360 Microprocessors 320

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
XPC7445RX600NC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32		GRID ARRAY		1.25 V				BOTTOM	3.2 mm	25 mm		YES	64	133 MHz			25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	600 rpm	YES
XPC750PRX400RE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	2.1 V		32		GRID ARRAY		2 V				BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V SUPPLY	NO		100 MHz			25 mm	CMOS	2.05 V		1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	400 rpm	YES
XPC750PRX400LE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V	32	32		GRID ARRAY		2 V	105 Cel	0 Cel		BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	400 MHz			25 mm	CMOS	2.05 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	400 rpm	YES
PPC7448VS600NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	600 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	600 rpm	YES
PPC7448VS1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1000 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1000 rpm	YES
PPC7448HX600ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	600 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	600 rpm	YES
PPC7448VS1000LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	105 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-N360		Not Qualified	1000 rpm	YES
PPC7448VS1600LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	105 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-N360		Not Qualified	1600 rpm	YES
PPC7448VU1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1000 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1000 rpm	YES
XPC750PRX333LE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2 V	32	32	1.9,3.3	GRID ARRAY	BGA360,19X19,50	1.8 V	105 Cel	0 Cel	TIN LEAD	BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	100 MHz			25 mm	CMOS	1.9 V	Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	333 rpm	YES	e0
PPC7448VU1267NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V	0	32		GRID ARRAY		1.05 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1267 MHz			25 mm	CMOS	1.1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1267 rpm	YES
PPC7448HX1600LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
PPC7448VU800ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	800 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	800 rpm	YES
PPC7448HX1600LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
PPC7448HX1000LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
XPC7445RX933LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32		GRID ARRAY		1.25 V				BOTTOM	3.2 mm	25 mm		YES	64	133 MHz			25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	933 rpm	YES
PPC7448VU1000LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	105 Cel	0 Cel		BOTTOM	2.4 mm	25 mm		YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
PPC7447RX1200LB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32		GRID ARRAY		1.25 V				BOTTOM	3.2 mm	29 mm		YES	64	167 MHz			29 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1200 rpm	YES
PPC7448VU600NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	600 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	600 rpm	YES
XC7445ARX733LG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32		GRID ARRAY		1.25 V				BOTTOM	3.2 mm	25 mm		YES	64	133 MHz			25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	733 rpm	YES
PPC7448VU667NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	667 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	667 rpm	YES
XPC7445RX600LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32		GRID ARRAY		1.25 V				BOTTOM	3.2 mm	25 mm		YES	64	133 MHz			25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	600 rpm	YES
PPC7448VU800NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	800 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	800 rpm	YES
PPC7448VS1600LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	105 Cel	0 Cel		BOTTOM	1.8 mm	25 mm		YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-N360		Not Qualified	1600 rpm	YES
PPC7448HX667NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	667 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	667 rpm	YES
PPC7448VU1000LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	105 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
PPC7448VS1267NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V	0	32		GRID ARRAY		1.05 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1267 MHz			25 mm	CMOS	1.1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1267 rpm	YES
PPC7448VS800ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	800 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	800 rpm	YES
PPC7448VS1000NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1000 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1000 rpm	YES
PPC7448VU1420LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	105 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1420 rpm	YES
KXPC755CRX400LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC		YES			64	2,2.5/3.3	GRID ARRAY	BGA360,19X19,50				Tin/Lead (Sn/Pb)	BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B360		Not Qualified	400 rpm		e0
PPC7448VS667ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	667 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	667 rpm	YES
PPC7448HX1000NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1000 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
XPC755BRX400LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V	32	32		GRID ARRAY	BGA360,19X19,50	1.9 V	105 Cel	0 Cel		BOTTOM	3.2 mm	25 mm		YES	64				25 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-CBGA-B360			400 rpm	YES
PPC7448VU1250ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V	0	32		GRID ARRAY		1.05 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1250 MHz			25 mm	CMOS	1.1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1250 rpm	YES
XPC750PRX300RE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	2 V		32		GRID ARRAY		1.8 V				BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V SUPPLY	NO		100 MHz			25 mm	CMOS	1.9 V		1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	300 rpm	YES
PPC7448VS867NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	867 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	867 rpm	YES
MPC755BRX300LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V			TIN LEAD	BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	300 rpm	YES	e0
MPC755CPX400LER2	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.9 V			TIN LEAD	BOTTOM	2.77 mm	25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B360	3	Not Qualified	400 rpm	YES	e0
MPC755BRX300	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V				BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	300 rpm	YES
MPC750ARX200TX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.7 V	32	32		GRID ARRAY		2.5 V				BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			25 mm	CMOS	2.6 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	200 rpm	YES
MPC7410VS450LD	NXP Semiconductors	MICROPROCESSOR, RISC		NO LEAD	360	LGA	SQUARE	CERAMIC		YES			32	1.8,1.8/3.3	GRID ARRAY	LGA360,19X19,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-N360		Not Qualified	450 rpm
MPC7410HX450LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC		YES			32	1.8,1.8/3.3	GRID ARRAY	BGA360,19X19,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B360		Not Qualified	450 rpm
MPC755CPX400LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.9 V			TIN LEAD	BOTTOM	2.77 mm	25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B360	3	Not Qualified	400 rpm	YES	e0
MPC755BPX350LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V			TIN LEAD	BOTTOM	2.77 mm	25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B360	3	Not Qualified	350 rpm	YES	e0
MPC755CPX350LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY, HEAT SINK/SLUG		1.8 V			TIN LEAD	BOTTOM	2.77 mm	25 mm		YES	64	100 MHz	30	245	25 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B360	3		350 rpm	YES	e0
MCF54454VR266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	70 Cel	0 Cel	TIN SILVER	BOTTOM	2.48 mm	23 mm		YES	32	66 MHz	40	260	23 mm	CMOS	1.5 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	266 rpm	YES	e2
MPC755CVT400LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.9 V				BOTTOM	2.77 mm	25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B360	3	Not Qualified	400 rpm	YES	e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.