783 Microprocessors 1,353

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8533VJAQF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			1000 rpm	YES
MPC8541PXAJE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8569ECVJAQNLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8569ECVTANLGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MC8610VT1333JZ	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.075 V	16	32		GRID ARRAY		.975 V	105 Cel	0 Cel		BOTTOM	2.7 mm	29 mm	YES	64				29 mm	CMOS	1.025 V		1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1333 rpm	YES
MPC8544EVTALJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES
MPC8569ECVTAQNLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8533ECVTAQFA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel	0 Cel	TIN SILVER	BOTTOM	2.8 mm	29 mm	YES	32	66 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES	e2
MPC8544EBVTAQJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES
MPC8569EVTAQLLB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8535BVJANGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.76 mm	29 mm	YES	64		40	260	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783	3		800 rpm	YES	e2
MPC8545EVJATGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V			TIN SILVER	BOTTOM	3.38 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1200 rpm	YES	e2
MPC8533VTANFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY		.95 V			TIN SILVER	BOTTOM	2.8 mm	29 mm	YES	32	.4 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	800 rpm	YES	e2
MPC8569ECVJANLLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8533CVTALFA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel	0 Cel	TIN SILVER	BOTTOM	2.8 mm	29 mm	YES	32	66 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES	e2
MPC8533EVTANGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY		.95 V			TIN SILVER	BOTTOM	2.8 mm	29 mm	YES	32	.4 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	800 rpm	YES	e2
MPC8544EBVTARFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8555ECPXAQDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY		1.25 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.3 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8544ECVTARJ	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel	-40 Cel		BOTTOM	2.8 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8547EVJAUJC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V			TIN SILVER	BOTTOM	3.38 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e2
MPC8547EHXAVG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40					BOTTOM									CMOS		Microprocessors	1 mm		S-PBGA-B783		Not Qualified	1500 rpm
MPC8555ECVTAKFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8541VTALE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8545VJAQGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V			TIN SILVER	BOTTOM	3.38 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES	e2
MPC8541VTAPE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541PXAKD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8569ECVTAUKGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8547CVJAUJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V			TIN SILVER	BOTTOM	3.38 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e2
MPC8547ECPXATHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40					BOTTOM									CMOS		Microprocessors	1 mm		S-PBGA-B783		Not Qualified	1200 rpm
MPC8535EAVJATH	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				BOTTOM	2.76 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1250 rpm	YES
MPC8544EBVTARG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8560CVT833FB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	883 rpm	YES
MPC8569ECVJAQNG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8544EVJAQGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V			TIN SILVER	BOTTOM	2.8 mm	29 mm	YES	32	133 MHz	40	260	29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783	3		1000 rpm	YES	e2
MPC8533EVJARG	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8555EPXALD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V				BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8547ECVTAQHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40					BOTTOM									CMOS		Microprocessors	1 mm		S-PBGA-B783		Not Qualified	1000 rpm
MPC8547PXAUJC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V			TIN LEAD SILVER	BOTTOM	3.38 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e0
MPC8569EVTAUKLB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8547PXAQGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V			TIN LEAD SILVER	BOTTOM	3.38 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES	e0
MPC8541EVTALEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8569ECVJANKLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8545VJATGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V			TIN SILVER	BOTTOM	3.38 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1200 rpm	YES	e2
MPC8569EVTAQNG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8540CVT833LB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	-40 Cel		BOTTOM	3.85 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8547EVTATGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V				BOTTOM	3.38 mm	29 mm	YES	64	133 MHz	NOT SPECIFIED	NOT SPECIFIED	29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1200 rpm	YES
MPC8555ECPXAJDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8533EVTARF	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.