEC-Q100	14			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	105 Cel	-40 Cel		BOTTOM	1.7 mm		12 mm	3.3V NOMINAL ALSO AVAILABLE @60MHZ FREQUENCY	YES	16	60 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm	CMOS		1.8 V		.8 mm	FIXED POINT	S-PBGA-B184				YES	YES
ADBF549MWBBCZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.38 V		22			GRID ARRAY, LOW PROFILE, FINE PITCH		1.188 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	CMOS		1.25 V		.8 mm	FIXED POINT	S-PBGA-B400		Not Qualified		YES	YES
ADMC326TN-XXX-YY	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.25 V		0			IN-LINE		4.75 V	125 Cel	-40 Cel	TIN LEAD	DUAL	6.35 mm		15.24 mm		NO	0	10 MHz			MULTIPLE	37.4 mm	CMOS		5 V		2.54 mm	FIXED POINT	R-PDIP-T28		Not Qualified		NO	YES	e0
AD80066KRSZ	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V					SMALL OUTLINE, SHRINK PITCH		4.75 V	70 Cel	0 Cel	MATTE TIN	DUAL	2 mm		5.3 mm		NO	8					10.2 mm	CMOS		5 V		.65 mm	FIXED POINT	R-PDSO-G28	1	Not Qualified		YES	NO	e3
AD73522-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	119	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		24	16	3.3	GRID ARRAY	BGA119,7X17,50	3 V	85 Cel	-20 Cel	TIN LEAD	BOTTOM	2.27 mm	16384	14 mm		NO	16	16.384 MHz			MULTIPLE	22 mm	CMOS		3.3 V	Digital Signal Processors	1.27 mm	FIXED POINT	R-PBGA-B119		Not Qualified		YES	YES	e0
AD21366WBSWZ105A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.26 V		16	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm		YES	16	16.67 MHz			MULTIPLE	20 mm	CMOS		1.2 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G144	1	Not Qualified		NO	YES	e3
AD21366WYSWZ205A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.05 V		16	32	1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	.95 V	105 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm		YES	16	16.67 MHz			MULTIPLE	20 mm	CMOS		1 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G144	1	Not Qualified		NO	YES	e3
ADBF561WBBCZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	UNSPECIFIED	YES	1.375 V		26			GRID ARRAY		.95 V	85 Cel	-40 Cel		BOTTOM	1.9 mm		17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	133 MHz			MULTIPLE	17 mm	CMOS		1.25 V		1 mm	FIXED POINT	S-XBGA-B256		Not Qualified		YES	YES
ADBF532WBSTZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.45 V		19			FLATPACK, LOW PROFILE, FINE PITCH		.95 V	85 Cel	-40 Cel		QUAD	1.6 mm		24 mm		YES	16	40 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm	CMOS		1.2 V		.5 mm	FIXED POINT	S-PQFP-G176		Not Qualified		YES	YES

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.