Analog Devices Digital Signal Processors (DSPs) 1,436

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-BF536BBCZ-3B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	300 MHz		260	MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF561SKB600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY		YES	1.4185 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	2.43 mm		27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		225	MULTIPLE	27 mm		CMOS		1.35 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B297	3	Not Qualified	600 rpm	YES	YES	e0
ADSP-21060LABZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	3.45 V			32	32	3.3	GRID ARRAY	BGA225,15X15,50	3.15 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.7 mm	4194304	23 mm		YES	48	40 MHz		260	MULTIPLE	23 mm		CMOS		3.3 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		YES	YES	e1
ADSP-21065LKSZ-240	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V			24	32	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	3.13 V	85 Cel		0 Cel	MATTE TIN	QUAD	4.1 mm	17408	28 mm		YES	32	30 MHz		260	MULTIPLE	28 mm		CMOS		3.3 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G208	3	Not Qualified		NO	YES	e3
ADSP-BF561SBBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm		17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	17 mm		CMOS		1.25 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-21060KBZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	5.25 V			32	32	5	GRID ARRAY	BGA225,15X15,50	4.75 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.7 mm	4194304	23 mm		YES	48	40 MHz		260	MULTIPLE	23 mm		CMOS		5 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		YES	YES	e1
ADSP-BF703KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm		CMOS		1.8 V					.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-BF518BBCZ-4F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V			19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	85 Cel		-40 Cel		BOTTOM	1.7 mm		12 mm		YES	16	400 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.4 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168		Not Qualified	400 rpm	YES	YES
ADSP-BF518BSWZ-4FX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V			19	32	1.3,1.8/3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.7 V	85 Cel		-40 Cel		QUAD	1.6 mm		24 mm	ALSO OPERATES AT 2.5 AND 3.3 V TYP	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS		1.8 V			Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176		Not Qualified	400 rpm	YES	YES
ADSP-BF527KBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF532SBBCZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz		260	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-21479BCPZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.26 V	8		24	40	1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.14 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	.9 mm	5242880	12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm	1	CMOS		1.2 V	65	1	Digital Signal Processors	FLASH	.5 mm	FLOATING POINT	S-XQCC-N88	3	Not Qualified		YES	YES	e3	8
ADSP-21479KCPZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.26 V	8		24	40	1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.14 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	.9 mm	5242880	12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm	1	CMOS		1.2 V	65	1	Digital Signal Processors	FLASH	.5 mm	FLOATING POINT	S-XQCC-N88	3	Not Qualified		YES	YES	e3	8
ADSP-21562BSWZ4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	GULL WING	120	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP120,.63SQ,16	.95 V	125 Cel		-40 Cel		DUAL	1.6 mm	163840	14 mm		YES	16		NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	14 mm	6	CMOS		1 V				FLASH	.4 mm	FLOATING POINT	S-PQFP-G120				YES	YES
ADSP-21562KSWZ4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	GULL WING	120	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP120,.63SQ,16	.95 V	125 Cel		-40 Cel		DUAL	1.6 mm	163840	14 mm		YES	16		30	260	MULTIPLE	14 mm	6	CMOS		1 V				FLASH	.4 mm	FLOATING POINT	S-PQFP-G120	3			YES	YES
ADSP-2184BST-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			14	16	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	4.5 V	85 Cel		-40 Cel	TIN LEAD OVER SILVER	QUAD	1.6 mm	4096	14 mm		NO	24	40 MHz			MULTIPLE	14 mm		CMOS		5 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100		Not Qualified		YES	YES	e0
ADSP-2184BSTZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			14			FLATPACK, LOW PROFILE, FINE PITCH		4.5 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm		14 mm		NO	24	40 MHz	30	260	MULTIPLE	14 mm		CMOS		5 V					.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-2186LKST-115	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16		14			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	3 V	70 Cel	6	0 Cel	TIN LEAD OVER SILVER	QUAD	1.6 mm	4096	14 mm		NO	24				MULTIPLE	14 mm		CMOS		3.3 V				FLASH	.5 mm	FLOATING POINT	S-PQFP-G100		Not Qualified		YES	YES	e0	24
ADSP-BF518BSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.47 V			19	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.164 V	85 Cel		-40 Cel		QUAD	1.6 mm		24 mm		YES	16	400 MHz	30	260	MULTIPLE	24 mm		CMOS		1.4 V			Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	400 rpm	YES	YES
ADSP-BF518BSWZ-4X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V			19	32	1.3,1.8/3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.7 V	85 Cel		-40 Cel		QUAD	1.6 mm		24 mm	ALSO OPERATES AT 2.5 AND 3.3 V TYP	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS		1.8 V			Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176		Not Qualified	400 rpm	YES	YES
ADSP-BF527KBCZ-6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	30	260	MULTIPLE	12 mm		CMOS		1.8 V			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF527KBCZ-6AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			0	32	1,1.8/3.3,3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1 V	70 Cel		0 Cel		BOTTOM	1.75 mm		17 mm		YES	0	133 MHz			MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208		Not Qualified	600 rpm	NO	YES
ADSP-BF527KBCZ-6C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V				32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel		0 Cel		BOTTOM	1.4 mm		12 mm		YES			NOT SPECIFIED	NOT SPECIFIED	SINGLE	12 mm		CMOS		3.3 V			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	600 rpm	YES	NO
ADSP-BF527KBCZ-6X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			0	32	1,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1 V	70 Cel		0 Cel		BOTTOM	1.4 mm		12 mm		YES	0	133 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	600 rpm	NO	YES
