HBGA Microcontrollers 91

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
MPC5554MVR132	NXP Semiconductors	MICROCONTROLLER	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V		24	NO	32	1.5,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA416,26X26,40	1.35 V	125 Cel			-40 Cel	TIN SILVER COPPER	YES	BOTTOM	NO	2.55 mm	2097152	27 mm		IT ALSO REQUIRES 3.3V SUPPLY			32	20 MHz	40	260	27 mm	65536	CMOS		600 mA	1.5 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B416	3	Not Qualified	132 rpm		e1		220
MPC5554MZP132	NXP Semiconductors	MICROCONTROLLER	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V		24	NO	32	1.5,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA416,26X26,40	1.35 V	125 Cel			-40 Cel	TIN LEAD SILVER	YES	BOTTOM	NO	2.55 mm	2097152	27 mm		IT ALSO REQUIRES 3.3V SUPPLY			32	20 MHz	30	245	27 mm	65536	CMOS		600 mA	1.5 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B416	3	Not Qualified	132 rpm		e0		220
TC1796256F150EBEKDUMA2	Infineon Technologies	MICROCONTROLLER	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.58 V		24	NO	32		GRID ARRAY, HEAT SINK/SLUG		1.42 V	125 Cel			-40 Cel	TIN SILVER COPPER	YES	BOTTOM	YES	2.5 mm	2097152	27 mm	128K			DMA(16), TIMER(2)	32	40 MHz			27 mm	65536	CMOS	16 Ch 12-Bit(2), FADC 4 Ch 10-Bit		1.5 V	NO		ASC(2), CAN(4), ETHERNET, MLI(2), MSC(2), SSC(2)	FLASH	1 mm		S-PBGA-B416	3		150 rpm		e1	8	127
MPC5554MZP132R2	NXP Semiconductors	MICROCONTROLLER	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V		24	NO	32	1.5,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA416,26X26,40	1.35 V	125 Cel			-40 Cel	TIN LEAD SILVER	YES	BOTTOM	NO	2.55 mm	2097152	27 mm		IT ALSO REQUIRES 3.3V SUPPLY			32	20 MHz	30	245	27 mm	65536	CMOS		600 mA	1.5 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B416	3	Not Qualified	132 rpm		e0
MPC5554MZP80	NXP Semiconductors	MICROCONTROLLER	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V		24	NO	32	1.5,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA416,26X26,40	1.35 V	125 Cel			-40 Cel	TIN LEAD	YES	BOTTOM	NO	2.55 mm	2097152	27 mm		IT ALSO REQUIRES 3.3V SUPPLY			32	20 MHz	30	245	27 mm	65536	CMOS		600 mA	1.5 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B416	3	Not Qualified	80 rpm		e0		220
TC1797512F180EFACKXUMA1	Infineon Technologies	MICROCONTROLLER, RISC	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.58 V		32	NO	32		GRID ARRAY, HEAT SINK/SLUG		1.42 V	125 Cel			-40 Cel		YES	BOTTOM	YES	2.4 mm		27 mm					32	90 MHz	NOT SPECIFIED	NOT SPECIFIED	27 mm		CMOS			1.5 V	NO			FLASH	1 mm		S-PBGA-B416			180 rpm				221
MPC5554AZP132	NXP Semiconductors	MICROCONTROLLER	MILITARY	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V		24	NO	32	1.5,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA416,26X26,40	1.35 V	125 Cel			-55 Cel	TIN LEAD	YES	BOTTOM	NO	2.55 mm	2097152	27 mm		IT ALSO REQUIRES 3.3V SUPPLY			32	20 MHz	30	245	27 mm	65536	CMOS		600 mA	1.5 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B416	3	Not Qualified	132 rpm		e0		220
TC1796256F150EBEKXUMA2	Infineon Technologies	MICROCONTROLLER	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.58 V		24	NO	32		GRID ARRAY, HEAT SINK/SLUG		1.42 V	125 Cel			-40 Cel		YES	BOTTOM	YES	2.5 mm	2097152	27 mm	128K			DMA(16), TIMER(2)	32	40 MHz	30	260	27 mm	65536	CMOS	16 Ch 12-Bit(2), FADC 4 Ch 10-Bit		1.5 V	NO		ASC(2), CAN(4), ETHERNET, MLI(2), MSC(2), SSC(2)	FLASH	1 mm		S-PBGA-B416	3		150 rpm			8	127
