NXP Semiconductors - XPC750PRX333LE

XPC750PRX333LE by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number XPC750PRX333LE
Description MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
Datasheet XPC750PRX333LE Datasheet
In Stock1,093
NAME DESCRIPTION
Minimum Supply Voltage: 1.8 V
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Nominal Supply Voltage: 1.9 V
Integrated Cache: YES
Maximum Seated Height: 3.2 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 360
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-CBGA-B360
Maximum Clock Frequency: 100 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Width: 25 mm
Speed: 333 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 2 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA360,19X19,50
Length: 25 mm
Additional Features: ALSO REQUIRES 3.3V I/O SUPPLY
Terminal Pitch: 1.27 mm
Temperature Grade: OTHER
Power Supplies (V): 1.9,3.3
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Pricing (USD)

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