HBGA Microcontrollers 91

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

935325435557

NXP Semiconductors

MICROCONTROLLER

BALL

416

HBGA

SQUARE

YES

1.65 V

24

32

GRID ARRAY, HEAT SINK/SLUG

1.35 V

YES

BOTTOM

YES

27 mm

32

20 MHz

27 mm

1.5 V

YES

1 mm

132 rpm

256

935310677557

NXP Semiconductors

MICROCONTROLLER, RISC

BALL

516

HBGA

SQUARE

YES

1.32 V

0

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

YES

BOTTOM

YES

27 mm

0

40 MHz

27 mm

1.2 V

YES

1 mm

264 rpm

SPC5674FK0MVV3

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

516

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

AEC-Q100

32

NO

32

1.2,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA516,26X26,40

1.14 V

125 Cel

E200

-40 Cel

NICKEL GOLD

YES

BOTTOM

YES

2.55 mm

4194304

27 mm

32

40 MHz

30

245

27 mm

262144

CMOS

850 mA

1.2 V

YES

Microcontrollers

FLASH

1 mm

S-PBGA-B516

3

Not Qualified

264 rpm

e4

935314555557

NXP Semiconductors

MICROCONTROLLER, RISC

BALL

516

HBGA

SQUARE

YES

1.32 V

0

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN SILVER

YES

BOTTOM

YES

27 mm

0

40 MHz

40

260

27 mm

1.2 V

YES

1 mm

3

264 rpm

e2

935324463557

NXP Semiconductors

MICROCONTROLLER, RISC

BALL

416

HBGA

SQUARE

YES

1.32 V

0

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN SILVER

YES

BOTTOM

YES

27 mm

0

40 MHz

40

260

27 mm

1.2 V

YES

1 mm

3

264 rpm

e2

PPC5125YVN400

NXP Semiconductors

MICROCONTROLLER

AUTOMOTIVE

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.47 V

0

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.33 V

125 Cel

-40 Cel

NO

BOTTOM

YES

2.55 mm

23 mm

0

35 MHz

NOT SPECIFIED

NOT SPECIFIED

23 mm

CMOS

1.4 V

NO

FLASH

1 mm

S-PBGA-B324

400 rpm

PPC5125YVN400R

NXP Semiconductors

MICROCONTROLLER

AUTOMOTIVE

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.47 V

0

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.33 V

125 Cel

-40 Cel

NO

BOTTOM

YES

2.55 mm

23 mm

0

35 MHz

NOT SPECIFIED

NOT SPECIFIED

23 mm

CMOS

1.4 V

NO

FLASH

1 mm

S-PBGA-B324

400 rpm

MPC5534MVZ80R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

0

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA324,22X22,40

1.35 V

125 Cel

-40 Cel

MATTE TIN

YES

BOTTOM

NO

2.55 mm

1048576

23 mm

0

20 MHz

23 mm

65536

CMOS

250 mA

1.5 V

YES

Microcontrollers

FLASH

1 mm

S-PBGA-B324

1

Not Qualified

80 rpm

e3

MPC5566MZP144R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

24

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA416,26X26,40

1.35 V

125 Cel

-40 Cel

TIN LEAD SILVER

YES

BOTTOM

YES

2.55 mm

3145728

27 mm

ALSO REQUIRES 3.3V SUPPLY

32

20 MHz

27 mm

131072

CMOS

820 mA

1.5 V

YES

Microcontrollers

FLASH

1 mm

S-PBGA-B416

3

Not Qualified

144 rpm

e0

256

MPC5533MVZ80

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

0

NO

32

1.5,3.3,5

GRID ARRAY

BGA324,22X22,40

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

NO

2.55 mm

196608

23 mm

0

80 MHz

23 mm

49152

CMOS

250 mA

1.5 V

NO

Microcontrollers

FLASH

1 mm

S-PBGA-B324

Not Qualified

80 rpm

MPC5533MZQ40R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

0

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA324,22X22,40

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

NO

2.55 mm

196608

23 mm

0

40 MHz

23 mm

49152

CMOS

250 mA

1.5 V

NO

Microcontrollers

FLASH

1 mm

S-PBGA-B324

Not Qualified

40 rpm

LH7A400N0G000B5-S

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

BALL

256

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

28

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.71 V

85 Cel

-40 Cel

NO

BOTTOM

YES

1.95 mm

17 mm

IT ALSO OPERATES AT 200MHZ SPEED WITH 0 TO 70DEGCEN TEMPERATURE RANGE

32

20 MHz

17 mm

CMOS

1.8 V

YES

FLASH

1 mm

S-PBGA-B256

195 rpm

60

MPC5566MZP112R

NXP Semiconductors

MICROCONTROLLER

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

24

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA416,26X26,40

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.55 mm

3145728

27 mm

0

ADC 40-CH IS AVAILABLE

DMA, POR, PWM(24), TIMER, TPU(2)

