Analog Devices Digital Signal Processors (DSPs) 1,436

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code
AD73560BB-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	119	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.3 V		0	16	3.3	GRID ARRAY	BGA119,7X17,50	2.7 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.27 mm	16384	14 mm		NO	0	16.384 MHz			MULTIPLE	22 mm		CMOS		3 V			Digital Signal Processors	1.27 mm	FIXED POINT	R-PBGA-B119		Not Qualified	YES	YES	e0
AD73422BB-40	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	OTHER	BALL	119	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V		14	16	3.3	GRID ARRAY	BGA119,7X17,50	3 V	85 Cel	-20 Cel	TIN LEAD	BOTTOM	2.27 mm	8192	14 mm	ALSO REQUIRES 3.3V SUPPLY	NO	24	52 MHz		225	MULTIPLE	22 mm		CMOS		3.3 V			Digital Signal Processors	1.27 mm	FIXED POINT	R-PBGA-B119	5	Not Qualified	YES	YES	e0
AD21365WYSWZ204A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.05 V		16	32	1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	.95 V	105 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm		YES	16	16.67 MHz			MULTIPLE	20 mm		CMOS		1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G144	1	Not Qualified	NO	YES	e3
ASDP-21365BBCZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	85 Cel	-40 Cel	MATTE TIN	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B136	1	Not Qualified	NO	YES	e3
ADMC401BST	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V		14			FLATPACK, LOW PROFILE, FINE PITCH		4.75 V	85 Cel	-40 Cel	TIN LEAD	QUAD	1.6 mm		20 mm		NO	24	13 MHz			MULTIPLE	20 mm		CMOS		5 V				.5 mm	FIXED POINT	S-PQFP-G144		Not Qualified	YES	YES	e0
AD21363WYSWZ2XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.05 V		16			FLATPACK, LOW PROFILE, FINE PITCH		.95 V	105 Cel	-40 Cel		QUAD	1.6 mm		20 mm		YES	16	33.33 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	20 mm		CMOS		1 V				.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified	NO	YES
AD21571WCSWZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V		0			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		QUAD	1.6 mm		24 mm		YES	0		30	260	MULTIPLE	24 mm		CMOS		1.1 V				.5 mm	FLOATING POINT	S-PQFP-G176			YES	YES
AD73460BBZ-40	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	119	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V		14			GRID ARRAY		3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.27 mm		14 mm		NO	24	26 MHz			MULTIPLE	22 mm		CMOS		3.3 V				1.27 mm	FIXED POINT	R-PBGA-B119	3	Not Qualified	YES	YES	e1
AD21364WBBCZ1XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		12 mm		YES	16	55.55 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.2 V				.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified	NO	YES
ADMC300BST	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		0			FLATPACK, LOW PROFILE		4.5 V	85 Cel	-40 Cel	TIN LEAD	QUAD	1.6 mm		14 mm		NO	0	12.5 MHz			MULTIPLE	14 mm		CMOS		5 V				.65 mm	FIXED POINT	S-PQFP-G80		Not Qualified	YES	YES	e0
ADBF533WBBCZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19			GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		12 mm		YES	16	40 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.25 V				.8 mm	FIXED POINT	S-PBGA-B160		Not Qualified	YES	YES
ADBF504WYCPZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V		0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	105 Cel	-40 Cel		QUAD	.85 mm		12 mm		NO	0	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		3 V				.5 mm	FIXED POINT	S-XQCC-N88		Not Qualified	YES	YES
ADSC572WCBCZ42XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS		1.1 V				.8 mm	FLOATING POINT	S-PBGA-B400			YES	YES
ADSC573WCBCZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS		1.1 V				.8 mm	FLOATING POINT	S-PBGA-B400			YES	YES
ASDP-21365WBBCZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	85 Cel	-40 Cel	MATTE TIN	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B136	1	Not Qualified	NO	YES	e3
AD73522BB-80	Analog Devices		OTHER	BALL	119	BGA	RECTANGULAR	PLASTIC/EPOXY		YES				16	3.3	GRID ARRAY	BGA119,7X17,50		85 Cel	-20 Cel	Tin/Lead (Sn/Pb)	BOTTOM		16384											CMOS		3.3 V			Digital Signal Processors	1.27 mm	FIXED POINT	R-PBGA-B119		Not Qualified			e0
ADBF531WBBCZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19			GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		12 mm		YES	16	40 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B160		Not Qualified	YES	YES
