Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
MICROCONTROLLER |
BALL |
416 |
HBGA |
SQUARE |
YES |
1.65 V |
24 |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.35 V |
YES |
BOTTOM |
YES |
27 mm |
32 |
20 MHz |
27 mm |
1.5 V |
YES |
1 mm |
132 rpm |
256 |
||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
516 |
HBGA |
SQUARE |
YES |
1.32 V |
0 |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.14 V |
YES |
BOTTOM |
YES |
27 mm |
0 |
40 MHz |
27 mm |
1.2 V |
YES |
1 mm |
264 rpm |
|||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
AEC-Q100 |
32 |
NO |
32 |
1.2,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA516,26X26,40 |
1.14 V |
125 Cel |
E200 |
-40 Cel |
NICKEL GOLD |
YES |
BOTTOM |
YES |
2.55 mm |
4194304 |
27 mm |
32 |
40 MHz |
30 |
245 |
27 mm |
262144 |
CMOS |
850 mA |
1.2 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B516 |
3 |
Not Qualified |
264 rpm |
e4 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
516 |
HBGA |
SQUARE |
YES |
1.32 V |
0 |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.14 V |
TIN SILVER |
YES |
BOTTOM |
YES |
27 mm |
0 |
40 MHz |
40 |
260 |
27 mm |
1.2 V |
YES |
1 mm |
3 |
264 rpm |
e2 |
|||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
416 |
HBGA |
SQUARE |
YES |
1.32 V |
0 |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.14 V |
TIN SILVER |
YES |
BOTTOM |
YES |
27 mm |
0 |
40 MHz |
40 |
260 |
27 mm |
1.2 V |
YES |
1 mm |
3 |
264 rpm |
e2 |
|||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.47 V |
0 |
NO |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.33 V |
125 Cel |
-40 Cel |
NO |
BOTTOM |
YES |
2.55 mm |
23 mm |
0 |
35 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
23 mm |
CMOS |
1.4 V |
NO |
FLASH |
1 mm |
S-PBGA-B324 |
400 rpm |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.47 V |
0 |
NO |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.33 V |
125 Cel |
-40 Cel |
NO |
BOTTOM |
YES |
2.55 mm |
23 mm |
0 |
35 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
23 mm |
CMOS |
1.4 V |
NO |
FLASH |
1 mm |
S-PBGA-B324 |
400 rpm |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
0 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,22X22,40 |
1.35 V |
125 Cel |
-40 Cel |
MATTE TIN |
YES |
BOTTOM |
NO |
2.55 mm |
1048576 |
23 mm |
0 |
20 MHz |
23 mm |
65536 |
CMOS |
250 mA |
1.5 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B324 |
1 |
Not Qualified |
80 rpm |
e3 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
24 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA416,26X26,40 |
1.35 V |
125 Cel |
-40 Cel |
TIN LEAD SILVER |
YES |
BOTTOM |
YES |
2.55 mm |
3145728 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
32 |
20 MHz |
27 mm |
131072 |
CMOS |
820 mA |
1.5 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B416 |
3 |
Not Qualified |
144 rpm |
e0 |
256 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
0 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY |
BGA324,22X22,40 |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
NO |
2.55 mm |
196608 |
23 mm |
0 |
80 MHz |
23 mm |
49152 |
CMOS |
250 mA |
1.5 V |
NO |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B324 |
Not Qualified |
80 rpm |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
0 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,22X22,40 |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
NO |
2.55 mm |
196608 |
23 mm |
0 |
40 MHz |
23 mm |
49152 |
CMOS |
250 mA |
1.5 V |
NO |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B324 |
Not Qualified |
40 rpm |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
28 |
NO |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.71 V |
85 Cel |
-40 Cel |
NO |
BOTTOM |
YES |
1.95 mm |
17 mm |
IT ALSO OPERATES AT 200MHZ SPEED WITH 0 TO 70DEGCEN TEMPERATURE RANGE |
32 |
20 MHz |
17 mm |
CMOS |
1.8 V |
YES |
FLASH |
1 mm |
S-PBGA-B256 |
195 rpm |
60 |
||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
24 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA416,26X26,40 |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
2.55 mm |
3145728 |
27 mm |
0 |
ADC 40-CH IS AVAILABLE |
DMA, POR, PWM(24), TIMER, TPU(2) |
32 |
20 MHz |
27 mm |
131072 |
CMOS |
820 mA |
1.5 V |
YES |
Microcontrollers |