32

20 MHz

27 mm

131072

CMOS

820 mA

1.5 V

YES

Microcontrollers

CAN, ETHERNET, SCI, SPI

FLASH

1 mm

S-PBGA-B416

Not Qualified

112 rpm

8

256

MPC5533MZQ80R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

0

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA324,22X22,40

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

NO

2.55 mm

196608

23 mm

0

80 MHz

23 mm

49152

CMOS

250 mA

1.5 V

NO

Microcontrollers

FLASH

1 mm

S-PBGA-B324

Not Qualified

80 rpm

MPC5566MVR144R

NXP Semiconductors

MICROCONTROLLER

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

24

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA416,26X26,40

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.55 mm

3145728

27 mm

0

ADC 40-CH IS AVAILABLE

DMA, POR, PWM(24), TIMER, TPU(2)

32

20 MHz

27 mm

131072

CMOS

820 mA

1.5 V

YES

Microcontrollers

CAN, ETHERNET, SCI, SPI

FLASH

1 mm

S-PBGA-B416

Not Qualified

144 rpm

8

256

MPC5554AVR132R2

NXP Semiconductors

MICROCONTROLLER

MILITARY

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

24

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA416,26X26,40

1.35 V

125 Cel

-55 Cel

YES

BOTTOM

NO

2.55 mm

2097152

27 mm

IT ALSO REQUIRES 3.3V SUPPLY

32

20 MHz

27 mm

65536

CMOS

1.5 V

YES

Microcontrollers

FLASH

1 mm

S-PBGA-B416

Not Qualified

132 rpm

MPC5674F3MVY3R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

516

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.55 mm

27 mm

0

40 MHz

27 mm

CMOS

1.2 V

YES

FLASH

1 mm

S-PBGA-B516

270 rpm

MPC5566MVR80R

NXP Semiconductors

MICROCONTROLLER

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

24

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA416,26X26,40

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.55 mm

3145728

27 mm

0

ADC 40-CH IS AVAILABLE

DMA, POR, PWM(24), TIMER, TPU(2)

