783 Microprocessors 1,353

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8543ECVJANGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V			TIN SILVER	BOTTOM	3.38 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e2
MPC8569ECVJANNJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8555ECVTAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541ECPXAQD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.3 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8569ECVJANNLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8533VJANG	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			800 rpm	YES
MPC8533VJARJA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			1067 rpm	YES
MPC8545EPXATGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V			TIN LEAD SILVER	BOTTOM	3.38 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1200 rpm	YES	e0
MPC8541ECPXALD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8545ECVJATGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V			TIN SILVER	BOTTOM	3.38 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1200 rpm	YES	e2
MPC8569ECVTAQLLB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8533ECVTARF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel	0 Cel	TIN SILVER	BOTTOM	2.8 mm	29 mm	YES	32	66 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e2
MPC8569ECVTAUNJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8533VTARJA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel	0 Cel	TIN SILVER	BOTTOM	2.8 mm	29 mm	YES	64		40	260	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783	3		1067 rpm	YES	e2
MPC8569EVJAQNJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8555VTAPEX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8545EVJANGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V			TIN SILVER	BOTTOM	3.38 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e2
MPC8544EVTARJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783	3		1067 rpm	YES	e2
MPC8569EVJAUKJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8569EVTANNLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8541EVTAQDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY		1.25 V	70 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.3 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8569ECVJAQLJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8547ECHXAVG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40					BOTTOM									CMOS		Microprocessors	1 mm		S-PBGA-B783		Not Qualified	1500 rpm
MPC8544ECVJARJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8555PXAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8555CPXALDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8544EVJALJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES
MPC8569ECVJAQKJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8544ECVTAQF	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES
MPC8569EVTAUKLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8541EPXAPE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8569ECVJAUNGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8533CVTALF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel	0 Cel	TIN SILVER	BOTTOM	2.8 mm	29 mm	YES	32	66 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES	e2
MPC8543ECVJAQGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V			TIN SILVER	BOTTOM	3.38 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES	e2
MPC8544EVJARGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8569EVJAQNJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8555ECVTAJDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8555PXAJEX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8541EPXAKF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8533ECVTALJA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel	0 Cel	TIN SILVER	BOTTOM	2.8 mm	29 mm	YES	32	66 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES	e2
MPC8544EVTARG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8560CVTAQFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY		1.25 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.3 V		1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8569EVJAUNJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8544EBVJANJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
MPC8544EVJALG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES
MPC8536EAVJAVL	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	1.045 V				BOTTOM	2.76 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1500 rpm	YES
MPC8536EAVJAULA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V			TIN SILVER	BOTTOM	2.76 mm	29 mm	YES	64	133 MHz	40	260	29 mm	CMOS	1 V	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	1333 rpm	YES	e2
MPC8533VJAQJ	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			1000 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.