CAN, ETHERNET, SCI, SPI |
FLASH |
1 mm |
S-PBGA-B416 |
Not Qualified |
112 rpm |
8 |
256 |
|||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
0 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,22X22,40 |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
NO |
2.55 mm |
196608 |
23 mm |
0 |
80 MHz |
23 mm |
49152 |
CMOS |
250 mA |
1.5 V |
NO |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B324 |
Not Qualified |
80 rpm |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
24 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA416,26X26,40 |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
2.55 mm |
3145728 |
27 mm |
0 |
ADC 40-CH IS AVAILABLE |
DMA, POR, PWM(24), TIMER, TPU(2) |
32 |
20 MHz |
27 mm |
131072 |
CMOS |
820 mA |
1.5 V |
YES |
Microcontrollers |
CAN, ETHERNET, SCI, SPI |
FLASH |
1 mm |
S-PBGA-B416 |
Not Qualified |
144 rpm |
8 |
256 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
MILITARY |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
24 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA416,26X26,40 |
1.35 V |
125 Cel |
-55 Cel |
YES |
BOTTOM |
NO |
2.55 mm |
2097152 |
27 mm |
IT ALSO REQUIRES 3.3V SUPPLY |
32 |
20 MHz |
27 mm |
65536 |
CMOS |
1.5 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B416 |
Not Qualified |
132 rpm |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
NO |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.14 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
2.55 mm |
27 mm |
0 |
40 MHz |
27 mm |
CMOS |
1.2 V |
YES |
FLASH |
1 mm |
S-PBGA-B516 |
270 rpm |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
24 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA416,26X26,40 |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
2.55 mm |
3145728 |
27 mm |
0 |
ADC 40-CH IS AVAILABLE |
DMA, POR, PWM(24), TIMER, TPU(2) |
32 |
20 MHz |
27 mm |
131072 |
CMOS |
820 mA |
1.5 V |
YES |
Microcontrollers |
CAN, ETHERNET, SCI, SPI |
FLASH |
1 mm |
S-PBGA-B416 |
Not Qualified |
80 rpm |
8 |
256 |
||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
24 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA416,26X26,40 |
1.35 V |
125 Cel |
-40 Cel |
TIN LEAD |
YES |
BOTTOM |
NO |
2.55 mm |
2097152 |
27 mm |
IT ALSO REQUIRES 3.3V SUPPLY |
32 |
20 MHz |
30 |
245 |
27 mm |
65536 |
CMOS |
600 mA |
1.5 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B416 |
3 |
Not Qualified |
112 rpm |
e0 |
|||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
24 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA416,26X26,40 |
1.35 V |
125 Cel |
-40 Cel |
TIN LEAD |
YES |
BOTTOM |
NO |
2.55 mm |
2097152 |
27 mm |
IT ALSO REQUIRES 3.3V SUPPLY |
32 |
20 MHz |
30 |
245 |
27 mm |
65536 |
CMOS |
600 mA |
1.5 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B416 |
3 |
Not Qualified |
112 rpm |
e0 |
220 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
0 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,22X22,40 |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
NO |
2.55 mm |
196608 |
23 mm |
0 |
40 MHz |
23 mm |
49152 |
CMOS |
250 mA |
1.5 V |
NO |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B324 |
Not Qualified |
40 rpm |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
0 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,22X22,40 |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
NO |
2.55 mm |
196608 |
23 mm |
0 |
66 MHz |
23 mm |
49152 |
CMOS |
250 mA |
1.5 V |
NO |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B324 |
Not Qualified |
66 rpm |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
NO |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.14 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
2.55 mm |
23 mm |
0 |
40 MHz |
23 mm |
CMOS |
1.2 V |
YES |
FLASH |
1 mm |
S-PBGA-B324 |
200 rpm |
||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
NO |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.14 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
2.55 mm |
27 mm |
0 |
40 MHz |
27 mm |
CMOS |
1.2 V |
YES |
FLASH |
1 mm |
S-PBGA-B416 |
270 rpm |
||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
NO |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.14 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
2.55 mm |
27 mm |
0 |
40 MHz |
27 mm |
