360 Microprocessors 320

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Package Style (Meter)	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8541PXAJFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32	GRID ARRAY	1.25 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.3 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
MPC8541CVTAJEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32	GRID ARRAY	1.1 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
MPC8541VTAQDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32	GRID ARRAY	1.15 V	70 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V	1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1420 rpm	YES
MPC8541VTALDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32	GRID ARRAY	1.15 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1420 rpm	YES
MPC8541PXAKFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32	GRID ARRAY	1.2 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8541CVTALFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32	GRID ARRAY	1.1 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
MC7447AVU1167NB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32	GRID ARRAY	1.25 V				BOTTOM	2.8 mm	25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz	40	260	25 mm	CMOS	1.3 V	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1167 rpm	YES
MPC8541CVTAJFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32	GRID ARRAY	1.2 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8541PXAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32	GRID ARRAY	1.1 V	70 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V	1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1000 rpm	YES
MPC8541ECPXAKEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32	GRID ARRAY	1.1 V	70 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V	1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1000 rpm	YES
MPC8541CVTAQFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32	GRID ARRAY	1.1 V	70 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V	1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1000 rpm	YES
MPC8541PXAPDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32	GRID ARRAY	1.2 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MC7447AHX1420LB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32	GRID ARRAY	1.25 V			TIN LEAD	BOTTOM	3.24 mm	25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz	40	260	25 mm	CMOS	1.3 V	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1420 rpm	YES	e0
MPC8541ECVTALEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32	GRID ARRAY	1.25 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.3 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
MPC8541CVTALEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32	GRID ARRAY	1.1 V	70 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V	1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1000 rpm	YES
MPC8541CPXAKFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32	GRID ARRAY	1.25 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.3 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
MC7447AVU1000NB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32	GRID ARRAY	1.25 V				BOTTOM	2.8 mm	25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz	40	260	25 mm	CMOS	1.3 V	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES
MPC8541ECPXAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32	GRID ARRAY	1.15 V	70 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V	1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1420 rpm	YES
MPC8541ECPXALEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32	GRID ARRAY	1.25 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.3 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
MPC8541ECPXAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32	GRID ARRAY	1.15 V	70 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V	1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1420 rpm	YES
MC7447AVS733NB	NXP Semiconductors	MICROPROCESSOR, RISC		UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32	GRID ARRAY	1.25 V				BOTTOM	2.2 mm	25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz			25 mm	CMOS	1.3 V	1.27 mm	FLOATING POINT	S-CBGA-X360	1	Not Qualified	733 rpm	YES
MPC8541VTAPDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32	GRID ARRAY	1.1 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
MC7447RX867NB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.15 V	36	32	GRID ARRAY	1.05 V				BOTTOM	3.2 mm	25 mm		YES	64	167 MHz			25 mm	CMOS	1.1 V	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	867 rpm	YES
MC7447AVU1420LB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32	GRID ARRAY	1.25 V				BOTTOM	2.8 mm	25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz	40	260	25 mm	CMOS	1.3 V	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1420 rpm	YES
MPC8541VTAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32	GRID ARRAY	1.1 V	70 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V	1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1000 rpm	YES
MPC8541EVTAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32	GRID ARRAY	1.2 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8541ECVTAPDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32	GRID ARRAY	1.25 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.3 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
MPC8541CPXAPDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32	GRID ARRAY	1.25 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.3 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
MPC8541CPXAQFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32	GRID ARRAY	1.1 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
MPC8541ECVTAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32	GRID ARRAY	1.15 V	70 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V	1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1420 rpm	YES
MPC8541CVTAQEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32	GRID ARRAY	1.2 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8541CVTAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32	GRID ARRAY	1.15 V	70 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V	1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1420 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.