MPC5554MZP80R2	NXP Semiconductors	MICROCONTROLLER	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V		24	NO	32	1.5,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA416,26X26,40	1.35 V	125 Cel			-40 Cel	TIN LEAD	YES	BOTTOM	NO	2.55 mm	2097152	27 mm		IT ALSO REQUIRES 3.3V SUPPLY			32	20 MHz	30	245	27 mm	65536	CMOS		600 mA	1.5 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B416	3	Not Qualified	80 rpm		e0
SPC5674FK0MVR3	NXP Semiconductors	MICROCONTROLLER, RISC	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	AEC-Q100	0	NO	32	1.2,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA416,26X26,40	1.14 V	125 Cel	E200		-40 Cel	TIN SILVER	YES	BOTTOM	YES	2.55 mm	4194304	27 mm					0	40 MHz	40	260	27 mm	262144	CMOS		850 mA	1.2 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B416	3	Not Qualified	264 rpm		e2
MPC5566MZP132R	NXP Semiconductors	MICROCONTROLLER	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V		24	NO			GRID ARRAY, HEAT SINK/SLUG		1.35 V	125 Cel			-40 Cel		YES	BOTTOM	YES	2.55 mm	3145728	27 mm	0	ADC 40-CH IS AVAILABLE		DMA, POR, PWM(24), TIMER, TPU(2)	32	20 MHz			27 mm	131072	CMOS			1.5 V	YES		CAN, ETHERNET, SCI, SPI	FLASH	1 mm		S-PBGA-B416			132 rpm			8
MPC5554MVR80	NXP Semiconductors	MICROCONTROLLER	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V		24	NO	32	1.5,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA416,26X26,40	1.35 V	125 Cel			-40 Cel	TIN SILVER COPPER	YES	BOTTOM	NO	2.55 mm	2097152	27 mm		IT ALSO REQUIRES 3.3V SUPPLY			32	20 MHz	40	260	27 mm	65536	CMOS			1.5 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B416	3	Not Qualified	80 rpm		e1		220
SPC5674FK0MVY3	NXP Semiconductors	MICROCONTROLLER, RISC	AUTOMOTIVE	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	AEC-Q100	32	NO	32	1.2,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.14 V	125 Cel	E200		-40 Cel	TIN SILVER	YES	BOTTOM	YES	2.55 mm	4194304	27 mm					32	40 MHz	40	260	27 mm	262144	CMOS		850 mA	1.2 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B516	3	Not Qualified	264 rpm		e2
SPC5674FK0MVY3R	NXP Semiconductors	MICROCONTROLLER, RISC	AUTOMOTIVE	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	AEC-Q100	32	NO	32	1.2,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.14 V	125 Cel	E200		-40 Cel	TIN SILVER	YES	BOTTOM	YES	2.55 mm	4194304	27 mm					32	40 MHz	40	260	27 mm	262144	CMOS		850 mA	1.2 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B516	3	Not Qualified	264 rpm		e2
STLS2F02	STMicroelectronics	MICROCONTROLLER	INDUSTRIAL	BALL	452	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		15		64		GRID ARRAY	BGA452,26X26,40	1.2 V	85 Cel		4	-40 Cel			BOTTOM		3.15 mm		27 mm			YES		64				27 mm		CMOS			1.26 V					1 mm	FLOATING POINT	S-PBGA-B452		Not Qualified	900 rpm	YES
935324463518	NXP Semiconductors	MICROCONTROLLER, RISC		BALL	416	HBGA	SQUARE			YES	1.32 V		0		32		GRID ARRAY, HEAT SINK/SLUG		1.14 V					TIN SILVER	YES	BOTTOM	YES			27 mm					0	40 MHz	40	260	27 mm					1.2 V	YES				1 mm			3		264 rpm		e2
935311206557	NXP Semiconductors	MICROCONTROLLER, RISC		BALL	516	HBGA	SQUARE			YES	1.32 V		0		32		GRID ARRAY, HEAT SINK/SLUG		1.14 V					TIN SILVER	YES	BOTTOM	YES			27 mm					0	40 MHz	40	260	27 mm					1.2 V	YES				1 mm			3		200 rpm		e2
935324223557	NXP Semiconductors	MICROCONTROLLER		BALL	416	HBGA	SQUARE			YES	1.65 V		24		32		GRID ARRAY, HEAT SINK/SLUG		1.35 V					TIN SILVER COPPER	YES	BOTTOM	YES			27 mm					32	20 MHz	40	260	27 mm					1.5 V	YES				1 mm			3		132 rpm		e1		256