ASDP-21060CW-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	240	HFQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V		32	32	5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	HQFP240,1.37SQ,20	4.75 V	100 Cel	-40 Cel		QUAD	4.2 mm	4194304	32 mm		YES	48	33.33 MHz			MULTIPLE	32 mm		CMOS		5 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-CQFP-G240		Not Qualified	YES	YES
AD21366WBSWZ1XXA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16			FLATPACK, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		QUAD	1.6 mm		20 mm		YES	16	55.55 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	20 mm		CMOS		1.2 V				.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified	NO	YES
ADBF518WBBCZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19			GRID ARRAY, LOW PROFILE, FINE PITCH		1.164 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		12 mm		YES	16	400 MHz			MULTIPLE	12 mm		CMOS		1.4 V				.8 mm	FIXED POINT	S-PBGA-B168			YES	YES
ADSC571WCSWZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V		0			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		QUAD	1.6 mm		24 mm		YES	0		30	260	MULTIPLE	24 mm		CMOS		1.1 V				.5 mm	FLOATING POINT	S-PQFP-G176			YES	YES
AD21366WBBCZ1XXA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		12 mm		YES	16	55.55 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.2 V				.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified	NO	YES
AD73422BBZ-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	OTHER	BALL	119	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V		14			GRID ARRAY		3 V	85 Cel	-20 Cel	MATTE TIN	BOTTOM	2.27 mm		14 mm	ALSO REQUIRES 3.3V SUPPLY	NO	24	52 MHz			MULTIPLE	22 mm		CMOS		3.3 V				1.27 mm	FIXED POINT	R-PBGA-B119		Not Qualified	YES	YES	e3
AD21364WBSWZ1XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16			FLATPACK, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		QUAD	1.6 mm		20 mm		YES	16	55.55 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	20 mm		CMOS		1.2 V				.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified	NO	YES
ADMCF341BR	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES			0			SMALL OUTLINE			85 Cel	-40 Cel	TIN LEAD	DUAL	2.65 mm		7.5 mm		NO	0	10 MHz			MULTIPLE	17.9 mm		CMOS						1.27 mm	FIXED POINT	R-PDSO-G28		Not Qualified	YES	YES	e0
AD21362WBSWZ104	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm		YES	16	16.67 MHz			MULTIPLE	20 mm		CMOS		1.2 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G144	1	Not Qualified	NO	YES	e3
AD73411BB-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	119	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V		14	16	3.3	GRID ARRAY	BGA119,7X17,50	3 V	85 Cel	-20 Cel	TIN LEAD	BOTTOM	2.27 mm	16384	14 mm		NO	24	16.384 MHz			MULTIPLE	22 mm		CMOS		3.3 V			Digital Signal Processors	1.27 mm	FIXED POINT	R-PBGA-B119		Not Qualified	YES	YES	e0
ADBF531WBSTZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19			FLATPACK, LOW PROFILE, FINE PITCH		.95 V	85 Cel	-40 Cel		QUAD	1.6 mm		24 mm		YES	16	40 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS		1.2 V				.5 mm	FIXED POINT	S-PQFP-G176		Not Qualified	YES	YES
ADMCF327BR	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V		0			SMALL OUTLINE		4.75 V	85 Cel	-40 Cel	TIN LEAD	DUAL	2.65 mm		7.5 mm		NO	0	20 MHz			MULTIPLE	17.9 mm		CMOS		5 V				1.27 mm	FIXED POINT	R-PDSO-G28		Not Qualified	NO	YES	e0
ADBF561WBBZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V		26			GRID ARRAY		.95 V	85 Cel	-40 Cel		BOTTOM	2.43 mm		27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	133 MHz			MULTIPLE	27 mm		CMOS		1.25 V				1 mm	FIXED POINT	S-PBGA-B297		Not Qualified	YES	YES
AD21571WCSWZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V		0			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		QUAD	1.6 mm		24 mm		YES	0		30	260	MULTIPLE	24 mm		CMOS		1.1 V				.5 mm	FLOATING POINT	S-PQFP-G176			YES	YES
AD21362WBBCZ1XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		12 mm		YES	16	55.55 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.2 V				.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified	NO	YES
AD73422BB-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	OTHER	BALL	119	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V		14	16	3.3	GRID ARRAY	BGA119,7X17,50	3 V	85 Cel	-20 Cel	TIN LEAD	BOTTOM	2.27 mm	16384	14 mm	ALSO REQUIRES 3.3V SUPPLY	NO	24	52 MHz		225	MULTIPLE	22 mm		CMOS		3.3 V			Digital Signal Processors	1.27 mm	FIXED POINT	R-PBGA-B119	5	Not Qualified	YES	YES	e0