32

20 MHz

27 mm

131072

CMOS

820 mA

1.5 V

YES

Microcontrollers

CAN, ETHERNET, SCI, SPI

FLASH

1 mm

S-PBGA-B416

Not Qualified

80 rpm

8

256

MPC5554MZP112R2

NXP Semiconductors

MICROCONTROLLER

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

24

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA416,26X26,40

1.35 V

125 Cel

-40 Cel

TIN LEAD

YES

BOTTOM

NO

2.55 mm

2097152

27 mm

IT ALSO REQUIRES 3.3V SUPPLY

32

20 MHz

30

245

27 mm

65536

CMOS

600 mA

1.5 V

YES

Microcontrollers

FLASH

1 mm

S-PBGA-B416

3

Not Qualified

112 rpm

e0

MPC5554MZP112

NXP Semiconductors

MICROCONTROLLER

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

24

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA416,26X26,40

1.35 V

125 Cel

-40 Cel

TIN LEAD

YES

BOTTOM

NO

2.55 mm

2097152

27 mm

IT ALSO REQUIRES 3.3V SUPPLY

32

20 MHz

30

245

27 mm

65536

CMOS

600 mA

1.5 V

YES

Microcontrollers

FLASH

1 mm

S-PBGA-B416

3

Not Qualified

112 rpm

e0

220

MPC5533MVZ40R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

0

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA324,22X22,40

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

NO

2.55 mm

196608

23 mm

0

40 MHz

23 mm

49152

CMOS

250 mA

1.5 V

NO

Microcontrollers

FLASH

1 mm

S-PBGA-B324

Not Qualified

40 rpm

MPC5533MVZ66R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

0

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA324,22X22,40

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

NO

2.55 mm

196608

23 mm

0

66 MHz

23 mm

49152

CMOS

250 mA

1.5 V

NO

Microcontrollers

FLASH

1 mm

S-PBGA-B324

Not Qualified

66 rpm

MPC5674F3MVZ2R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.55 mm

23 mm

0

40 MHz

23 mm

CMOS

1.2 V

YES

FLASH

1 mm

S-PBGA-B324

200 rpm

MPC5674F3MVR3R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.55 mm

27 mm

0

40 MHz

27 mm

CMOS

1.2 V

YES

FLASH

1 mm

S-PBGA-B416

270 rpm

MPC5674F3MVV3R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

516

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.55 mm

27 mm

0

40 MHz

27 mm

CMOS

1.2 V

YES

FLASH

1 mm

S-PBGA-B516

270 rpm

MPC5674F3MVY2R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

516

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.55 mm

27 mm

0

40 MHz

27 mm

CMOS

1.2 V

YES

FLASH

1 mm

S-PBGA-B516

200 rpm

MPC5533MZQ66R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

0

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA324,22X22,40

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

NO

2.55 mm

196608

23 mm

0

66 MHz

23 mm

49152

CMOS

250 mA

1.5 V

NO

Microcontrollers

FLASH

1 mm

S-PBGA-B324

Not Qualified

66 rpm

MPC5533MVZ40

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

0

NO

32

1.5,3.3,5

GRID ARRAY

BGA324,22X22,40

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

NO

2.55 mm

196608

23 mm

0

40 MHz

23 mm

49152

CMOS

250 mA

1.5 V

NO

Microcontrollers

FLASH

1 mm

S-PBGA-B324

Not Qualified

40 rpm

MPC5674F3MVR2R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.55 mm

27 mm

0

40 MHz

27 mm

CMOS

1.2 V

YES

FLASH

1 mm

S-PBGA-B416

200 rpm

MPC5533MVZ80R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

0

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA324,22X22,40

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

NO

2.55 mm

196608

23 mm

0

80 MHz

23 mm

49152

CMOS

250 mA

1.5 V

NO

Microcontrollers

FLASH

1 mm

S-PBGA-B324

Not Qualified

80 rpm

MPC5554AZP132R2

NXP Semiconductors

MICROCONTROLLER

MILITARY

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

24

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA416,26X26,40

1.35 V

125 Cel

-55 Cel

TIN LEAD SILVER

YES

BOTTOM

NO

2.55 mm

2097152

27 mm

IT ALSO REQUIRES 3.3V SUPPLY

32

20 MHz

27 mm

65536

CMOS

1.5 V

YES

Microcontrollers

FLASH

1 mm

S-PBGA-B416

3

Not Qualified

132 rpm

e0

MPC5566MZP80R

NXP Semiconductors

MICROCONTROLLER

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

24

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA416,26X26,40

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.55 mm

3145728

27 mm

0

ADC 40-CH IS AVAILABLE

DMA, POR, PWM(24), TIMER, TPU(2)

32

20 MHz

27 mm

131072

CMOS

820 mA

1.5 V

YES

Microcontrollers

CAN, ETHERNET, SCI, SPI

FLASH

1 mm

S-PBGA-B416

Not Qualified

80 rpm

8

256

MPC5554AVR132

NXP Semiconductors

MICROCONTROLLER

MILITARY

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

24

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA416,26X26,40

1.35 V

125 Cel

-55 Cel

YES

BOTTOM

NO

2.55 mm

2097152

27 mm

IT ALSO REQUIRES 3.3V SUPPLY

32

20 MHz

27 mm

65536

CMOS

1.5 V

YES

Microcontrollers

FLASH

1 mm

S-PBGA-B416

Not Qualified

132 rpm

220

MPC5566MVR144

NXP Semiconductors

MICROCONTROLLER

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

24

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.55 mm

3145728

27 mm

0

ADC 40-CH IS AVAILABLE

DMA, POR, PWM(24), TIMER, TPU(2)