935309958557	NXP Semiconductors	MICROCONTROLLER		BALL	416	HBGA	SQUARE			YES	1.65 V		24		32		GRID ARRAY, HEAT SINK/SLUG		1.35 V					NICKEL GOLD	YES	BOTTOM	YES			27 mm					32	20 MHz	40	260	27 mm					1.5 V	YES				1 mm			3		144 rpm		e4		256
935311244557	NXP Semiconductors	MICROCONTROLLER, RISC		BALL	416	HBGA	SQUARE			YES	1.32 V		0		32		GRID ARRAY, HEAT SINK/SLUG		1.14 V					TIN SILVER	YES	BOTTOM	YES			27 mm					0	40 MHz	40	260	27 mm					1.2 V	YES				1 mm			3		200 rpm		e2
935309961557	NXP Semiconductors	MICROCONTROLLER, RISC		BALL	416	HBGA	SQUARE			YES	1.65 V		24		32		GRID ARRAY, HEAT SINK/SLUG		1.35 V						YES	BOTTOM	NO			27 mm					32	20 MHz			27 mm					1.5 V	YES				1 mm					132 rpm
935311244518	NXP Semiconductors	MICROCONTROLLER, RISC		BALL	416	HBGA	SQUARE			YES	1.32 V		0		32		GRID ARRAY, HEAT SINK/SLUG		1.14 V					TIN SILVER	YES	BOTTOM	YES			27 mm					0	40 MHz	40	260	27 mm					1.2 V	YES				1 mm			3		200 rpm		e2
935319429518	NXP Semiconductors	MICROCONTROLLER		BALL	416	HBGA	SQUARE			YES	1.65 V		24		32		GRID ARRAY, HEAT SINK/SLUG		1.35 V					TIN SILVER COPPER	YES	BOTTOM	YES			27 mm					32	20 MHz	40	260	27 mm					1.5 V	YES				1 mm			3		132 rpm		e1		256
SPC5673FK0MVV2	NXP Semiconductors	MICROCONTROLLER, RISC	AUTOMOTIVE	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	AEC-Q100	32	NO	32	1.2,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.14 V	125 Cel	E200		-40 Cel	TIN LEAD	YES	BOTTOM	YES	2.55 mm	4194304	27 mm					32	40 MHz	30	245	27 mm	262144	CMOS			1.2 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B516	3	Not Qualified	200 rpm		e0
935314555518	NXP Semiconductors	MICROCONTROLLER, RISC		BALL	516	HBGA	SQUARE			YES	1.32 V		0		32		GRID ARRAY, HEAT SINK/SLUG		1.14 V					TIN SILVER	YES	BOTTOM	YES			27 mm					0	40 MHz	40	260	27 mm					1.2 V	YES				1 mm			3		264 rpm		e2
SPC5673FK0MVV2R	NXP Semiconductors	MICROCONTROLLER, RISC	AUTOMOTIVE	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	AEC-Q100	32	NO	32	1.2,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.14 V	125 Cel	E200		-40 Cel	TIN LEAD	YES	BOTTOM	YES	2.55 mm	4194304	27 mm					32	40 MHz	30	245	27 mm	262144	CMOS			1.2 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B516	3	Not Qualified	200 rpm		e0
935313983557	NXP Semiconductors	MICROCONTROLLER		BALL	416	HBGA	SQUARE			YES	1.65 V		24		32		GRID ARRAY, HEAT SINK/SLUG		1.35 V					NICKEL GOLD	YES	BOTTOM	YES			27 mm					32	20 MHz	40	260	27 mm					1.5 V	YES				1 mm			3		132 rpm		e4		256
935310677518	NXP Semiconductors	MICROCONTROLLER, RISC		BALL	516	HBGA	SQUARE			YES	1.32 V		0		32		GRID ARRAY, HEAT SINK/SLUG		1.14 V						YES	BOTTOM	YES			27 mm					0	40 MHz			27 mm					1.2 V	YES				1 mm					264 rpm
935316969557	NXP Semiconductors	MICROCONTROLLER		BALL	416	HBGA	SQUARE			YES	1.65 V		24		32		GRID ARRAY, HEAT SINK/SLUG		1.35 V						YES	BOTTOM	YES			27 mm					32	20 MHz			27 mm					1.5 V	YES				1 mm					80 rpm				256
935321622518	NXP Semiconductors	MICROCONTROLLER, RISC		BALL	516	HBGA	SQUARE			YES	1.32 V		0		32		GRID ARRAY, HEAT SINK/SLUG		1.14 V					NICKEL GOLD	YES	BOTTOM	YES			27 mm					0	40 MHz	30	245	27 mm					1.2 V	YES				1 mm			3		200 rpm		e4
935325464557	NXP Semiconductors	MICROCONTROLLER		BALL	416	HBGA	SQUARE			YES	1.65 V		24		32		GRID ARRAY, HEAT SINK/SLUG		1.35 V						YES	BOTTOM	YES			27 mm					32	20 MHz			27 mm					1.5 V	YES				1 mm					144 rpm				256
