Texas Instruments - TDA2SXBTQABCQ1

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TDA2SXBTQABCQ1 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TDA2SXBTQABCQ1
Description MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: HBGA; Package Shape: SQUARE;
Datasheet TDA2SXBTQABCQ1 Datasheet
In Stock830
NAME DESCRIPTION
Minimum Supply Voltage: 1.11 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.15 V
Integrated Cache: NO
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.96 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 760
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Address Bus Width: 16
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B760
Maximum Clock Frequency: 38.4 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: HBGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Speed: 1176 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.2 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Length: 23 mm
Peak Reflow Temperature (C): 250
Terminal Pitch: .8 mm
Temperature Grade: AUTOMOTIVE
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