Analog Devices Digital Signal Processors (DSPs) 1,436

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-21369KSWZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.35 V			24			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.25 V	70 Cel		0 Cel		QUAD	1.6 mm		28 mm		YES	32	25 MHz	30	260	MULTIPLE	28 mm		CMOS		1.3 V					.5 mm	FLOATING POINT	S-PQFP-G144	3			NO	YES
ADSP-21367KBP-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		225	MULTIPLE	27 mm		CMOS		1.2 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e0
ADSP-21990BCA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V			0	16	2.5,3.3	GRID ARRAY	BGA196,14X14,40	2.37 V	85 Cel		-40 Cel		BOTTOM	1.9 mm	4096	15 mm		YES	0	160 MHz			MULTIPLE	15 mm		CMOS		2.5 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B196		Not Qualified		YES	YES
ADSP-BF537KBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	40 MHz			MULTIPLE	12 mm		CMOS		1.26 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-2109KP-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	J BEND	68	QCCJ	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V			14	16	5	CHIP CARRIER	LDCC68,1.0SQ	3 V	70 Cel		0 Cel	TIN LEAD	QUAD	4.45 mm	256	24.18 mm		NO	24	20 MHz			MULTIPLE	24.18 mm		CMOS	31 mA	3.3 V			Digital Signal Processors		1.27 mm	FIXED POINT	R-PQCC-J68		Not Qualified		YES	YES	e0
ADSP-SC571KSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176	3			YES	YES	e3
ADSP-2186BSTZ-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16		14			FLATPACK, LOW PROFILE, FINE PITCH		4.5 V	85 Cel	4	-40 Cel	MATTE TIN	QUAD	1.6 mm	4096	14 mm		NO	24	16.67 MHz		260	MULTIPLE	14 mm	1	CMOS	100 mA	5 V	2	2			.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP21CSP01BS200	Analog Devices		INDUSTRIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY		YES					16	5	FLATPACK	QFP160,1.2SQ		85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	QUAD		8192											CMOS		5 V			Digital Signal Processors		.635 mm	FIXED POINT	S-PQFP-G160		Not Qualified				e0
ADSP-21368KBP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V			24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz			MULTIPLE	27 mm		CMOS		1.3 V					1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES	e0
ADSP-21569WCBCZ8RL	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel		-40 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16				MULTIPLE	17 mm	10	CMOS		1 V				FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADSP-BF544BBCZ-5X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			26	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.9 V	85 Cel		-40 Cel	MATTE TIN	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm		CMOS		1.25 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	1	Not Qualified	600 rpm	YES	YES	e3
ADSP-21532SBBC-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			19	16	2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	2.25 V					BOTTOM	1.4 mm	16384	12 mm		YES	16	33.33 MHz			MULTIPLE	12 mm		CMOS		2.5 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B160		Not Qualified		YES	YES
ADSP-2186KST-115	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16		14	16	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	4.5 V	70 Cel	4	0 Cel	Tin/Lead (Sn85Pb15) - with Silver (Ag) barrier	QUAD	1.6 mm	4096	14 mm		NO	24	14.4 MHz	30	240	MULTIPLE	14 mm	1	CMOS	100 mA	5 V	2	2	Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e0
ADSP-BF514KSWZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.47 V			19	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.164 V	70 Cel		0 Cel		QUAD	1.6 mm		24 mm		YES	16	300 MHz	30	260	MULTIPLE	24 mm		CMOS		1.225 V			Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	300 rpm	YES	YES
ADSP-21364KBCZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz	30	260	MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1
ADSP-21364KSQZ-1AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	20 mm		CMOS	500 mA	1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES	e3
ADSP-21365BBCZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1
ADSP-21364WBSWZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		-40 Cel	TIN	QUAD	1.6 mm		20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	20 mm		CMOS		1.2 V					.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES	e3
ADSPBF534SBBC1Z500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel		-40 Cel		BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182		Not Qualified	500 rpm	YES	YES
ADSP-BF533SKBC600X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			20			GRID ARRAY, LOW PROFILE, FINE PITCH		.8 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	1.7 mm		12 mm		YES	16	33.33 MHz			MULTIPLE	12 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified		YES	YES	e0
ADSP-21369KBP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V			24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz			MULTIPLE	27 mm		CMOS		1.3 V					1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES	e0
ADSP-2189NKST-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V			14	16	1.8,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	70 Cel		0 Cel	TIN LEAD	QUAD	1.6 mm	49152	14 mm		NO	24	40 MHz			MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e0
ADSP-BF525ABCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	100 MHz		260	MULTIPLE	12 mm		CMOS		1.8 V			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-21567BBCZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel		-40 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16		30	260	MULTIPLE	17 mm	10	CMOS		1 V				FLASH	.8 mm	FLOATING POINT	S-PBGA-B400	3			YES	YES
ADSP-BF534BBCZ-4B1	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel		-40 Cel		BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208		Not Qualified	400 rpm	YES	YES
ADSP-2185LBSTZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16		14			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	3 V	85 Cel	6	-40 Cel	MATTE TIN	QUAD	1.6 mm	8192	14 mm		NO	24			260	MULTIPLE	14 mm		CMOS		3.3 V				FLASH	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3	24
