Analog Devices Digital Signal Processors (DSPs) 1,436

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-21365YSWZ-2CA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.05 V			16	32	1,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	.95 V	105 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	33.33 MHz			MULTIPLE	20 mm		CMOS		1 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES	e3
ADSP-21365KSQZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	20 mm		CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES	e3
ADSP-2186KST-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16		14	16	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	4.5 V	70 Cel	4	0 Cel	TIN LEAD OVER SILVER	QUAD	1.6 mm	4096	14 mm		NO	24	16.67 MHz			MULTIPLE	14 mm	1	CMOS	100 mA	5 V	2	2	Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100		Not Qualified		YES	YES	e0
ADSP-21365SKSQZENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.14 V	70 Cel		0 Cel		QUAD	1.6 mm		20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	20 mm		CMOS		1.2 V					.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES
ADSP-2172KS-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	128	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16		14			FLATPACK		4.5 V	70 Cel	1	0 Cel	TIN LEAD	QUAD		1024		8/16 BIT PARALLEL HOST INTERFACE PORT	NO	24	16.67 MHz			MULTIPLE		1	CMOS	75 mA	5 V	0	2		MROM		FIXED POINT	S-PQFP-G128		Not Qualified		YES	YES	e0	24
ADSP-BF536BBCZ-3A1	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel		-40 Cel		BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	40 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182		Not Qualified	300 rpm	YES	YES
ADSP-2100SZ	Analog Devices		MILITARY	GULL WING	100	QFP	SQUARE	CERAMIC		YES					16	5	FLATPACK	QFP100,.9SQ		125 Cel		-55 Cel	Tin/Lead (Sn/Pb)	QUAD		0											CMOS	100 mA	5 V			Digital Signal Processors		.635 mm	FIXED POINT	S-XQFP-G100		Not Qualified				e0
ADSP-21362BSWZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	20 mm		CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-2188MKSTZ-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.89 V			14			FLATPACK, LOW PROFILE, FINE PITCH		2.61 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm		14 mm		NO	24	75 MHz	30	260	MULTIPLE	14 mm		CMOS		2.75 V					.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP2103BS52	Analog Devices		INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY		YES					16	3.3	FLATPACK	QFP80,.7SQ		85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	QUAD		1024											CMOS	24 mA	3.3 V			Digital Signal Processors		.635 mm	FIXED POINT	S-PQFP-G80		Not Qualified				e0
ADSP-BF523KBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	30	260	MULTIPLE	12 mm		CMOS		1.8 V			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF702KCPZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V			0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel		0 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm		CMOS		1.8 V					.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-TS201SABP-X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	.95 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	3.1 mm	786432	25 mm		YES	64				MULTIPLE	25 mm		CMOS					Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576		Not Qualified		NO	YES	e0
ADSP-21060KSZ-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V			32	32	5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	QFP240,1.3SQ,20	4.75 V	85 Cel		0 Cel	MATTE TIN	QUAD	4.1 mm	4194304	32 mm	16/32 BIT PARALLEL HOST INTFC PORT; SINGLE CY INSTR EXECUTION; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED	YES	48	33.33 MHz			MULTIPLE	32 mm		CMOS		5 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240		Not Qualified		YES	YES	e3
ADSP-BF533WYBZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	169	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			20	32	1.2,2.5/3.3	GRID ARRAY	BGA169,17X17,40	.8 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm		19 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz			MULTIPLE	19 mm		CMOS		1.2 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B169		Not Qualified	400 rpm	YES	YES	e1
ADSP-BF542BBCZ-5X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			26	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.9 V	85 Cel		-40 Cel	MATTE TIN	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm		CMOS		1.25 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	1	Not Qualified	600 rpm	YES	YES	e3
