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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MC7448THX1267ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1 V	105 Cel	-40 Cel	TIN LEAD	BOTTOM	2.8 mm	25 mm		YES	64	200 MHz	40	260	25 mm	CMOS	1.05 V	Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1267 rpm	YES	e0
MC7448TVU1267ND	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	0			GRID ARRAY		1 V				BOTTOM	2.4 mm	25 mm		YES	0	200 MHz	40	260	25 mm	CMOS	1.05 V		1.27 mm	FLOATING POINT	S-CBGA-B360	1		1267 rpm	YES
MC7448HX1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.2 V	0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel	0 Cel	TIN LEAD	BOTTOM	2.8 mm	25 mm		NO	0	1400 MHz	40	260	25 mm	CMOS	1.15 V	Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1400 rpm	YES	e0
MC7448VU800ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	800 MHz	40	260	25 mm	CMOS	1 V	Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	800 rpm	YES
MCF54452CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel	-40 Cel	TIN SILVER	BOTTOM	2.48 mm	23 mm		YES	32	66 MHz	40	260	23 mm	CMOS	1.5 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MCF54455CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel	-40 Cel	TIN SILVER	BOTTOM	2.48 mm	23 mm		YES	32	66 MHz	40	260	23 mm	CMOS	1.5 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MC7448HX1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel	0 Cel	TIN LEAD	BOTTOM	2.8 mm	25 mm		NO	0	1000 MHz	40	260	25 mm	CMOS	1 V	Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES	e0
MC7448HX1250ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V	0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.05 V	105 Cel	0 Cel	TIN LEAD	BOTTOM	2.8 mm	25 mm		NO	0	1250 MHz	40	260	25 mm	CMOS	1.1 V	Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1250 rpm	YES	e0
MC7448HX1700LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.25 V	105 Cel	0 Cel	TIN LEAD	BOTTOM	2.8 mm	25 mm		YES	64	200 MHz	40	260	25 mm	CMOS	1.3 V	Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1700 rpm	YES	e0
MC7448HX600ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel	0 Cel	TIN LEAD	BOTTOM	2.8 mm	25 mm		NO	0	600 MHz	40	260	25 mm	CMOS	1 V	Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	600 rpm	YES	e0
MC7448THX1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel	-40 Cel	TIN LEAD	BOTTOM	2.8 mm	25 mm		YES	64	200 MHz	40	260	25 mm	CMOS	1.15 V	Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES	e0
MC7448TVU1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1000 MHz	40	260	25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-B360	1		1000 rpm	YES
MC7448VS1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.2 V	0	32	1.3,1.8/2.5	GRID ARRAY	LGA360,19X19,50	1.1 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1400 MHz	30	245	25 mm	CMOS	1.15 V	Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	1400 rpm	YES
MC7448VU1000LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel	0 Cel		BOTTOM	2.4 mm	25 mm		YES	64	200 MHz	40	260	25 mm	CMOS	1.15 V	Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES
MC7448VU1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1000 MHz	40	260	25 mm	CMOS	1 V	Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	1000 rpm	YES
MC7448VU1250ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V	0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.05 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1250 MHz	40	260	25 mm	CMOS	1.1 V	Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	1250 rpm	YES
MC7448VU1267ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.1 V	0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1267 MHz	40	260	25 mm	CMOS	1.05 V	Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	1267 rpm	YES
MC7448VU1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.2 V	0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1400 MHz	40	260	25 mm	CMOS	1.15 V	Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	1400 rpm	YES
MC7448VU1600LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.2 V	105 Cel	0 Cel		BOTTOM	2.4 mm	25 mm		YES	64	200 MHz	40	260	25 mm	CMOS	1.25 V	Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1600 rpm	YES
KMC7448VU1267ND	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.15 V	36	32		GRID ARRAY		1.05 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz	40	260	25 mm	CMOS	1.1 V		1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1267 rpm	YES
NHPXA270C5C312	Intel	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.375 V	26	32		GRID ARRAY		1.1875 V			TIN SILVER COPPER	BOTTOM				YES	32	3.6864 MHz				CMOS	1.25 V			FIXED POINT	S-PBGA-B360		Not Qualified	312 rpm	YES	e1
MC7448THX1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel	-40 Cel	TIN LEAD	BOTTOM	2.8 mm	25 mm		YES	64	200 MHz	40	260	25 mm	CMOS	1.15 V	Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1400 rpm	YES	e0
MPC7410HX500LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.9 V	32	32		GRID ARRAY, HEAT SINK/SLUG		1.7 V			TIN LEAD	BOTTOM	3.2 mm	25 mm		YES	64	133 MHz	40	260	25 mm	CMOS	1.8 V		1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	500 rpm	YES	e0