ADSP-BF514BSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.47 V			19	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.164 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES	16	400 MHz			MULTIPLE	24 mm		CMOS		1.4 V			Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	400 rpm	YES	YES	e3
ADSP-21362YSWZ-2AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.05 V			16	32	1,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	.95 V	105 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	33.33 MHz		260	MULTIPLE	20 mm		CMOS		1 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21365BSWZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	20 mm		CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-2189NKCAZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			14	16	1.8,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	1.71 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	49152	10 mm		NO	24	40 MHz		260	MULTIPLE	10 mm		CMOS		1.8 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e1
ADSP-21366KSQZ-1AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	20 mm		CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES	e3
ADSP-21992BBC	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES	2.625 V			20	16	2.5,3.3	GRID ARRAY	BGA196,14X14,40	2.375 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.85 mm	16384	15 mm		YES	16	150 MHz		240	MULTIPLE	15 mm		CMOS		2.5 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e0
ADSP-BF526KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz			MULTIPLE	12 mm		CMOS		1.8 V			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-21364SKBC-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V					.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e0
ADSP-21062KBZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	5.25 V			32	32	5	GRID ARRAY	BGA225,15X15,50	4.75 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.7 mm	2097152	23 mm		YES	48	40 MHz		260	MULTIPLE	23 mm		CMOS		5 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		YES	YES	e1
ADSP-21371KSWZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V			24	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.14 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	32768	28 mm		YES	32	16.67 MHz		260	MULTIPLE	28 mm		CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G208	3	Not Qualified		NO	YES	e3
ADSP-21362WSQZ-2AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.05 V			16	32	1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	.95 V	105 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16				MULTIPLE	20 mm		CMOS		1 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES	e3
ADSP-CM409FCBCZENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	212	LBGA	SQUARE	PLASTIC/EPOXY		YES	3.47 V			24			GRID ARRAY, LOW PROFILE		3.13 V	105 Cel		-40 Cel		BOTTOM	1.7 mm		19 mm		YES	15	60 MHz			SINGLE	19 mm		CMOS		3.3 V					1 mm	FLOATING POINT	S-PBGA-B212				YES	NO
ADSP-21062KSZ-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	1		32	32	5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	QFP240,1.3SQ,20	4.75 V	85 Cel	3	0 Cel	Matte Tin (Sn)	QUAD	4.1 mm	2M	32 mm	16/32 BIT PARALLEL HOST INTFC PORT; SINGLE CY INSTR EXECUTION; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED	YES	48	33.33 MHz	40	260	MULTIPLE	32 mm	1	CMOS	850 mA	5 V	10	2	Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240	3	Not Qualified		YES	YES	e3
ADSP-BF526BBCZ-3AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel		-40 Cel		BOTTOM	1.75 mm		17 mm	ALSO OPERATES AT 2.5 AND 3.3 V TYP	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208		Not Qualified	300 rpm	YES	YES
ADSP-21366KBCZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1
ADSP-CM408FBSWZENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	3.47 V			24	16	3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	3.13 V	105 Cel		-40 Cel		QUAD	1.6 mm	196608	24 mm		YES	15	60 MHz			SINGLE	24 mm		CMOS		3.3 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G176		Not Qualified		YES	NO
ADSP-2195MKCA-160X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V			22	16	2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	2.37 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.7 mm	16384	10 mm		YES	16	160 MHz			MULTIPLE	10 mm		CMOS		2.5 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144		Not Qualified		YES	YES	e0
ADSP-2101KP-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16		14	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	70 Cel	1	0 Cel	TIN LEAD	QUAD	4.45 mm	512	24.18 mm	20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	20 MHz			MULTIPLE	24.18 mm	1	CMOS	31 mA	5 V	0	2	Digital Signal Processors		1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified		YES	YES	e0
ADSP-2105BP-80REEL	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES	5.5 V			14			CHIP CARRIER		4.5 V	85 Cel		-40 Cel		QUAD	4.45 mm		24.18 mm		NO	24	20 MHz			MULTIPLE	24.18 mm		CMOS		5 V					1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified		YES	YES
ADSP-BF536BBC-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	400 MHz		240	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	400 rpm	YES	YES	e0
ADSP-21161N-KB-100X	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	OTHER	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			24			GRID ARRAY		1.71 V	85 Cel		0 Cel	TIN LEAD	BOTTOM	1.9 mm		17 mm		YES	48	50 MHz			MULTIPLE	17 mm		CMOS		1.8 V					1 mm	FLOATING POINT	S-PBGA-B225		Not Qualified		NO	YES	e0
ADSP-2172KST-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	128	QFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	16		14			FLATPACK		4.5 V	70 Cel	1	0 Cel	TIN LEAD	QUAD		1024		8/16 BIT PARALLEL HOST INTERFACE PORT	NO	24	16.67 MHz			MULTIPLE		1	CMOS	75 mA	5 V	0	2		MROM		FIXED POINT	R-PQFP-G128		Not Qualified		YES	YES	e0	24

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.