783 Microprocessors 1,353

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8555ECPXAPF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	15	32		GRID ARRAY		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64				29 mm	CMOS	1.2 V		1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8569EVJANNGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8569ECVTANKL	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8533VTARGA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			1067 rpm	YES
MPC8569EVTANNGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8545VJAQGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V			TIN SILVER	BOTTOM	3.38 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES	e2
MPC8555ECPXAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8569EVTANLLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8555ECVTAJEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8543PXAQGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V			TIN LEAD SILVER	BOTTOM	3.38 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES	e0
MPC8555EPXALDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8533VTANGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY		.95 V			TIN SILVER	BOTTOM	2.8 mm	29 mm	YES	32	.4 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	800 rpm	YES	e2
MPC8533EVJARF	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8533VJARF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			1067 rpm	YES
MPC8536BVJANGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.76 mm	29 mm	YES	64		40	260	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783	3		800 rpm	YES	e2
MPC8541PXAQE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.3 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8569ECVJANKJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8569EVTANNL	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8555EVTALE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	15	32		GRID ARRAY		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64				29 mm	CMOS	1.2 V		1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8540VTAQFC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	3.85 mm	29 mm	YES	64	166 MHz	40	260	29 mm	CMOS	1.2 V		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
MPC8536EAVJATHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V			TIN SILVER	BOTTOM	2.76 mm	29 mm	YES	64	133 MHz	40	260	29 mm	CMOS	1 V	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	1250 rpm	YES	e2
MPC8541EVTAJD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	3.75 mm	29 mm	YES	64	166 MHz	40	260	29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	533 rpm	YES	e2
MPC8555PXAPDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541PXAPF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel	TIN LEAD	BOTTOM	3.75 mm	29 mm	YES	64	166 MHz	30	245	29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	833 rpm	YES	e0
MPC8545EPXANGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V			TIN LEAD SILVER	BOTTOM	3.38 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e0
MC8610VT800GZ	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.7 mm	29 mm	YES	64				29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	800 rpm	YES
MPC8541EPXAJD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel	TIN LEAD	BOTTOM	3.75 mm	29 mm	YES	64	166 MHz	30	245	29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	533 rpm	YES	e0
MPC8533VTALGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY		.95 V			TIN SILVER	BOTTOM	2.8 mm	29 mm	YES	32	.4 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES	e2
MPC8569ECVJAULJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8545ECVTATGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V				BOTTOM	3.38 mm	29 mm	YES	64	133 MHz	NOT SPECIFIED	NOT SPECIFIED	29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1200 rpm	YES
MPC8540CVT667LC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	-40 Cel		BOTTOM	3.85 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8555CPXALEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8560VT667FB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8536ECVJAVLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	1.045 V			TIN SILVER	BOTTOM	2.76 mm	29 mm	YES	64	133 MHz	40	260	29 mm	CMOS	1.1 V	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	1500 rpm	YES	e2
MPC8569ECVTAUNJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8541EPXAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8543VTANGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V				BOTTOM	3.38 mm	29 mm	YES	64	133 MHz	NOT SPECIFIED	NOT SPECIFIED	29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
MPC8536EAVJAQGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V			TIN SILVER	BOTTOM	2.76 mm	29 mm	YES	64	133 MHz	40	260	29 mm	CMOS	1 V	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	1000 rpm	YES	e2
MPC8535CVJAKGA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel	-40 Cel		BOTTOM	2.76 mm	29 mm	YES	64				29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			600 rpm	YES
MPC8569ECVJAULLB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V		1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8555CPXAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8544ECVJALGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES
MPC8533EVJAQFA	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel	0 Cel		BOTTOM	2.8 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES
MPC8560VT833LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	0 Cel		BOTTOM	3.85 mm	29 mm	YES	64	166 MHz	40	260	29 mm	CMOS	1.2 V		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	833 rpm	YES
MPC8555VTAJDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8541EVTAQE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.3 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8555EVTAPD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	15	32		GRID ARRAY		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64				29 mm	CMOS	1.2 V		1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8555EPXAPE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	15	32		GRID ARRAY		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64				29 mm	CMOS	1.2 V		1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	833 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.