NXP Semiconductors - MC7447ATHX1167NB

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MC7447ATHX1167NB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC7447ATHX1167NB
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Low Power Mode: YES;
Datasheet MC7447ATHX1167NB Datasheet
In Stock4,121
NAME DESCRIPTION
Minimum Supply Voltage: 1.25 V
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Nominal Supply Voltage: 1.3 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 3.24 mm
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 360
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 36
Technology: CMOS
JESD-30 Code: S-CBGA-B360
Maximum Clock Frequency: 167 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 25 mm
Moisture Sensitivity Level (MSL): 1
Speed: 1167 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.35 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
JESD-609 Code: e0
Qualification: Not Qualified
Length: 25 mm
Additional Features: ALSO REQUIRES 1.8V OR 2.5V SUPPLY
Peak Reflow Temperature (C): 260
Terminal Pitch: 1.27 mm
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Pricing (USD)

Qty. Unit Price Ext. Price
4,121 $2,133.330 $8,791,452.930

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