32

20 MHz

27 mm

131072

CMOS

1.5 V

YES

CAN, ETHERNET, SCI, SPI

FLASH

1 mm

S-PBGA-B416

144 rpm

8

256

MPC5554MVR112R2

NXP Semiconductors

MICROCONTROLLER

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

24

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA416,26X26,40

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

NO

2.55 mm

2097152

27 mm

IT ALSO REQUIRES 3.3V SUPPLY

32

20 MHz

27 mm

65536

CMOS

1.5 V

YES

Microcontrollers

FLASH

1 mm

S-PBGA-B416

Not Qualified

112 rpm

MPC5566MVR132R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

24

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA416,26X26,40

1.35 V

125 Cel

-40 Cel

MATTE TIN

YES

BOTTOM

YES

2.55 mm

3145728

27 mm

ALSO REQUIRES 3.3V SUPPLY

32

20 MHz

27 mm

131072

CMOS

820 mA

1.5 V

YES

Microcontrollers

FLASH

1 mm

S-PBGA-B416

1

Not Qualified

132 rpm

e3

256

MPC5674F3MVZ3R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.55 mm

23 mm

0

40 MHz

23 mm

CMOS

1.2 V

YES

FLASH

1 mm

S-PBGA-B324

270 rpm

MPC5674F3MVV2R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

516

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.55 mm

27 mm

0

40 MHz

27 mm

CMOS

1.2 V

YES

FLASH

1 mm

S-PBGA-B516

200 rpm

MPC5533MVZ66

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

324

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

0

NO

32

1.5,3.3,5

GRID ARRAY

BGA324,22X22,40

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

NO

2.55 mm

196608

23 mm

0

66 MHz

23 mm

49152

CMOS

250 mA

1.5 V

NO

Microcontrollers

FLASH

1 mm

S-PBGA-B324

Not Qualified

66 rpm

MPC5554MVR112

NXP Semiconductors

MICROCONTROLLER

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

24

NO

32

1.5,3.3,5

GRID ARRAY, HEAT SINK/SLUG

BGA416,26X26,40

1.35 V

125 Cel

-40 Cel

YES

BOTTOM

NO

2.55 mm

2097152

27 mm

IT ALSO REQUIRES 3.3V SUPPLY

32

20 MHz

27 mm

65536

CMOS

1.5 V

YES

Microcontrollers

FLASH

1 mm

S-PBGA-B416

Not Qualified

112 rpm

220

MB91F469GAPB-GS

Infineon Technologies

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

320

HBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

28

NO

32

3.3/5

GRID ARRAY, HEAT SINK/SLUG

BGA320,20X20,50

3 V

125 Cel

FR60

-40 Cel

YES

BOTTOM

YES

2.46 mm

2162688

27 mm

0

IT ALSO NEED 1.8V NOMINAL SUPPLY VOLTAGE

ALARM COMPARATOR(2), DMA(5), RTC, TIMER(33), WDT(2)

32

16 MHz

27 mm

98304

CMOS

32-Ch 10-Bit

170 mA

5 V

NO

Microcontrollers

CAN(6), I2C(4), USART(8)

FLASH

1.27 mm

S-PBGA-B320

Not Qualified

100 rpm

8

205

MB91F469GBPB-GSE1

Infineon Technologies

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

320

HBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

28

NO

32

3.3/5

GRID ARRAY, HEAT SINK/SLUG

BGA320,20X20,50

3 V

125 Cel

FR60

-40 Cel

YES

BOTTOM

YES

2.46 mm

2162688

27 mm

0

IT ALSO NEED 1.8V NOMINAL SUPPLY VOLTAGE

ALARM COMPARATOR(2), DMA(5), RTC, TIMER(33), WDT(2)

32

16 MHz

27 mm

98304

CMOS

32-Ch 10-Bit

170 mA

5 V

NO

Microcontrollers

CAN(6), I2C(4), USART(8)

FLASH

1.27 mm

S-PBGA-B320

Not Qualified

100 rpm

8

205

TC1796256F150EBDKXUMA1

Infineon Technologies

MICROCONTROLLER

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.58 V

24

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.42 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.5 mm

27 mm

32

25 MHz

27 mm

CMOS

1.5 V

NO

FLASH

1 mm

S-PBGA-B416

150 rpm

127

Microcontrollers

A microcontroller is a type of integrated circuit (IC) that is designed to control a specific task or set of tasks within a larger system. Unlike a microprocessor, which is designed to be a general-purpose computing device, a microcontroller is optimized for embedded applications that require real-time control and processing.

Microcontrollers typically contain a processor core, memory, input/output (I/O) ports, and various peripheral devices, all on a single chip. The processor core is usually a low-power, low-speed version of a microprocessor, such as an 8-bit or 16-bit processor. The memory on a microcontroller includes both volatile and non-volatile memory, such as random-access memory (RAM) and flash memory, respectively. The I/O ports are used to interface with external devices such as sensors, switches, and displays.

Microcontrollers are used in a wide range of applications, including automotive systems, medical devices, consumer electronics, and industrial automation. They are particularly well-suited for applications that require real-time control and processing, such as motor control, temperature sensing, and data acquisition.

One of the key advantages of microcontrollers is their low cost and small size. Because all of the necessary components are integrated onto a single chip, microcontrollers are much smaller and less expensive than other types of computing devices. This makes them ideal for use in small, battery-powered devices such as handheld calculators and remote controls.