CMOS |
1.2 V |
YES |
FLASH |
1 mm |
S-PBGA-B516 |
270 rpm |
||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
NO |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.14 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
2.55 mm |
27 mm |
0 |
40 MHz |
27 mm |
CMOS |
1.2 V |
YES |
FLASH |
1 mm |
S-PBGA-B516 |
200 rpm |
||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
0 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,22X22,40 |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
NO |
2.55 mm |
196608 |
23 mm |
0 |
66 MHz |
23 mm |
49152 |
CMOS |
250 mA |
1.5 V |
NO |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B324 |
Not Qualified |
66 rpm |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
0 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY |
BGA324,22X22,40 |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
NO |
2.55 mm |
196608 |
23 mm |
0 |
40 MHz |
23 mm |
49152 |
CMOS |
250 mA |
1.5 V |
NO |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B324 |
Not Qualified |
40 rpm |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
NO |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.14 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
2.55 mm |
27 mm |
0 |
40 MHz |
27 mm |
CMOS |
1.2 V |
YES |
FLASH |
1 mm |
S-PBGA-B416 |
200 rpm |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
0 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,22X22,40 |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
NO |
2.55 mm |
196608 |
23 mm |
0 |
80 MHz |
23 mm |
49152 |
CMOS |
250 mA |
1.5 V |
NO |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B324 |
Not Qualified |
80 rpm |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER |
MILITARY |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
24 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA416,26X26,40 |
1.35 V |
125 Cel |
-55 Cel |
TIN LEAD SILVER |
YES |
BOTTOM |
NO |
2.55 mm |
2097152 |
27 mm |
IT ALSO REQUIRES 3.3V SUPPLY |
32 |
20 MHz |
27 mm |
65536 |
CMOS |
1.5 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B416 |
3 |
Not Qualified |
132 rpm |
e0 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
24 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA416,26X26,40 |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
2.55 mm |
3145728 |
27 mm |
0 |
ADC 40-CH IS AVAILABLE |
DMA, POR, PWM(24), TIMER, TPU(2) |
32 |
20 MHz |
27 mm |
131072 |
CMOS |
820 mA |
1.5 V |
YES |
Microcontrollers |
CAN, ETHERNET, SCI, SPI |
FLASH |
1 mm |
S-PBGA-B416 |
Not Qualified |
80 rpm |
8 |
256 |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
MILITARY |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
24 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA416,26X26,40 |
1.35 V |
125 Cel |
-55 Cel |
YES |
BOTTOM |
NO |
2.55 mm |
2097152 |
27 mm |
IT ALSO REQUIRES 3.3V SUPPLY |
32 |
20 MHz |
27 mm |
65536 |
CMOS |
1.5 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B416 |
Not Qualified |
132 rpm |
220 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
24 |
NO |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
2.55 mm |
3145728 |
27 mm |
0 |
ADC 40-CH IS AVAILABLE |
DMA, POR, PWM(24), TIMER, TPU(2) |
32 |
20 MHz |
27 mm |
131072 |
CMOS |
1.5 V |
YES |
CAN, ETHERNET, SCI, SPI |
FLASH |
1 mm |
S-PBGA-B416 |
144 rpm |
8 |
256 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
24 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA416,26X26,40 |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
NO |
2.55 mm |
2097152 |
27 mm |
IT ALSO REQUIRES 3.3V SUPPLY |
32 |
20 MHz |
27 mm |
65536 |
CMOS |
1.5 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B416 |
Not Qualified |
112 rpm |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
24 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA416,26X26,40 |
1.35 V |
125 Cel |
-40 Cel |
MATTE TIN |
YES |
BOTTOM |
YES |
2.55 mm |
3145728 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
32 |
20 MHz |
27 mm |
131072 |
CMOS |
820 mA |
1.5 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B416 |
1 |
Not Qualified |
132 rpm |
e3 |
256 |
|||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
NO |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.14 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