AD21363WYSWZ205	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.05 V		16	32	1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	.95 V	105 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm		YES	16	16.67 MHz			MULTIPLE	20 mm		CMOS		1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G144	1	Not Qualified	NO	YES	e3
ADSC570WCSWZ42XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V		0			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		QUAD	1.6 mm		24 mm		YES	0		30	260	MULTIPLE	24 mm		CMOS		1.1 V				.5 mm	FLOATING POINT	S-PQFP-G176			YES	YES
ADBF549WBBCZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.38 V		22			GRID ARRAY, LOW PROFILE, FINE PITCH		1.188 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS		1.25 V				.8 mm	FIXED POINT	S-PBGA-B400		Not Qualified	YES	YES
ADMC340BST	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY		YES			0	16	5	FLATPACK, LOW PROFILE	QFP64,.66SQ,32		125 Cel	-40 Cel	TIN LEAD	QUAD	1.6 mm	512	14 mm		NO	0	10 MHz			MULTIPLE	14 mm		CMOS	60 mA	5 V			Digital Signal Processors	.8 mm	FIXED POINT	S-PQFP-G64		Not Qualified	NO	YES	e0
AD21477WYSWZ1A02	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED		GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	24	40		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP100,.63SQ,20	1.14 V	105 Cel	-40 Cel		QUAD	1.6 mm	2097152	14 mm		YES	16	16.67 MHz			MULTIPLE	14 mm	1	CMOS		1.2 V	65	1		.5 mm	FLOATING POINT	S-PQFP-G100			YES	YES
AD1B60BJ	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V		0			CHIP CARRIER		4.75 V	85 Cel	-40 Cel	TIN LEAD	QUAD					NO	0				SINGLE			CMOS		5 V					FIXED POINT	S-CQCC-J44		Not Qualified	NO	NO	e0
AD14060BF-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	FLAT	308	GQFF	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V		32	32	5	FLATPACK, GUARD RING	TPAK308,3.0SQ,25	4.75 V	100 Cel	-40 Cel	GOLD	QUAD	4.064 mm	524288	52.07 mm		YES	48	40 MHz			MULTIPLE	52.07 mm		CMOS	3400 mA	5 V			Digital Signal Processors	.635 mm	FLOATING POINT	S-CQFP-F308		Not Qualified	NO	YES	e4
ADBF539WBBCZ5F8XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V		19			GRID ARRAY, LOW PROFILE, FINE PITCH		2.7 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm		CMOS		3.3 V				.8 mm	FIXED POINT	S-PBGA-B316			YES	YES
ASDP-21060CW-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	240	HFQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V		32	32	5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	HQFP240,1.37SQ,20	4.75 V	100 Cel	-40 Cel		QUAD	4.2 mm	4194304	32 mm		YES	48	40 MHz			MULTIPLE	32 mm		CMOS		5 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-CQFP-G240		Not Qualified	YES	YES
ADSC572WCBCZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS		1.1 V				.8 mm	FLOATING POINT	S-PBGA-B400			YES	YES
AD21469WBBZ3XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES			24			GRID ARRAY			70 Cel	0 Cel		BOTTOM	2.4 mm		19 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	8	28.125 MHz			MULTIPLE	19 mm		CMOS						1 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	NO	YES
AD14160LBB-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	452	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V		32	32	3.3	GRID ARRAY	BGA452,36X36,50	4.75 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	5.08 mm	524288	46.995 mm		YES	48	40 MHz			MULTIPLE	46.995 mm		CMOS	2200 mA	5 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-CBGA-B452		Not Qualified	YES	YES	e0
ADMC328YR-XXX-YY	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V		0			SMALL OUTLINE		4.75 V	105 Cel	-40 Cel	TIN LEAD	DUAL	2.65 mm		7.5 mm		NO	0	20 MHz			MULTIPLE	17.9 mm		CMOS		5 V				1.27 mm	FIXED POINT	R-PDSO-G28		Not Qualified	NO	YES	e0
ASDP-21060LCW-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	240	HFQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	3.45 V		32	32	3.3	FLATPACK, HEAT SINK/SLUG, FINE PITCH	HQFP240,1.37SQ,20	3.15 V	100 Cel	-40 Cel		QUAD	4.2 mm	4194304	32 mm		YES	48	40 MHz			MULTIPLE	32 mm		CMOS		3.3 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-CQFP-G240		Not Qualified	YES	YES
AD21369WBSWZ1XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		QUAD	1.6 mm		28 mm		YES	32	25 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	28 mm		CMOS		1.2 V				.5 mm	FLOATING POINT	S-PQFP-G144			NO	YES

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.