NXP Semiconductors - MCF5253CVM140

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MCF5253CVM140 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCF5253CVM140
Description Microprocessors; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE;
Datasheet MCF5253CVM140 Datasheet
In Stock2,513
NAME DESCRIPTION
Minimum Supply Voltage: 1.08 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.2 V
Integrated Cache: NO
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 2.85 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 225
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, FINE PITCH
Address Bus Width: 16
Technology: CMOS
JESD-30 Code: S-PBGA-B225
Maximum Clock Frequency: 35 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: FBGA
Width: 13 mm
Moisture Sensitivity Level (MSL): 3
Speed: 140 rpm
Maximum Supply Voltage: 1.32 V
Low Power Mode: NO
Boundary Scan: YES
External Data Bus Width: 16
JESD-609 Code: e1
Minimum Operating Temperature: -20 Cel
Length: 13 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: OTHER
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Pricing (USD)

Qty. Unit Price Ext. Price
2,513 $22.920 $57,597.960

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