388 Microprocessors 31

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MCF5485CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32		GRID ARRAY		3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm	YES		66.67 MHz	40	260	27 mm	CMOS	3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
MCF5474VR266	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	8	32	32		GRID ARRAY	BGA388,26X26,40	1.43 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm	32768	27 mm	YES	32	66.67 MHz	40	260	27 mm	CMOS	1.5 V	16	4		1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e1
MCF5485CZP200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32		GRID ARRAY		3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm	YES		66.67 MHz	40	260	27 mm	CMOS	3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e0
MCF5484CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32		GRID ARRAY		3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm	YES		66.67 MHz	40	260	27 mm	CMOS	3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
MCF5475ZP266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32	32		GRID ARRAY		1.43 V	70 Cel	0 Cel	NICKEL GOLD	BOTTOM	2.55 mm		27 mm	YES	32	66.66 MHz	40	260	27 mm	CMOS	1.5 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e4
MCF5484CZP200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32		GRID ARRAY		3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm	YES		66.67 MHz	40	260	27 mm	CMOS	3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e0
MCF5474VR200	NXP Semiconductors	MICROPROCESSOR		BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	8	32	32		GRID ARRAY	BGA388,26X26,40	1.43 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm	32768	27 mm	YES	32	66.67 MHz	40	260	27 mm	CMOS	1.5 V	16	4		1 mm	FLOATING POINT	S-PBGA-B388	3			YES	e1
MCF5474ZP266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32	32		GRID ARRAY		1.43 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm	YES	32	66.66 MHz	40	260	27 mm	CMOS	1.5 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e0
MCF5475VR266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32	32		GRID ARRAY		1.43 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm	YES	32	66.66 MHz	40	260	27 mm	CMOS	1.5 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e1
STPCC0110BTC3	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		12	64	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	NO	64	14.3 MHz			35 mm	CMOS	3.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B388		Not Qualified	100 rpm	YES	e0
STPCI0175BTC3	STMicroelectronics	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES				32	3.3	GRID ARRAY	BGA388,26X26,50		70 Cel	0 Cel	TIN LEAD	BOTTOM										CMOS	3.3 V			Microprocessors	1.27 mm		S-PBGA-B388		Not Qualified	75 rpm		e0
STPCI0112BTC3	STMicroelectronics	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES				32	3.3	GRID ARRAY	BGA388,26X26,50		70 Cel	0 Cel	TIN LEAD	BOTTOM										CMOS	3.3 V			Microprocessors	1.27 mm		S-PBGA-B388		Not Qualified	120 rpm		e0
STPCD0113BTC3	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	NO	64	133 MHz			35 mm	CMOS	3.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B388		Not Qualified	133 rpm	YES	e0
STPCC0112BTC3	STMicroelectronics	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES				32	3.3	GRID ARRAY	BGA388,26X26,50		70 Cel	0 Cel	TIN LEAD	BOTTOM										CMOS	3.3 V			Microprocessors	1.27 mm		S-PBGA-B388		Not Qualified	120 rpm		e0
STPCC0175BTI3	STMicroelectronics	MICROPROCESSOR		BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32	32		GRID ARRAY		3 V				BOTTOM	2.38 mm		35 mm	NO	32	14.3 MHz			35 mm	CMOS	3.3 V				1.27 mm	FLOATING POINT	S-PBGA-B388		Not Qualified	75 rpm	YES
STPCD0110BTC3	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	NO	64	100 MHz			35 mm	CMOS	3.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B388		Not Qualified	100 rpm	YES	e0
STPCI0110BTC3	STMicroelectronics	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES				32	3.3	GRID ARRAY	BGA388,26X26,50		70 Cel	0 Cel	TIN LEAD	BOTTOM										CMOS	3.3 V			Microprocessors	1.27 mm		S-PBGA-B388		Not Qualified	100 rpm		e0
STPCC0175BTC3	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	NO	32	14.3 MHz			35 mm	CMOS	3.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B388		Not Qualified	75 rpm	YES	e0
STPCD0112BTC3	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	NO	64	120 MHz			35 mm	CMOS	3.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B388		Not Qualified	120 rpm	YES	e0
MCF5480CVR166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32		GRID ARRAY		3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm	YES		66.67 MHz	40	260	27 mm	CMOS	3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	166.66 rpm	YES	e1
MCF5483CVR166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32		GRID ARRAY		3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm	YES		66.67 MHz	40	260	27 mm	CMOS	3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	166.66 rpm	YES	e1
MCF5475VR200	NXP Semiconductors	MICROPROCESSOR		BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	8	32	32		GRID ARRAY	BGA388,26X26,40	1.43 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm	32768	27 mm	YES	32	66.67 MHz	40	260	27 mm	CMOS	1.5 V	16	4		1 mm	FLOATING POINT	S-PBGA-B388	3			YES	e1
MCF5471ZP200	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32	32		GRID ARRAY		1.43 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm	YES	32	66.66 MHz	40	260	27 mm	CMOS	1.5 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e0
MCF5471VR200	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32	32		GRID ARRAY		1.43 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm	YES	32	66.66 MHz	40	260	27 mm	CMOS	1.5 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
MCF5470VR200	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32	32		GRID ARRAY		1.43 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm	YES	32	66.66 MHz	40	260	27 mm	CMOS	1.5 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
MCF5481CVR166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32		GRID ARRAY		3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm	YES		66.67 MHz	40	260	27 mm	CMOS	3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	166.66 rpm	YES	e1
MCF5482CZP166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32		GRID ARRAY		3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm	YES		66.67 MHz	30	220	27 mm	CMOS	3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	166.66 rpm	YES	e0
MCF5482CVR166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32		GRID ARRAY		3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm	YES		66.67 MHz	40	260	27 mm	CMOS	3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	166.66 rpm	YES	e1
MCF5480CZP166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32		GRID ARRAY		3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm	YES		66.67 MHz	30	220	27 mm	CMOS	3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	166.66 rpm	YES	e0
MCF5472VR200	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32	32		GRID ARRAY		1.43 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm	YES	32	66.66 MHz	40	260	27 mm	CMOS	1.5 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
CYNCP80192-BGC	Infineon Technologies		COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES					2.5,3.3	GRID ARRAY	BGA388,26X26,50		70 Cel	0 Cel		BOTTOM														Microprocessors	1.27 mm		S-PBGA-B388		Not Qualified

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.