935313983518	NXP Semiconductors	MICROCONTROLLER		BALL	416	HBGA	SQUARE			YES	1.65 V		24		32		GRID ARRAY, HEAT SINK/SLUG		1.35 V						YES	BOTTOM	YES			27 mm					32	20 MHz			27 mm					1.5 V	YES				1 mm					132 rpm				256
SPC5566MVR144	NXP Semiconductors	MICROCONTROLLER, RISC	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V	AEC-Q100	24	NO	32	1.5,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA416,26X26,40	1.35 V	125 Cel	E200		-40 Cel	TIN SILVER COPPER	YES	BOTTOM	YES	2.55 mm	3145728	27 mm					32	20 MHz	40	260	27 mm	131072	CMOS		820 mA	1.5 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B416	3	Not Qualified	144 rpm		e1		256
SPC5674FAMVR3	NXP Semiconductors	MICROCONTROLLER, RISC	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		0	NO	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	125 Cel			-40 Cel	TIN SILVER	YES	BOTTOM	YES	2.55 mm	4194304	27 mm	0			DMA(96), POR, PWM(32), TIMER(64)	0	40 MHz	40	260	27 mm	262144	CMOS	64-Ch 12-Bit		1.2 V	YES		CAN(4), SCI(3), SPI(4)	FLASH	1 mm		S-PBGA-B416	3		264 rpm		e2	8
SPC5673FK0MVR2	NXP Semiconductors	MICROCONTROLLER, RISC	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	AEC-Q100	0	NO	32	1.2,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA416,26X26,40	1.14 V	125 Cel	E200		-40 Cel	TIN SILVER	YES	BOTTOM	YES	2.55 mm	4194304	27 mm					0	40 MHz	40	260	27 mm	262144	CMOS			1.2 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B416	3	Not Qualified	200 rpm		e2
SPC5674FAMVR3R	NXP Semiconductors	MICROCONTROLLER, RISC	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		0	NO	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	125 Cel			-40 Cel	TIN SILVER	YES	BOTTOM	YES	2.55 mm	4194304	27 mm	0			DMA(96), POR, PWM(32), TIMER(64)	0	40 MHz	40	260	27 mm	262144	CMOS	64-Ch 12-Bit		1.2 V	YES		CAN(4), SCI(3), SPI(4)	FLASH	1 mm		S-PBGA-B416	3		264 rpm		e2	8
935316969518	NXP Semiconductors	MICROCONTROLLER		BALL	416	HBGA	SQUARE			YES	1.65 V		24		32		GRID ARRAY, HEAT SINK/SLUG		1.35 V						YES	BOTTOM	YES			27 mm					32	20 MHz			27 mm					1.5 V	YES				1 mm					80 rpm				256
935318943518	NXP Semiconductors	MICROCONTROLLER, RISC		BALL	416	HBGA	SQUARE			YES	1.65 V		24		32		GRID ARRAY, HEAT SINK/SLUG		1.35 V					NICKEL GOLD	YES	BOTTOM	NO			27 mm					32	20 MHz	30	245	27 mm					1.5 V	YES				1 mm			3		132 rpm		e4
SPC5673FK0MVR2R	NXP Semiconductors	MICROCONTROLLER, RISC	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	AEC-Q100	0	NO	32	1.2,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA416,26X26,40	1.14 V	125 Cel	E200		-40 Cel	TIN SILVER	YES	BOTTOM	YES	2.55 mm	4194304	27 mm					0	40 MHz	40	260	27 mm	262144	CMOS			1.2 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B416	3	Not Qualified	200 rpm		e2
SPC5674FK0MVV3R	NXP Semiconductors	MICROCONTROLLER, RISC	AUTOMOTIVE	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	AEC-Q100	32	NO	32	1.2,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.14 V	125 Cel	E200		-40 Cel	TIN LEAD	YES	BOTTOM	YES	2.55 mm	4194304	27 mm					32	40 MHz	30	245	27 mm	262144	CMOS		850 mA	1.2 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B516	3	Not Qualified	264 rpm		e0
SPC5566MZP144	NXP Semiconductors	MICROCONTROLLER	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V	AEC-Q100	24	NO	32	1.5,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA416,26X26,40	1.35 V	125 Cel	E200		-40 Cel	NICKEL GOLD	YES	BOTTOM	YES	2.55 mm	3145728	27 mm					32	20 MHz	40	260	27 mm	131072	CMOS		820 mA	1.5 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B416	3	Not Qualified	144 rpm		e4		256
