225 Microprocessors 13

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MCF5251VM140	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.08 V	70 Cel		0 Cel		BOTTOM	1.6 mm		13 mm		YES	32	140 MHz	40	260	13 mm	CMOS		1.2 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	140 rpm	NO
MCF5251CVM140R2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		24	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.08 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	140 MHz	40	260	13 mm	CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B225	3		140 rpm	NO	e1
MCF5251CVM140	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		24	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.08 V	85 Cel		-40 Cel		BOTTOM	1.6 mm		13 mm		YES	32	140 MHz	40	260	13 mm	CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B225	3		140 rpm	NO
MC9328MXSVP10	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V		25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
MC9328MXSVP10R2	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V		25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
MCF5253CVM140	NXP Semiconductors		OTHER	BALL	225	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.32 V		16			GRID ARRAY, FINE PITCH		1.08 V	70 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	2.85 mm		13 mm		YES	16	35 MHz	40	260	13 mm	CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B225	3		140 rpm	NO	e1
MCF5253VM140	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.32 V		16			GRID ARRAY, FINE PITCH		1.08 V	70 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	2.85 mm		13 mm		YES	16	35 MHz	40	260	13 mm	CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	140 rpm	NO	e1
MC9328MXSCVP10	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V		25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
MC9328MXLVP20	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2 V		25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	16 MHz	40	260	13 mm	CMOS		1.9 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	200 rpm	YES	e1
MC9328MXLVP15	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	150 rpm	YES	e1
MC9328MXSCVP10R2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V		25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
R9A07G084M08GBG	Renesas Electronics	MICROPROCESSOR, RISC		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.05 V	125 Cel	16	-40 Cel		BOTTOM	1.4 mm	1572864	13 mm		YES	16	25 MHz			13 mm	CMOS	310 mA	1.1 V	16	11		.8 mm	FLOATING POINT	S-PBGA-B225			400 rpm	YES
R9A07G084M04GBG	Renesas Electronics	MICROPROCESSOR, RISC		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.05 V	125 Cel	16	-40 Cel		BOTTOM	1.4 mm	1572864	13 mm		YES	16	25 MHz			13 mm	CMOS	310 mA	1.1 V	16	11		.8 mm	FLOATING POINT	S-PBGA-B225			400 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.