ADSP-BF527KBCZ6C1X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V				32	2/3.3	GRID ARRAY	BGA289,23X23,20	1.8 V	70 Cel		0 Cel		BOTTOM				ALSO OPERATES AT 3.3 V TYP I/O SUPPLY	YES		12.288 MHz			SINGLE			CMOS		2.5 V			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	600 rpm	YES	NO
ADSP-TS201SYBP-050	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V			32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	1 V	105 Cel		-40 Cel		BOTTOM	3.1 mm		25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64	125 MHz		225	MULTIPLE	25 mm		CMOS		1.05 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES
ADSP-21060KSZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	1		32	32	5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	QFP240,1.3SQ,20	4.75 V	85 Cel	3	0 Cel	MATTE TIN	QUAD	4.1 mm	4M	32 mm	40 MIPS; 16/32 BIT PARALLEL HOST INTERFACE PORT; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED	YES	48	40 MHz		260	MULTIPLE	32 mm	1	CMOS	850 mA	5 V	10	2	Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240	3	Not Qualified		YES	YES	e3
ADSP-21161NKCA-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			24	32	1.8,3.3	GRID ARRAY	BGA225,15X15,40	1.71 V	85 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	1.85 mm	32768	17 mm		YES	48	27.5 MHz		240	MULTIPLE	17 mm		CMOS		1.8 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		NO	YES	e0
ADSP-21363BBCZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz	30	260	MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1
ADSP-21363KBCZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1
ADSP-21479KSWZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		24	40	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.14 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	5242880	14 mm		YES	16	16.67 MHz	30	260	MULTIPLE	14 mm	1	CMOS		1.2 V	65	1	Digital Signal Processors	FLASH	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3	8
ADSP-2185MKST-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.63 V			14	16	2.5,2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	2.37 V	70 Cel		0 Cel	Tin/Lead (Sn85Pb15) - with Silver (Ag) barrier	QUAD	1.6 mm	16384	14 mm		NO	24	37.5 MHz	30	240	MULTIPLE	14 mm		CMOS		2.5 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e0
ADSP-2185MKST-300X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY		YES				14	16	2.5/3.3	FLATPACK	QFP100,.63SQ,20		85 Cel		-40 Cel	TIN LEAD	QUAD		16384		ALSO REQUIRES 3.3V SUPPLY	NO	24	75 MHz			MULTIPLE			CMOS		2.5 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100		Not Qualified		YES	YES	e0
ADSP-2186MKSTZ-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.63 V			14	16	2.5,2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	2.37 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	8192	14 mm		NO	24	37.5 MHz	30	260	MULTIPLE	14 mm		CMOS		2.5 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-2188NBSTZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V			14	16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	57344	14 mm		NO	24	40 MHz	30	260	MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-BF522BBCZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF561SKB500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	2.43 mm		27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		225	MULTIPLE	27 mm		CMOS		1.25 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B297	3	Not Qualified	500 rpm	YES	YES	e0
ADSP-BF561SKBCZ-6V	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.4185 V			23	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,25	.8 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		260	MULTIPLE	12 mm		CMOS		1.35 V			Microprocessors		.65 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF561SKBZ600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY		YES	1.4185 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.43 mm		27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		260	MULTIPLE	27 mm		CMOS		1.35 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B297	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-21061LKBZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL EXTENDED	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	3.45 V			32	32	3.3	GRID ARRAY	PGA225,15X15	3.15 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.57 mm	32768	23 mm		YES	48	40 MHz	40	260	MULTIPLE	23 mm		CMOS	480 mA	3.3 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		NO	YES	e1
ADSP-21369BBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		260	MULTIPLE	27 mm		CMOS		1.2 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e1
ADSP-21479KBCZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		24	40	1.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	5242880	12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm	1	CMOS		1.2 V	65	1	Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e1	8
ADSP-21563KSWZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	GULL WING	120	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP120,.63SQ,16	.95 V	125 Cel		-40 Cel		DUAL	1.6 mm	163840	14 mm		YES	16		30	260	MULTIPLE	14 mm	6	CMOS		1 V				FLASH	.4 mm	FLOATING POINT	S-PQFP-G120	3			YES	YES
ADSP-21565KSWZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	GULL WING	120	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP120,.63SQ,16	.95 V	125 Cel		-40 Cel		DUAL	1.6 mm	163840	14 mm		YES	16		NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	14 mm	6	CMOS		1 V				FLASH	.4 mm	FLOATING POINT	S-PQFP-G120				YES	YES
ADSP-21566BBCZ4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	110 Cel		0 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16		30	260	MULTIPLE	17 mm	10	CMOS		1 V				FLASH	.8 mm	FLOATING POINT	S-PBGA-B400	3			YES	YES
ADSP-2185MBST-266	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.75 V			14	16	2.5,2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	2.25 V	85 Cel		-40 Cel	TIN LEAD OVER SILVER	QUAD	1.6 mm	16384	14 mm		NO	24	33 MHz			MULTIPLE	14 mm		CMOS		2.5 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100		Not Qualified		YES	YES	e0
ADSP-2186BST-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16		14	16	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	4.5 V	85 Cel	4	-40 Cel	TIN LEAD OVER SILVER	QUAD	1.6 mm	4096	14 mm		NO	24	16.67 MHz			MULTIPLE	14 mm	1	CMOS	100 mA	5 V	2	2	Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100		Not Qualified		YES	YES	e0
ADSP-2186NKST-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V			14	16	1.8,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	70 Cel		0 Cel	TIN LEAD	QUAD	1.6 mm	8192	14 mm		NO	24	40 MHz			MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e0

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.