935317056518	NXP Semiconductors	MICROCONTROLLER		BALL	416	HBGA	SQUARE			YES	1.65 V		24		32		GRID ARRAY, HEAT SINK/SLUG		1.35 V						YES	BOTTOM	YES			27 mm					32	20 MHz			27 mm					1.5 V	YES				1 mm					112 rpm				256
SPC5554MVR132	NXP Semiconductors	MICROCONTROLLER	AUTOMOTIVE	BALL	416	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V	AEC-Q100	24	NO	32	1.5,3.3,5	GRID ARRAY, HEAT SINK/SLUG	BGA416,26X26,40	1.35 V	125 Cel			-40 Cel	TIN SILVER COPPER	YES	BOTTOM	YES	2.55 mm	2097152	27 mm		ALSO OPERATES AT 3.3 V			32	20 MHz	40	260	27 mm	65536	CMOS		875 mA	1.5 V	YES	Microcontrollers		FLASH	1 mm		S-PBGA-B416	3	Not Qualified	132 rpm		e1		256
935309958518	NXP Semiconductors	MICROCONTROLLER		BALL	416	HBGA	SQUARE			YES	1.65 V		24		32		GRID ARRAY, HEAT SINK/SLUG		1.35 V						YES	BOTTOM	YES			27 mm					32	20 MHz			27 mm					1.5 V	YES				1 mm					144 rpm				256
935323239557	NXP Semiconductors	MICROCONTROLLER, RISC		BALL	416	HBGA	SQUARE			YES	1.32 V		0		32		GRID ARRAY, HEAT SINK/SLUG		1.14 V					TIN SILVER	YES	BOTTOM	YES			27 mm					0	40 MHz	40	260	27 mm					1.2 V	YES				1 mm			3		264 rpm		e2
935319453557	NXP Semiconductors	MICROCONTROLLER		BALL	416	HBGA	SQUARE			YES	1.65 V		24		32		GRID ARRAY, HEAT SINK/SLUG		1.35 V					TIN SILVER COPPER	YES	BOTTOM	YES			27 mm					32	20 MHz	40	260	27 mm					1.5 V	YES				1 mm			3		144 rpm		e1		256
SPC5674FAMVY3R	NXP Semiconductors	MICROCONTROLLER, RISC	AUTOMOTIVE	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V		0	NO	32		GRID ARRAY, HEAT SINK/SLUG		4.5 V	125 Cel			-40 Cel	TIN SILVER	YES	BOTTOM	YES	2.55 mm		27 mm		MS-034AAL-1			0		40	260	27 mm		CMOS			5 V	NO			FLASH	1 mm		S-PBGA-B516	3		270 rpm		e2
935319429557	NXP Semiconductors	MICROCONTROLLER		BALL	416	HBGA	SQUARE			YES	1.65 V		24		32		GRID ARRAY, HEAT SINK/SLUG		1.35 V					TIN SILVER COPPER	YES	BOTTOM	YES			27 mm					32	20 MHz	40	260	27 mm					1.5 V	YES				1 mm			3		132 rpm		e1		256

Microcontrollers

A microcontroller is a type of integrated circuit (IC) that is designed to control a specific task or set of tasks within a larger system. Unlike a microprocessor, which is designed to be a general-purpose computing device, a microcontroller is optimized for embedded applications that require real-time control and processing.

Microcontrollers typically contain a processor core, memory, input/output (I/O) ports, and various peripheral devices, all on a single chip. The processor core is usually a low-power, low-speed version of a microprocessor, such as an 8-bit or 16-bit processor. The memory on a microcontroller includes both volatile and non-volatile memory, such as random-access memory (RAM) and flash memory, respectively. The I/O ports are used to interface with external devices such as sensors, switches, and displays.

Microcontrollers are used in a wide range of applications, including automotive systems, medical devices, consumer electronics, and industrial automation. They are particularly well-suited for applications that require real-time control and processing, such as motor control, temperature sensing, and data acquisition.

One of the key advantages of microcontrollers is their low cost and small size. Because all of the necessary components are integrated onto a single chip, microcontrollers are much smaller and less expensive than other types of computing devices. This makes them ideal for use in small, battery-powered devices such as handheld calculators and remote controls.