ADSP-BF534BBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	400 MHz	30	260	MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-2101BP-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16		14	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	85 Cel	1	-40 Cel	TIN LEAD	QUAD	4.45 mm	512	24.18 mm	20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	20 MHz			MULTIPLE	24.18 mm	1	CMOS	31 mA	5 V	0	2	Digital Signal Processors		1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified		YES	YES	e0
ADSP-SC571KSWZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES							FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS							.5 mm	FIXED POINT	S-PQFP-G176	3			YES	YES	e3
ADSP-BF538BBCZ-4F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz		260	MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-2186MBST-266	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.75 V			14	16	2.5,2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	2.25 V	85 Cel		-40 Cel	TIN LEAD OVER SILVER	QUAD	1.6 mm	8192	14 mm		NO	24	33 MHz			MULTIPLE	14 mm		CMOS		2.5 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100		Not Qualified		YES	YES	e0
ADSP-2100JG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	PIN/PEG	100	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.25 V	0		15	16	5	GRID ARRAY	PGA100M,13X13	4.75 V	70 Cel	4	0 Cel	TIN LEAD	PERPENDICULAR		0		SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	24.576 MHz			MULTIPLE		0	CMOS	90 mA	5 V	0	0	Digital Signal Processors		2.54 mm	FIXED POINT	S-CPGA-P100		Not Qualified		YES	YES	e0
ADSP-BF531WBBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160		Not Qualified	400 rpm	YES	YES	e1
ADSP-21060CZZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	240	FQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V			32			FLATPACK, FINE PITCH		4.75 V	100 Cel		-40 Cel	TIN SILVER COPPER	QUAD	4.3 mm		32 mm		YES	48	40 MHz			MULTIPLE	32 mm		CMOS		5 V					.5 mm	FLOATING POINT	S-CQFP-G240		Not Qualified		YES	YES	e1
ADSP-BF539BBCZ-5F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.37 V			20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B316		Not Qualified	533 rpm	YES	YES	e1
ADSP-BF526BBCZ-4AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel		-40 Cel		BOTTOM	1.75 mm		17 mm	ALSO OPERATES AT 2.5 AND 3.3 V TYP	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208		Not Qualified	400 rpm	YES	YES
ADSP-BF592BCPZ-2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V				32	1.3,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.7 V	85 Cel		-40 Cel		QUAD	1 mm		9 mm	ALSO OPERATES AT 2.5 AND 3.3 V TYP	YES		50 MHz	30	260	MULTIPLE	9 mm		CMOS		1.8 V			Microprocessors		.5 mm	FIXED POINT	S-XQCC-N64	3	Not Qualified	200 rpm	YES	YES
ADSP-BF539YBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	105 Cel		-40 Cel		BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS		1 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B316		Not Qualified	400 rpm	YES	YES
ADSP-2101BS-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16		14	16	5	FLATPACK	QFP80,.7SQ	4.5 V	85 Cel	1	-40 Cel	TIN LEAD	QUAD	2.45 mm	512	14 mm		NO	24	25 MHz			MULTIPLE	14 mm	1	CMOS	38 mA	5 V	0	2	Digital Signal Processors		.65 mm	FIXED POINT	S-PQFP-G80	3	Not Qualified		YES	YES	e0
ADSP-BF534BBC-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	500 MHz		240	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	500 rpm	YES	YES	e0
ADSP-21477KCPZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.26 V	8		24	40	1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.14 V	70 Cel		0 Cel	MATTE TIN	QUAD	.9 mm	2097152	12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm	1	CMOS		1.2 V	65	1	Digital Signal Processors		.5 mm	FLOATING POINT	S-XQCC-N88	3	Not Qualified		YES	YES	e3
ADSP-21266SKSTZ-150X	Analog Devices		COMMERCIAL	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY		YES					32	1.2,3.3	FLATPACK	QFP144,.87SQ,20		70 Cel		0 Cel		QUAD		65536											CMOS	500 mA				Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified
ADSP-TS202SABP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	.95 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	3.1 mm	393216	25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64	125 MHz			MULTIPLE	25 mm		CMOS		1 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576		Not Qualified		NO	YES	e0
5962-9800302HXX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	MILITARY	BALL	452	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V		MIL-PRF-38534 Class H	32			GRID ARRAY		4.75 V	125 Cel		-55 Cel		BOTTOM					YES	48	40 MHz			MULTIPLE			CMOS		5 V						FIXED POINT	S-CBGA-B452		Not Qualified		NO	YES