2.55 mm |
23 mm |
0 |
40 MHz |
23 mm |
CMOS |
1.2 V |
YES |
FLASH |
1 mm |
S-PBGA-B324 |
270 rpm |
||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
NO |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.14 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
2.55 mm |
27 mm |
0 |
40 MHz |
27 mm |
CMOS |
1.2 V |
YES |
FLASH |
1 mm |
S-PBGA-B516 |
200 rpm |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
0 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY |
BGA324,22X22,40 |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
NO |
2.55 mm |
196608 |
23 mm |
0 |
66 MHz |
23 mm |
49152 |
CMOS |
250 mA |
1.5 V |
NO |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B324 |
Not Qualified |
66 rpm |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
24 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA416,26X26,40 |
1.35 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
NO |
2.55 mm |
2097152 |
27 mm |
IT ALSO REQUIRES 3.3V SUPPLY |
32 |
20 MHz |
27 mm |
65536 |
CMOS |
1.5 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B416 |
Not Qualified |
112 rpm |
220 |
|||||||||||||||||||||||||||||||
Infineon Technologies |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
320 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
28 |
NO |
32 |
3.3/5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA320,20X20,50 |
3 V |
125 Cel |
FR60 |
-40 Cel |
YES |
BOTTOM |
YES |
2.46 mm |
2162688 |
27 mm |
0 |
IT ALSO NEED 1.8V NOMINAL SUPPLY VOLTAGE |
ALARM COMPARATOR(2), DMA(5), RTC, TIMER(33), WDT(2) |
32 |
16 MHz |
27 mm |
98304 |
CMOS |
32-Ch 10-Bit |
170 mA |
5 V |
NO |
Microcontrollers |
CAN(6), I2C(4), USART(8) |
FLASH |
1.27 mm |
S-PBGA-B320 |
Not Qualified |
100 rpm |
8 |
205 |
|||||||||||||||||||||||||
|
Infineon Technologies |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
320 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
28 |
NO |
32 |
3.3/5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA320,20X20,50 |
3 V |
125 Cel |
FR60 |
-40 Cel |
YES |
BOTTOM |
YES |
2.46 mm |
2162688 |
27 mm |
0 |
IT ALSO NEED 1.8V NOMINAL SUPPLY VOLTAGE |
ALARM COMPARATOR(2), DMA(5), RTC, TIMER(33), WDT(2) |
32 |
16 MHz |
27 mm |
98304 |
CMOS |
32-Ch 10-Bit |
170 mA |
5 V |
NO |
Microcontrollers |
CAN(6), I2C(4), USART(8) |
FLASH |
1.27 mm |
S-PBGA-B320 |
Not Qualified |
100 rpm |
8 |
205 |
||||||||||||||||||||||||
Infineon Technologies |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
416 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.58 V |
24 |
NO |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.42 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
2.5 mm |
27 mm |
32 |
25 MHz |
27 mm |
CMOS |
1.5 V |
NO |
FLASH |
1 mm |
S-PBGA-B416 |
150 rpm |
127 |
A microcontroller is a type of integrated circuit (IC) that is designed to control a specific task or set of tasks within a larger system. Unlike a microprocessor, which is designed to be a general-purpose computing device, a microcontroller is optimized for embedded applications that require real-time control and processing.
Microcontrollers typically contain a processor core, memory, input/output (I/O) ports, and various peripheral devices, all on a single chip. The processor core is usually a low-power, low-speed version of a microprocessor, such as an 8-bit or 16-bit processor. The memory on a microcontroller includes both volatile and non-volatile memory, such as random-access memory (RAM) and flash memory, respectively. The I/O ports are used to interface with external devices such as sensors, switches, and displays.
Microcontrollers are used in a wide range of applications, including automotive systems, medical devices, consumer electronics, and industrial automation. They are particularly well-suited for applications that require real-time control and processing, such as motor control, temperature sensing, and data acquisition.
One of the key advantages of microcontrollers is their low cost and small size. Because all of the necessary components are integrated onto a single chip, microcontrollers are much smaller and less expensive than other types of computing devices. This makes them ideal for use in small, battery-powered devices such as handheld calculators and remote controls.