MCF54453CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel	-40 Cel	TIN SILVER	BOTTOM	2.48 mm	23 mm		YES	32	66 MHz	40	260	23 mm	CMOS	1.5 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MCF54454CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel	-40 Cel	TIN SILVER	BOTTOM	2.48 mm	23 mm		YES	32	66 MHz	40	260	23 mm	CMOS	1.5 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MCF54452VR266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	70 Cel	0 Cel	TIN SILVER	BOTTOM	2.48 mm	23 mm		YES	32	66 MHz	40	260	23 mm	CMOS	1.5 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	266 rpm	YES	e2
NHPXA270C5C520	Intel	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.595 V	26	32		GRID ARRAY		1.3775 V			TIN SILVER COPPER	BOTTOM				YES	32	3.6864 MHz				CMOS	1.45 V			FIXED POINT	S-PBGA-B360		Not Qualified	520 rpm	YES	e1
FWPXA270C5C416	Intel	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.485 V	26	32		GRID ARRAY		1.2825 V				BOTTOM				YES	32	3.6864 MHz				CMOS	1.35 V			FIXED POINT	S-PBGA-B360	1	Not Qualified	416 rpm	YES
FWPXA270C5E416	Intel	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.485 V	26	32		GRID ARRAY		1.2825 V	85 Cel	-40 Cel		BOTTOM				YES	32	3.6864 MHz				CMOS	1.35 V			FIXED POINT	S-PBGA-B360	1	Not Qualified	416 rpm	YES
XPC755BRX300LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	YES	2.1 V				GRID ARRAY		1.9 V				BOTTOM				YES						CMOS	2 V			FIXED POINT	R-CBGA-B360			300 rpm	NO
MC7447AHX1167NB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32		GRID ARRAY		1.25 V			TIN LEAD	BOTTOM	3.24 mm	25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz	40	260	25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1167 rpm	YES	e0
MC7447ATHX1167NB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32		GRID ARRAY		1.25 V			TIN LEAD	BOTTOM	3.24 mm	25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz	40	260	25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1167 rpm	YES	e0
MC7447AVU1267LB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32		GRID ARRAY		1.25 V				BOTTOM	2.8 mm	25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz			25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1267 rpm	YES	e2
MC7448VU1700LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.25 V	105 Cel	0 Cel		BOTTOM	2.4 mm	25 mm		YES	64	200 MHz	40	260	25 mm	CMOS	1.3 V	Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1700 rpm	YES
NHPXA270C5C416	Intel	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.485 V	26	32		GRID ARRAY		1.2825 V			TIN SILVER COPPER	BOTTOM				YES	32	3.6864 MHz				CMOS	1.35 V			FIXED POINT	S-PBGA-B360		Not Qualified	416 rpm	YES	e1
PC7448FGH1267ND	Teledyne E2v (Uk)	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	36	32	1.05,1.5/2.5	GRID ARRAY	BGA360,19X19,50	1 V	125 Cel	-40 Cel		BOTTOM	2.8 mm	25 mm		YES	64	200 MHz			25 mm	CMOS	1.05 V	Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1267 rpm	NO
PCX755BVZFU350LE	Atmel	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V				BOTTOM	2.77 mm	25 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B360		Not Qualified	350 rpm	YES
PPC7448VU600ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	600 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	600 rpm	YES
PPC7448VU1250NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V	0	32		GRID ARRAY		1.05 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1250 MHz			25 mm	CMOS	1.1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1250 rpm	YES
XPC7445RX800LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.65 V	36	32		GRID ARRAY	BGA360,19X19,50	1.55 V	105 Cel	0 Cel		BOTTOM	3.2 mm	25 mm		YES	64	133 MHz			25 mm	CMOS	1.6 V		1.27 mm	FLOATING POINT	S-CBGA-B360			800 rpm	YES
XPC755BRX400LE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V	32	32		GRID ARRAY	BGA360,19X19,50	1.9 V	105 Cel	0 Cel		BOTTOM	3.2 mm	25 mm		YES	64	100 MHz			25 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-CBGA-B360			400 rpm	YES
XPC7445RX733LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32		GRID ARRAY		1.25 V				BOTTOM	3.2 mm	25 mm		YES	64	133 MHz			25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	733 rpm	YES
XPC755CRX450LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V	32	32		GRID ARRAY		1.9 V				BOTTOM	3.2 mm	25 mm		YES	64	100 MHz			25 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	450 rpm	YES
PPC7448HX867ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	867 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	867 rpm	YES
PPC7448VU867NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	867 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	867 rpm	YES
PPC7447RX1000NB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC		YES			32	1.1,1.8/2.5	GRID ARRAY	BGA360,19X19,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B360		Not Qualified	1000 rpm
PPC7448VU1600LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	105 Cel	0 Cel		BOTTOM	2.4 mm	25 mm		YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
PPC7448HX1250NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V	0	32		GRID ARRAY		1.05 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1250 MHz			25 mm	CMOS	1.1 V		1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	1250 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.