760 Microprocessors 30

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
AM5728BABCX	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5728BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5728BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH		1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
APQ-8016E-1-760NSP-TR-01-0	Qualcomm	MICROPROCESSOR, RISC	OTHER	BALL	760	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1.12 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.84 V	60 Cel	-30 Cel		BOTTOM	.96 mm		12 mm						255	14 mm	CMOS					R-PBGA-B760	3			e1
AM5748ABZXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5749ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
XAM5718AABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH		1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5726BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
XAM5728BABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH		1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5746ABZXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5726BABCXAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5726BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5729BABCXEAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
XAM5749ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel	-40 Cel		BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz			23 mm	CMOS	1.15 V		.8 mm	FIXED POINT	S-PBGA-B760		1500 rpm	YES
AM5729BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz		250	23 mm	CMOS	1.15 V		.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5729BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
TDA2SXBTQABCQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	760	HBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32	GRID ARRAY, HEAT SINK/SLUG		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1176 rpm	YES	e1
AM5729BABCX	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5748ABZX	Texas Instruments	MICROPROCESSOR, RISC	COMMERCIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5746ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5748ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5746ABZX	Texas Instruments	MICROPROCESSOR, RISC	COMMERCIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
XAM5746ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16		GRID ARRAY		1.11 V	105 Cel	-40 Cel		BOTTOM					YES	32	38.4 MHz				CMOS	1.15 V			FLOATING POINT	S-PBGA-B760		1500 rpm	YES
XAM5748ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16		GRID ARRAY		1.11 V	105 Cel	-40 Cel		BOTTOM					YES	32	38.4 MHz				CMOS	1.15 V			FLOATING POINT	S-PBGA-B760		1500 rpm	YES
XAM5718ABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH		1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5726BABCX	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5718AZBOXEM	Texas Instruments	MICROPROCESSOR, RISC	MILITARY	BALL	760	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V	8	AEC-Q100	16		GRID ARRAY		1.11 V	125 Cel	-55 Cel	TIN LEAD	BOTTOM		524288	23 mm	ALSO OPERATES AT 0.85 V TO 1.15 V AFTER AVS ENABLED	YES	32	32 MHz		250	23 mm	CMOS	1.15 V	1		FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e0
AM5749ABZXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
XAM5728AABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH		1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5749ABZX	Texas Instruments	MICROPROCESSOR, RISC	COMMERCIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.