ADSP-21060KS-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	1		32	32	5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	QFP240,1.3SQ,20	4.75 V	85 Cel	3	0 Cel	TIN LEAD	QUAD	4.1 mm	4M	32 mm	16/32 BIT PARALLEL HOST INTFC PORT; SINGLE CY INSTR EXECUTION; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED	YES	48	33.33 MHz		225	MULTIPLE	32 mm	1	CMOS	850 mA	5 V	10	2	Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240	3	Not Qualified		YES	YES	e0
ADSP-BF514KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V			19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	400 MHz	30	260	MULTIPLE	12 mm		CMOS		1.4 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-21363SCSQZENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.05 V			16			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.95 V	105 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm		20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	20 mm		CMOS		1 V					.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES	e3
ADSP-2166KS-66	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V			14	16	3.3	FLATPACK	QFP80,.7SQ	3 V	70 Cel		0 Cel	TIN LEAD	QUAD	3.4 mm	2048	14 mm		NO	24	16.67 MHz			MULTIPLE	14 mm		CMOS	16 mA	3.3 V			Digital Signal Processors		.65 mm	FIXED POINT	S-PQFP-G80		Not Qualified		YES	YES	e0
ADSP-2100ASG/883B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	MILITARY	PIN/PEG	100	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.5 V	0	38535Q/M;38534H;883B	15	16	5	GRID ARRAY	PGA100M,13X13	4.5 V	125 Cel	4	-55 Cel	TIN LEAD	PERPENDICULAR		0		SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	32.768 MHz			MULTIPLE		0	CMOS	130 mA	5 V	0	0	Digital Signal Processors		2.54 mm	FIXED POINT	S-CPGA-P100		Not Qualified		YES	YES	e0
ADSP-BF531WBBZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	169	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			20	32	1.2,2.5/3.3	GRID ARRAY	BGA169,17X17,40	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm		19 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz			MULTIPLE	19 mm		CMOS		1.2 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B169		Not Qualified	400 rpm	YES	YES	e1
ADSP-21061KS-200X	Analog Devices			GULL WING	240	HLFQFP	SQUARE	PLASTIC/EPOXY		YES					32	5	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP240,1.37SQ,20					Tin/Lead (Sn/Pb)	QUAD		32768											CMOS		5 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240		Not Qualified				e0
ADSP-2181BST-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	16		14	16	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	4.5 V	85 Cel	4	-40 Cel	TIN LEAD	QUAD	1.6 mm	8192	14 mm	33 MIPS SUSTAINED; SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	16.67 MHz			MULTIPLE	20 mm	1	CMOS	100 mA	5 V	2	2	Digital Signal Processors		.5 mm	FIXED POINT	R-PQFP-G128	3	Not Qualified		YES	YES	e0
ADSP2103BP52	Analog Devices		INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES					16	3.3	CHIP CARRIER	LDCC68,1.0SQ		85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	QUAD		1024											CMOS	24 mA	3.3 V			Digital Signal Processors		1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified				e0
ADSP-2186MKCAZ-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V			14			GRID ARRAY, LOW PROFILE, FINE PITCH		2.37 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		10 mm		NO	24	37.5 MHz		260	MULTIPLE	10 mm		CMOS		2.5 V					.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e1
ADSP-21065LKS-240X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V			24	32	3.3	FLATPACK	QFP208,1.2SQ,20	3 V	85 Cel		0 Cel	TIN LEAD	QUAD		16384			YES	32	30 MHz			MULTIPLE			CMOS		3.3 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G208		Not Qualified		NO	YES	e0
ADSP-2115BP-40	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16		14	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	85 Cel	3	-40 Cel	TIN LEAD	QUAD	4.45 mm	512	23.875 mm	COMPANDING HARDWARE WITH SERIAL PORTS; INTERNAL WIDTH PMA=14; DMA=14; PMD=24; DMD=16	NO	24	10.24 MHz			MULTIPLE	23.875 mm	1	CMOS	55 mA	5 V	0	2	Digital Signal Processors		1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified		YES	YES	e0
ADSP-2101TG/883B-50	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	MILITARY	PIN/PEG	68	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.5 V	16	38535Q/M;38534H;883B	14	16	5	GRID ARRAY	PGA68,11X11	4.5 V	125 Cel	3	-55 Cel	TIN LEAD	PERPENDICULAR		512		20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	12.5 MHz			MULTIPLE		1	CMOS	45 mA	5 V	0	2	Digital Signal Processors		2.54 mm	FIXED POINT	S-CPGA-P68		Not Qualified		YES	YES	e0
ADSP-21567WCBCZ8RL	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel		-40 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16				MULTIPLE	17 mm	10	CMOS		1 V				FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.